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市場調查報告書

中國的半導體產業分析:2014年∼2015年

China Semiconductor Industry Report, 2014-2015

出版商 ResearchInChina 商品編碼 242706
出版日期 內容資訊 英文 110 Pages
商品交期: 最快1-2個工作天內
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中國的半導體產業分析:2014年∼2015年 China Semiconductor Industry Report, 2014-2015
出版日期: 2015年07月22日 內容資訊: 英文 110 Pages
簡介

中國的半導體產業整體規模已達到3000億人幣以上(2014年),但完成品的比例卻低於1/3,此外外資型、台灣企業也佔了大半。除掉這些來分析,中國的半導體企業生產額為125億美金,其中50億為IC設計、37億美金為IC製造、38億美金為IC構裝.檢查。雖然IC設計部門的比例佔了高比例,但中國本土的IC設計企業所設計的產品遠較實際為台灣系晶圓代工廠 (TSMC,UMC等)為少,業界整體而言未不能說是均衡發展中。2014年以後,中國半導體企業將朝全球規模的企業合併、收購(M&A)發展,以強化整體生產能力,但由於人材、技術的累積需要時間,半導體業界方面仍需要長期的配合才行。

本報告提供中國的半導體產業調查分析,提供您全球半導體產業概要,類比半導體·MCU·DRAM·NAND·化合物半導體市場現狀,IC製造業現況,包裝·檢驗產業相關驗證,同時包含主要供應商簡介等資料,為您概述為以下內容。

第1章 全球半導體產業

  • 全球概要
  • 供應鏈
  • 半導體產業概要
  • 半導體檢驗
  • 全球半導體包裝·檢驗企業排行榜
  • 晶圓代工廠產業的規模

第2章 半導體產業的下游工程市場

  • 全球記憶體市場
  • DRAM的供給數量·需求數量
  • NAND的供給數量·需求數量
  • 全球行動電話市場
  • 全球行動電話產業
  • 中國的行動電話市場
  • 筆記型電腦市場
  • 平板電腦市場
  • 伺服器市場

第3章 中國的半導體產業及市場

  • IC市場
  • 半導體產業
  • 中國政府的半導體產業的政策的配合措施
  • 半導體產業的近幾年的企業合併·收購 (M&A)
  • IC產業的發展預測
  • 晶圓代工廠產業的發展目標
  • 半導體包裝·檢驗產業
  • 半導體包裝·檢驗企業的排行榜
  • IC設計產業

第4章 中國的典型性的IC設計企業

  • Hisilicon
  • Spreadtrum
  • Datang Semiconductor
  • Beijing Nari Smart-chip Microelectronics Technology
  • Galaxycore Microelectronics
  • Rockchip
  • Allwinner Technology
  • Silan Microelectronics
  • CEC Huada Electronic Design
  • ZXIC
  • GigaDevice
  • SMIC Microelectronics
  • RDA Microelectronics

第5章 晶圓代工廠

  • SMIC
  • HHGrace
  • Huali Microelectronics
  • XMC
  • ASMC

第6章 半導體包裝·檢驗企業

  • JCET
  • Nantong Fujitsu Microelectronics
  • Tianshui Huatian Technology
  • China Wafer Level CSP

圖表

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄
Product Code: ZYW212

The report covers the followings:

  • 1. Global Semiconductor Market and Industry;
  • 2. China Semiconductor Market and Industry;
  • 3. Eleven Chinese IC Design Companies
  • 4. Five Chinese Foundries
  • 5. Four Chinese Packaging and Testing Companies

According to China Semiconductor Industry Association, the total value of the entire semiconductor industry chain exceeded RMB300 billion in 2014, of which only RMB104.7 billion or one-third was concerned with products (excluding foreign companies). The IC export volume is still optimistic in a relative sense, but it is mostly contributed by foreign companies in China, rather than local enterprises.

Without foreign companies, Taiwanese enterprises and software business, Chinese semiconductor industryturns to be a real pattern like this: the output value of China semiconductor industry approximated USD12.5 billion in 2014, of which USD5 billion came from IC design, USD3.7 billion from IC fabrication, USD3.8 billion from IC packaging and testing. Apparently, IC design accounted for a higher proportion, in fact, the foundries of IC design companies mainly referred to Taiwanese TSMC or UMC, especially large IC design companies; about 80% of wafers were produced by Taiwanese TSMC. This means the irrelevance between IC design companies and foundries in Mainland China.

Since 2014, Chinese financial institutions or enterprises which are adept at capital operation and have huge capitalhave acquired semiconductor companies worldwide vigorously. China is trying to expand its semiconductor industry rapidly through acquisitions. However, the semiconductor industry requires long-term accumulation of talents and technologies, the semiconductor industry of China still has a long way to go even if it renders capital operation.

