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市場調查報告書

全球和中國的IC基板產業分析

Global and China IC Substrate Industry Report, 2015

出版商 ResearchInChina 商品編碼 307705
出版日期 內容資訊 英文 120 Pages
商品交期: 最快1-2個工作天內
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全球和中國的IC基板產業分析 Global and China IC Substrate Industry Report, 2015
出版日期: 2015年03月09日 內容資訊: 英文 120 Pages
簡介

全球IC基板產業,隨著PC需求(及CPU用基板的需求)的低迷,及企業間的價格競爭加劇,2012∼2013年持續嚴峻的形勢。可是,2014年之後預計業績趨向復甦。其理由為,新的IC封裝技術的引進,及LTE 4G網路的擴張伴隨的基地台需求的增加,由於穿戴式、設備的登場使SiP模組需求擴大,超薄型手機需求,PC產業的復活等因素。全球IC基板市場由日本、韓國、台灣企業獨佔,中國企業在技術方面和市場結構方面起步都落後。

本報告提供全球和中國的IC基板產業的現況與未來展望相關分析、全球半導體產業現狀為首、IC基板的技術性特性、產業結構(相關產業的關聯)、市場規模的實際成果值、預測值、全球和中國的主要的IC基板廠商、包裝企業概要的資訊,為您概述為以下內容。

第1章 全球半導體產業

  • 產業概要
  • IC封裝
  • IC封裝、檢驗

第2章 IC基板

  • 簡介
  • 覆晶式IC基板
  • 全球行動電話市場
  • 全球智慧型手機市場
  • 中國的行動電話市場
  • 筆記本型電腦市場
  • CPU 及 GPU 市場
  • 記憶體市場

第3章 IC基板市場、產業

  • IC基板市場
  • 寬IO/HMC 記憶體
  • 零件包藏基礎
  • 線路包藏基礎
  • 行動裝置用IC封裝
  • SIP包裝
  • 2.5D 包裝(矽/玻璃/有機樹脂 插入器)
  • TSV (3D)包裝
  • FC-PoP 包裝
  • IC基板產業

第4章 IC基板供應商

  • Unimicron
  • IBIDEN
  • Daeduck Electronics
  • SIMMTECH
  • LG INNOTEK
  • SEMCO
  • Nan Ya PCB
  • Kinsus
  • 新光電氣工業
  • 京瓷SLC科技
  • AT&S
  • ACCESS
  • EASTERN

第5章 IC基板包裝企業

  • ASE
  • Amkor
  • SPIL
  • STATS ChipPAC
  • 三菱瓦斯化學
  • AJINOMOTO

圖表一覽

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄
Product Code: BXM079

‘Global and China IC Substrate Industry Report, 2015’ highlights the followings:

  • 1. Status quo of semiconductor and IC packaging industry
  • 2. Analysis on downstream market of IC substrate
  • 3. Development trend of IC substrate
  • 4. Analysis on IC substrate industry
  • 5. Research on 12 IC substrate vendors
  • 6. Research on 6 IC substrate peripheral companies

IC substrate industry may be in a predicament in 2015, rooted in two aspects: first, the maturing of FOWLP; second, the tablet sales decline and sluggish smartphone growth. In addition, the prosperity of IC substrate industry in 2013 stimulated large-scale expansion of enterprises in 2014, thus leading to an insufficient rate of capacity utilization.

For FC-CSP substrate with mobile phone and tablet PC as the core market facing strong competition from FOWLP that has overwhelming superiorities including low profile, higher speed, more I/O, higher integration, less processing step, especially needing no substrate which slashes cost as IC substrate accounts for more than half of the total cost of IC.

Although it is in its infancy without obvious cost advantage, FOWLP has been an irresistible trend, the traditional FC-CSP substrate will have to reduce the price to enter a competition, and the demand for the latter will be sharply reduced by more than 60% once FOWLP matures. So in 2015, FC-CSP substrate vendors have to substantially reduce the price to gain market advantage in advance. It is expected that in 2015 the IC substrate market will encounter a 7% scale-down to USD7.12 billion.

In the downstream market, large screen mobile phone squeezed the living space of tablet PC which declined significantly. And the single-functional tablet PC is mostly used as a toy for children with less demand for replacement. In the field of smartphone, China as the world's largest smartphone market declined in 2014.

SiP packaging substrate will be the highlight for IC substrate market in 2015 as core components of high-end smart watches must adopt SiP packaging. Both the two core processors built in Apple Watch use SiP packaging technology. The most important SiP substrate of Apple Watch calls for the most difficult production, priced 4-5 times higher than FCCSP applied to general ARM processor. The orders are shared by Nanya, Kinsus and other Taiwanese vendors. ASE undertakes Apple Watch's SI chip SiP packaging business.