Chinese government makes great efforts to support the memory sector of the semiconductor industry with the investment of at least USD10 billion, because China is the largest memory market and buys 75% of the global memory. If the global memory industry structure remains stable, China will import tens of billions in USD of memory each year.

Most of Chinese IC design companies rely on their powerful parent companies which are partly state-owned enterprises with dominating positions and non-market-oriented operation to thrive and almost no independent IC design companies exist. For example, the parent company of Nari Smart-chip Microelectronics is a subsidiary of State Grid with main products -- smart meter IC and a monopoly position. The parent company of CEC Huada is China Electronics Corporation (CEC) which monopolizes the ID card-use IC market. Non-state-owned large enterprises Huawei, ZTE, Datang Telecom (with TD-SCDMA technology) and SMIC Microelectronics act as the backers of Hisilicon, ZXIC, Leadcore Technology and Galaxycore respectively.

Independent IC design companies include Spreadtrum, RDA, Rockchip and Allwinner Technology. Spreadtrum and RDA which need a lot of money but hold limited financing channels have been acquired by state-owned enterprises. Major shareholders and technology sources of Goodix and FocalTech are actually Taiwanese companies.

In Mainland China, IC design companies are highly dependent on mobile phone and tablet PC markets. Some companies are even completely dependent on the smart card market, such as Nari Smart-chip Microelectronics, Fudan Microelectronics and Hua Hong Integrated Circuit.

Taiwanese IC design companies which are mostly independent firms are superior in technology to their counterparts in Mainland China; even if some Taiwanese companies relied on the parent companies at early stages, they have become dependent slowly, such as Himax and Novatek. Taiwanese IC design companies largely rely on the upstream industry chain instead of the downstream. Five of Taiwan's top 18 IC design companies focus on LCD driver because Taiwan's LCD panel industry ranks first in the world by shipment. In Chinese Mainland, IC design companies specialize in the digital field except RDA; in contrast, there are many Analog and Mixed IC design companies as well as two high-tech ASIC design companies of a certain scale in Taiwan.

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Table of Contents

1 Global Semiconductor Industry

  • 1.1 Global Overview
  • 1.2 Supply Chain
  • 1.3 Semiconductor Industry Overview
  • 1.4 Semiconductor Testing
  • 1.5 Ranking of Global Packaging and Testing Companies
  • 1.6 Scale of Foundry Industry

2 Downstream Markets of Semiconductor Industry

  • 2.1 Global Memory Market
  • 2.2 DRAM Supply and Demand
  • 2.3 NAND Supply and Demand
  • 2.4 Global Mobile Phone Market
  • 2.5 Global Mobile Phone Industry
  • 2.6 Chinese Mobile Phone Market
  • 2.7 Laptop Computer Market
  • 2.8 Tablet PC Market
  • 2.9 Server Market

3 China's Semiconductor Industry and Market

  • 3.1 IC Market
  • 3.2 Semiconductor Industry
  • 3.3 Government's Policies Incentive to Semiconductor Industry
  • 3.4 Recent M&As in Semiconductor Industry
  • 3.5 Development Forecast for IC Industry
  • 3.6 Development Goals of Foundries
  • 3.7 Semiconductor Packaging and Testing Industry
  • 3.8 Ranking of Semiconductor Packaging and Testing Companies
  • 3.9 IC Design Industry

4 Typical IC Design Companies in China

  • 4.1 Hisilicon
  • 4.2 Spreadtrum
  • 4.3 Datang Semiconductor
  • 4.4 Beijing Nari Smart-chip Microelectronics Technology
  • 4.5 Galaxycore Microelectronics
  • 4.6 Rockchip
  • 4.7 Allwinner Technology
  • 4.8 Silan Microelectronics
  • 4.9 CEC Huada Electronic Design
  • 4.10 ZXIC
  • 4.11 GigaDevice
  • 4.12 SMIC Microelectronics
  • 4.13 RDA Microelectronics

5 Foundries

  • 5.1 SMIC
  • 5.2 HHGrace
  • 5.3 Huali Microelectronics
  • 5.4 XMC
  • 5.5 ASMC

6 Semiconductor Packaging and Testing Companies

  • 6.1 JCET
  • 6.2 Nantong Fujitsu Microelectronics
  • 6.3 Tianshui Huatian Technology
  • 6.4 China Wafer Level CSP

Selected Charts

  • Global Semiconductor Market Size, 2013-2019E
  • Product Distribution of Global Semiconductor Market, 2013-2016E
  • Growth Rate of Global Semiconductor Products by Market Size, 2013-2016E
  • Semiconductor Outsourced Supply Chain
  • Semiconductor Company Systems
  • Semiconductor Outsourced Supply Chain Example
  • Food Chain IC CAD Design Industry
  • Top25 Semiconductor Sales Leaders, 1Q2014
  • Top25 Semiconductor Sales Leaders, 1Q2015
  • Worldwide IC Sales by Company Headquarters Location, 1990-2013
  • Fabless IC Sales Marketshare by Company Headquarters Location, 2013
  • Top 10 IC Manufacturers in China, 2008-2013
  • Ranking of FIQFN Vendors, 2013
  • Ranking of FOWLP Vendors, 2013
  • Ranking of Stacked Package Vendors, 2013
  • Ranking of Global Top 24 Packaging and Testing Companies by Revenue, 2013-2015
  • Operating Margin and Gross Margin of Global Major OSAT Vendors, 2013-2015
  • Global Foundry Market Size, 2008-2018E
  • Global Memory Market Size, 2009-2016E
  • Global Memory Market by Type, 2014
  • Automotive Memory Market Size, 2008-2015
  • Automotive Memory Market by Technology, 2010-2015
  • DRAM Industry Capex, 2008-2015
  • DRAM Oversupply Ratio, 2013-2016E
  • DRAM Demand by Devices, 2013-2015E
  • DRAM GB/SystemDRAM GB/System, 2013-2015
  • DRAM Oversupply Ratio, Q1 2014-Q4 2016
  • NAND Industry Capex, 2008-2015E
  • Mainstream Tech-node on Typical Smartphone IC, 2011-2018E
  • Average IC Costs of a Mobile Phone, 2008-2016E
  • Frequency Bands per Mobile Handset Device, 2000-2018E
  • Cellular Terminal Shipment Forecast by Cellular Standard, 2000-2018E
  • LTE-enabled Cellular Terminal Forecast, 2011-2018E
  • Global Mobile Phone Shipment, 2007-2015
  • Global 3G/4G Mobile Phone Shipment by Region, 2011-2014
  • Major Mobile Phone Vendors' Shipment, Q1 2015
  • Market Share of Major Mobile Phone Vendors, Q1 2015
  • Market Share of Major Mobile Phone OS, Q1 2015
  • Worldwide Smartphone Sales to End Users by Vendor, 2014
  • Worldwide Smartphone Sales to End Users by Operating System, 2014
  • Shipment of Global Top 10 Smartphone Vendors, Q1 2015
  • Share of Major Vendors in Chinese Smartphone Market, 2014
  • Share of Major Vendors in Chinese 4G Mobile Phone Market, 2014
  • Share of Major Vendors in Chinese Smartphone Market, Q1 2015
  • Laptop Computer Shipment, 2008-2015
  • Shipment of Global Major Laptop ODM Vendors, 2010-2014
  • Global Tablet PC Shipment, 2011-2016E
  • Shipment of Top Five Tablet Vendors, Q4 2014
  • Shipment, Market Share and Growth of Top Five Tablet Vendors, 2014
  • Global Server Market Size, 2013-2018E
  • Top 5 Corporate Family, Worldwide Server Systems Factory Revenue, 2013
  • Top 5 Corporate Family, Worldwide Server Systems Factory Revenue, Q4 2014
  • Market Share of Global Server Vendors, 2015
  • China's IC Market Size, 2011-2017E
  • China's IC Import Value, 2006-2014
  • China's IC Export Value, 2006-2014
  • Revenue of China IC Industry, 2008-2014
  • Capex of China IC Industry, 2008-2014
  • Ranking of Top 10 IC Design Companies in China by Revenue, 2004 vs 2014
  • China Foundry Sales Share of Pure-play IC Foundry Market, 2002-2018
  • Structure of China's IC Foundation
  • Size of China's Semiconductor Packaging and Testing Industry, 2009-2015
  • Number and Capacity of Semiconductor Packaging and Testing Enterprises in China, 2010-2014
  • Ranking of Top 30 IC Packaging and Testing Enterprises in China by Revenue, 2014
  • Top 18 IC Design Companies in Taiwan, 2014
  • Ranking of Top 30 IC Design Companies in China, 2013
  • Huawei's Revenue and Operating Margin, 2007-2015
  • Huawei's Selected Financial Data, 2010-2014
  • Huawei's Revenue by Region, 2011-2014
  • Huawei's Revenue by Business, 2011-2014
  • Spreadtrum's Revenue, 2003-2014
  • Selected Financial Data of Datang Semiconductor, 2014
  • Selected Financial Data of Leadcore Technology, 2012-2014