The PC market is also likely to recover in 2015 for tablet PC slump means the recovery of laptop computer market. Laptop computer market saw the first growth in 2014 after three consecutive years of decline and is expected to continue the trend in 2015. And laptop discrete graphics card accounts for a zooming proportion, signifying GPU shipments boost.

Another excellent performer in IC substrate applications is the memory market.

Revenue of Major IC Substrate Vendors, 2012-2014(USD mln)

Table of Contents

1. Global Semiconductor Industry

  • 1.1. Overview
  • 1.2. IC Packaging
  • 1.3. IC Packaging and Testing

2. Downstream Market of IC Substrate

  • 2.1. Introduction to IC Substrate
  • 2.2. Flip Chip IC Substrate
  • 2.3. Global Mobile Phone Market
  • 2.4. Global Smartphone Market
  • 2.5. Chinese Mobile Phone Market
  • 2.6. Laptop Computer Market
  • 2.7. CPU and GPU Market
  • 2.8. Memory Market

3. IC Substrate Market and Industry

  • 3.1. IC Substrate Market
  • 3.2. Wide IO/HMC Memory
  • 3.3. Embedded Component Substrate
  • 3.4. Embedded Trace Substrate
  • 3.5. IC Packaging for Portable Devices
    • 3.5.1. Status Quo
    • 3.5.2. PoP Packaging
    • 3.5.3. FOWLP
  • 3.6. SIP Packaging
  • 3.7. 2.5D Packaging (SI/Glass/Organic Interposer)
    • 3.7.1. Introduction to 2.5D Packaging
    • 3.7.2. Application of 2.5D Packaging
    • 3.7.3. Market Size of 2.5D Interposer
    • 3.7.4. Suppliers of 2.5D Packaging
  • 3.8. TSV (3D) Packaging
    • 3.8.1. TSV Packaging Equipment
  • 3.9. FC-PoP Packaging
  • 3.10. IC Substrate Industry

4. IC Substrate Vendors

  • 4.1. Unimicron
  • 4.2. IBIDEN
  • 4.3. Daeduck Electronics
  • 4.4. SIMMTECH
  • 4.5. LG INNOTEK
  • 4.6. SEMCO
  • 4.7. Nan Ya PCB
  • 4.8. KINSUS
  • 4.9. SHINKO
  • 4.10. KYOCERA SLC
  • 4.11. AT&S
  • 4.12. ACCESS
  • 4.13. EASTERN

5. IC Substrate Packaging Companies

  • 5.1. ASE
  • 5.2. AMKOR
  • 5.3. SPIL
  • 5.4. STATS ChipPAC
  • 5.5. Mitsubishi Gas Chemical Company
  • 5.6. AJINOMOTO

Selected Charts:

  • Global Semiconductor Market Size, 1994-2019E
  • Global Semiconductor Market Growth Rate, 2015
  • Downstream Application of Global Semiconductor Market, 1998-2019E
  • Geographical Distribution of Global Semiconductor Market, 2009-2019E
  • Capital of Global Semiconductor Enterprises, 2000-2019E
  • Geographical Distribution of Global Semiconductor Equipment Market, 2012-2016E
  • Wafer Process Equipment Sales by Product, 2010-2019E
  • Top 30 of Global Semiconductor Industry by Revenue, 2014
  • IC Packaging Types Used by Major Electronic Products
  • Global IC Packaging and Testing Market Size, 2012-2017E
  • Global Outsourcing IC Packaging and Testing Market Size, 2012-2017E
  • Global IC Packaging Market Size, 2012-2017E
  • Global IC Testing Market Size, 2012-2017E
  • Revenue of Taiwan Packaging and Testing Industry, 2009-2013
  • Revenue of Top 10 Global Packaging Enterprises, 2013
  • Global Mobile Phone Shipments, 2007-2015E
  • Geographical Distribution of Global 3G/4G Mobile Phone Shipments, 2011-2014
  • Worldwide Mobile Phone Sales to End Users by Vendor in 2013
  • Shipments of Top 10 Global Mobile Phone Vendors, Q3 2014
  • Worldwide Smartphone Sales to End Users by Vendor in 2013
  • Worldwide Smartphone Sales to End Users by Operating System in 2013
  • Shipments of Top 13 Global Smartphone Vendors, 2013-2015E
  • Shipments of Major Smartphone Vendors, Q3 2014
  • Monthly Shipments of China Mobile Phone Market, 2013-2014
  • Market Share of Major Vendors in China Smartphone Market, 2014
  • Market Share of Major Vendors in China 4G Mobile Phone Market, 2014
  • Global Tablet PC Shipments, 2011-2016E
  • Top Five Tablet Vendors, Shipments Fourth Quarter 2014
  • Top Five Tablet Vendors, Shipments, Market Share, and Growth, Calendar Year 2014
  • CPU and GPU Shipments, 2008-2015E
  • Laptop Computer Shipments, 2008-2015E
  • Shipments of Major Global Laptop ODM Vendors, 2010-2014
  • Memory Market Size, 2012-2016E
  • IC Substrate Market Size, 2009-2016E
  • IC Substrate Market Size by Technology, 2009-2016E
  • Specific Application Products of IC Substrate
  • Mobile DRAM Trend
  • Advantages of WIDE IO
  • SK Hynix WIDE IO2 Roadmap
  • HMC Architecture
  • HMC BENEFITS
  • Advantages of Embedded Passive and Active Component Motherboard
  • Embedded Component Substrate Process
  • Comparison of Embedded Active & Passive Components
  • Roadmap of Embedded Passive Substrate
  • Structure Roadmap of Embedded Active Substrate
  • FOWLP and PLP Process Comparison
  • WHY EMBEDDED TRACE?
  • EMBEDDED TRACE Package Features
  • EMBEDDED TRACE Package Sweet Spot (for Wire Bonding)
  • EMBEDDED TRACE Package Sweet Spot (for FLIP CHIP)
  • Apple iPad 4 LTE A1459 IC Package Type List
  • Development Trend of PoP Packaging
  • 2.5D Interposer Manffacturing Revenue
  • Breakdown by Interposer Bulk Material, 2010-2017
  • Downstream Application of TSV
  • TSV Equipment Suppliers
  • Distribution of TSV Packaging Equipment, 2012-2017E
  • Revenue of Major IC Substrate Vendors, 2010-2014
  • Unimicron's Organizational Structure
  • Unimicron's Revenue and Gross Margin, 2003-2014
  • Unimicron's Revenue and Operating Margin, 2009-2014
  • Unimicron's Revenue and Gross Margin, Q1 2012-Q4 2014
  • Unimicron's Sales Breakdown by Technology, 2010-2014
  • Unimicron's Sales Breakdown by Application, 2010-2014
  • Unimicron's Capacity, 2010-2014
  • Unimicron's CAPEX, 2004-2013
  • Unimicron's M & A
  • IBIDEN's Revenue and Operating Margin, FY2006-FY2015
  • IBIDEN's Revenue Breakdown by Business, FY2006-FY2015
  • IBIDEN's Revenue Breakdown by Business, Q2 2012-Q2 2014
  • IBIDEN's Operating Income by Business, Q2 2012-Q2 2014
  • Ibiden Electronics' Revenue Breakdown by Product, FY2010-FY2015
  • IBIDEN's CAPEX and Depreciation, FY2010-FY2015
  • Daeduck Electronics' Revenue and Operating Margin, 2005-2014
  • Daeduck Electronics' Revenue by Business, 2009-2014
  • Daeduck GDS' Revenue and Operating Margin, 2005-2014
  • Daeduck GDS' Revenue Breakdown by Business, 2010-2014
  • SIMMTECH's Organizational Structure
  • SIMMTECH's Revenue and Operating Margin, 2004-2014
  • SIMMTECH's Revenue, Gross Margin and Net Profit Margin, 2009-2014
  • SIMMTECH's Balance Sheet, 2009-2013
  • SIMMTECH's Revenue Breakdown by Product, 2013-2015
  • SIMMTECH's Gross Margin and Operating Margin, Q1 2013-Q4 2014
  • SIMMTECH's Shipments, Q1 2013-Q4 2014
  • SIMMTECH's Shipments, 2012-2015E
  • SIMMTECH's Capacity Utilization, Q1 2013-Q4 2014
  • SIMMTECH's Capacity Utilization, 2012-2015E
  • SIMMTECH's Revenue by Application, 2008-2014
  • SIMMTECH's Substrate Revenue by Application, 2012-2014
  • SIMMTECH's Plants
  • LG INNOTEK's Revenue and Operating Margin, 2006-2015E
  • LG INNOTEK's Revenue and Operating Margin, Q1 2012-Q4 2014
  • LG INNOTEK's Revenue Breakdown by Business, 2011-2015E
  • LG INNOTEK's Operating Income by Business, 2011-2015E
  • SEMCO's Revenue and Operating Margin, 2009-2014
  • SEMCO's Revenue Breakdown by Department, 2010-2014
  • Revenue and Operating Margin of SEMCO's ACI Segment, Q1 2013-Q4 2014
  • SEMCO's HDI and PKG Revenue, Q1-Q4 2014
  • Nan Ya PCB's Organizational Structure
  • Nan Ya PCB's Revenue and Gross Margin, 2006-2014
  • Nan Ya PCB's Revenue and Operating Margin, 2009-2015E
  • Nan Ya PCB's Revenue and Growth Rate, Jan 2013-Jan 2015
  • Nan Ya PCB's Capacity and Global Distribution
  • KINSUS' Revenue and Gross Margin, 2004-2014
  • KINSUS' Revenue and Operating Margin, 2009-2015E
  • KINSUS' Revenue and Growth Rate, Jan 2013-Jan 2015
  • KINSUS' Revenue Breakdown by Product, 2011-2014
  • KINSUS' Revenue Breakdown by Application, 2011
  • KINSUS' Revenue by Application, Q1 2014
  • KINSUS' Revenue by Application, Q4 2014
  • Customer Distribution of KINSUS, 2013\2014
  • SHINKO's Revenue and Net Income, FY2007-FY2015
  • SHINKO's Revenue Breakdown by Business, FY2010-FY2015
  • AT&S and EBITDA Margin, FY2005-FY2015
  • Chongqing Substrate Plant Ramp of AT&S
  • AT&S' Revenue Breakdown by Business/Region, FY2014
  • AT&S' Revenue Breakdown by Business/Region, FY2015
  • Revenue of AT&S' Mobile Devices & Substrates Business, Q2/13-Q4/14
  • Main Customers of AT&S' Mobile Devices & Substrates Business
  • Revenue of AT&S' Industrial & Automotive Business, Q2/13-Q4/14
  • Main Customers of AT&S' Industrial & Automotive Business
  • AT&S' Employees, 2010-2015
  • AT&S' CAPEX, 2010-2015E
  • Financial Data of ACCESS, 2012-2013
  • Major Clients of ACCESS, 2011-2013
  • Revenue of Packaging Substrate of ACCESS, 2011-2013
  • Major Equipment of ACCESS
  • ASE's Organizational Structure
  • ASE's Revenue and Gross Margin, 2005-2015E
  • ASE's Revenue and Operating Margin, 2009-2015E
  • ASE's Revenue, Jan 2013-Jan 2015
  • ASE's Revenue Breakdown by Business, 2010-2014
  • Revenue and Gross Margin of ASE's Packaging Division, Q1 2013-Q4 2014
  • Revenue Breakdown of ASE's Packaging Division by Type, Q1 2013-Q4 2014
  • Revenue and Gross Margin of ASE's Materials Division, Q1 2013-Q4 2014
  • Revenue Breakdown of ASE's IC Business by Application, Q1 2013-Q4 2014
  • ASE's EMS Revenue and Gross Margin, Q1 2013-Q4 2014
  • ASE's EMS Revenue Breakdown, Q1 2013-Q4 2014
  • Amkor's Revenue, Gross Margin and Operating Margin, 2005-2014
  • Amkor's Revenue Breakdown by Packaging Type, 2007-2014
  • Amkor's Packaged Units, 2012-2014
  • Amkor's Revenue Breakdown by Application, 2012-2014
  • SPIL's Organizational Structure
  • SPIL's Revenue, Gross Margin and Operating Margin, 2003-2014
  • SPIL's Revenue, Jan 2013-Jan 2015
  • SPIL's Revenue, Gross Margin and Operating Margin, Q4 2012-Q4 2014
  • SPIL's Revenue Breakdown by Region, 2005-2014
  • SPIL's Revenue Breakdown by Application, 2005-2014
  • SPIL's Revenue Breakdown by Business, 2005-2014
  • SPIL's Capacity, 2006-2014
  • STATS ChipPAC's Revenue and Gross Margin, 2004-2014
  • STATS ChipPAC's Balance Sheet, 2014
  • STATS ChipPAC's Revenue Breakdown by Packaging Type, 2006-2013
  • STATS ChipPAC's Revenue Breakdown by Application, 2006-2013
  • STATS ChipPAC's Revenue Breakdown by Region, 2006-2013
  • Global Distribution of STATS ChipPAC
  • STATS ChipPAC's Revenue Breakdown by Region/Business, 2014
  • Mitsubishi Gas Chemical's Organization Chart
  • MGC's Revenue and Operating Income, FY2009-FY2015
  • MGC's Revenue by Segment, FY2009-FY2015
  • MGC's Operating Income by Segment, FY2009-FY2015
  • CAPEX and Depreciation of MGC's Information and Advanced Material Division, FY2009-FY2015
  • ABF Application
  • ABF Manufacturing Process
  • ABF Construction
  • Outline of Manufacturing Substrate Using ABF
  • Next Build-up Material in Demand
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