  • Galaxycore's Revenue and Gross Margin, 2011-2014
  • Galaxycore's Revenue by Product, 2011-2014
  • Galaxycore's Revenue by Pixel, 2011-2014
  • Galaxycore's Product Shipment, 2011-2014
  • Galaxycore's Assets, Liabilities and Cash Flow, 2011-2014
  • Balance Sheet of Allwinner Technology, 2012-2014
  • Revenue and Profit of Allwinner Technology, 2012-2014
  • Selected Financial Indicators of Allwinner Technology, 2012-2014
  • Revenue of Allwinner Technology by Application, 2012-2014
  • Major Suppliers of Allwinner Technology, 2014
  • Major Suppliers of Allwinner Technology, 2013
  • Major Suppliers of Allwinner Technology, 2012
  • Major Products of Allwinner Technology
  • Silan's Revenue by Business, 2010-2014
  • GigaDevice's Product Structure
  • GigaDevice's Balance Sheet, 2011-2013
  • GigaDevice's Revenue and Operating Income, 2011-2013
  • GigaDevice's Cash Flow, 2011-2013
  • GigaDevice's Financial Indicators, 2011-2013
  • Distribution of GigaDevice's Clients, 2013
  • Distribution of GigaDevice's Suppliers, 2013
  • Revenue and Operating Margin of SMIC Microelectronics, 2009-2015
  • Revenue of SMIC Microelectronics by Business, 2009-2014
  • Revenue of SMIC Microelectronics by Product, 2009-2014
  • RDA's Product Roadmap
  • RDA's Main Customers
  • RDA's Revenue by Product
  • SMIC's Milestones
  • SMIC's Fab Capacity
  • SMIC's Revenue and Operating Margin, 2007-2015
  • SMIC's Capacity, 2008-2014
  • SMIC's Gross Margin, 2008-2014
  • SMIC's Balance Sheet, 1Q2015
  • SMIC's Cash Flow, 1Q2015
  • SMIC's Net Profit and Gross Margin, 3Q2011-1Q2015
  • SMIC's EBITDA, 3Q2011-1Q2015
  • SMIC's Utilization Rate, 3Q2011-1Q2015
  • SMIC's Revenue by Region, 2010-2014
  • SMIC's Quarterly Revenue Breakdown by Geography, 2013Q2-2015Q1
  • SMIC's Revenue by Application, 2010-2014
  • SMIC's Quarterly Revenue Breakdown by Application, 2013Q2-2015Q1
  • SMIC's Revenue Breakdown by Node, 2010-2014
  • SMIC's Quarterly Revenue Breakdown by Node, 2013Q2-2015Q1
  • SMIC's Quarterly Capacity, 2013Q2-2015Q1
  • SMIC's Technology Migration on Application
  • Revenue, Gross Profit and Operating Income of Huahong Grace, 2011-2015
  • Revenue, Net Income and Asset-Liability Ratio of Huahong Group, 2011-2014
  • Revenue Breakdown of Huahong Grace by Product, 2011-2014
  • Revenue Breakdown of Huahong Grace by Node, 2011-2014
  • Capacity Utilization of Huahong Grace, 2011-2014
  • Revenue Breakdown of Huahong Grace by Client, 2011-2014
  • Revenue Breakdown of Huahong Grace by Region, 2011-2014
  • Revenue Breakdown of Huahong Grace by Application, 2011-2014
  • XMC's Roadmap
  • XMC's 3D IC Technology Platform
  • Revenue and Gross Margin of Shanghai Advanced Semiconductor Manufacturing, 2008-2015
  • ASMC's Revenue by Application, Q2 2013-Q1 2015
  • ASMC's Revenue by Region, Q2 2013-Q1 2015
  • ASMC's Revenue by Client, Q2 2013-Q1 2015
  • ASMC's Revenue by Fab, Q2 2013-Q1 2015
  • ASMC's UTILRate (%), Q2 2013-Q1 2015
  • JCET's Revenue and Operating Margin, 2006-2015
  • JCET's Output, 2011-2014
  • JCET's CHIP Packaging Cost Structure, 2012-2013
  • JCET's Revenue by Product, 2013-2014
  • Global CU Pilluar Capacity Distribution, 2012
  • JCET's Assets and Liabilities, 2009-2014
  • JCET's Quarterly Revenue, Q1 2007-Q1 2015
  • JCET's Quarterly Net Income, Q1 2007-Q1 2015
  • Revenue and Profit of JCET's Major Subsidiaries, 2013-2014
  • JCET's Roadmap
  • Revenue and Operating Income of Nantong Fujitsu Microelectronics, 2007-2015
  • Balance Sheet of Nantong Fujitsu Microelectronics, 2012-2014
  • Cash Flow of Nantong Fujitsu Microelectronics, 2012-2014
  • Key Ratio of Nantong Fujitsu Microelectronics, 2012-2014
  • Revenue and Operating Margin of TianShuiHuaTian microelectronics, 2006-2015
  • Revenue and Operating Income of China Wafer Level CSP, 2010-2015
  • Revenue of China Wafer Level CSP by Client, 2014
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