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市場調查報告書
全球和中國的記憶體產業報告:2011年
Global and China Memory Industry Report, 2011
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全球和中國的記憶體產業報告:2011年 是由出版商ResearchInChina在2011年09月所出版的。
這份英文市場調查報告書包含135 Pages 價格從美金2400起跳。
2011年，雖然全球DRAM整體市場成長率下降，但行動用DRAM卻因為平板電腦和智慧型手機的普及而使其需求擴大。2010年全年的市場成長率為175％，而2011年第一季就達到了15.6％。同時2010年行動用Flash市場也達到70％的成長率。
本報告提供全球和中國的記憶體產業及市場(DRAM，Flash記憶體)相關分析，相關市場的行動電話·PC市場趨勢，全球記憶體產業·市場結構與趨勢詳細內容，行動用記憶體市場趨勢，主要供應商資訊等資料，為您概述為以下內容。
第1 全球和中國的行動電話市場
- 全球行動電話市場規模
- 行動電話製造商市場佔有率
- 智慧型手機市場·產業
- 中國的行動電話產業
第2章 全球和中國的PC市場·產業
- 全球平板電腦市場規模
- 中國的平板電腦市場
- 組裝加工和ODM(ODM廠商設計)
第3章 記憶體產業·市場
- 產業概況
- 產品及技術
- 市場規模
- DRAM實行·檢驗
- Flash實施·檢驗
- eMMC
- DRAM市場
- Flash市場
第4章 行動設備用記憶體
- 行動用DRAM產品和應用
- 行動用DRAM市場
- 行動設備用Flash
第5章 記憶體的供應商
- Samsung
- Hynix
- 東芝
- Elpida Memory
- Micron
- Spansion
- Macronix
- Inotera
- Winbond
- Powerchip
- Promos
- Nanya
圖表一覽
Abstract
This report
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- Analyzes the global and China mobile phone and tablet PC market
- Focuses on memory industry and memory used in mobile devices
- Highlights memory vendors.
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In 2011, the standard DRAM saw the slowdown in growth. But the mushroom of
tablet PC and smart phone enables the CAGR of the Mobile DRAM shipment to soar
to 175%. In Q1 2011, the Mobile DRAM accounted for 15.6% of the total output
of global DRAM.
The CAGR of mobile flash exceeds 70%, and the embedded Flash market will enjoy
a share of 40% in 2010 to over 60% in the Flash market. eMMChas a good
prospect in mobile devices.
According to the ranking concerning revenue from memory products of DRAM
vendors in H1 2011, South Korea-based Samsung and Hynixranked the top two.
Samsung will transform its process technology of DRAM from 3x nm to 2x nm, and
that of NAND Flash from 27 nm to 21 nm. In Q1 2011, the proceeds from DRAM,
NAND Flash and MCP accounted for 54.4%, 42.3% and 3.3% of Samsung' s memory
revenue respectively.
Benefiting from the substantial growth in the output of 35 nm products,
Samsung' s memory occupied 40% market shares in Q2. As for Mobile DRAM, Samsung
has mass-produced low-power LPDDR2 with 30 nm process.
Hynixwill convert DRAM process from 44 nm to 38 nm, and NAND Flash process
from 26 nm to 20 nm. In Q1 2011, the sales of DRAM, NAND Flash and MCP made up
71.2%, 19.7% and 9.1% of Hynix' stotal revenue from memory products separately.
Hynix presently employs the 50nm process to produce Mobile DRAM.
Since Q2 2011, Hynixwill add monthly capacity of 30,000 pcsand plans to raise
the proportion of non-PC DRAM to 60%.
The NAND wafer fab, co-invested by Japanese vendors Toshiba and Sandisk,
applies the 19-nm process technology. In 2011, Elpidarealized the
mass-production of 30-nm process DRAM.
Elpidahas transferred to focus on Mobile DRAM instead of standard DRAM and
introduced 30-nm process for the fabrication of the former. The earnings from
Mobile DRAM accounted for more than 50% of Elpida' srevenue.
The current process technology of Micron Technology is 42 nm process and 37-nm
process is still in the testing phase. In Q1 2011, the sales of DRAM, NAND
Flash and NOR shared 47%, 31% and 19% of Micron' s total revenue respectively.
After its reorganization in 2010, Spansionis devoted to embedded memory and
agrees to cross license their patented products with Samsung.
Taiwan-based vendor Macronix is the world' s largest vendor of Mask ROM and the
fourth largest NOR Flash vendor. In Q1 2011, ROM products of Macronix mainly
adopted 65-nm process technology, and 45-nm process sample will be introduced
in Q2. 110-nm process dominates the production of NOR Flash, and 75-nm process
products will be mass-produced in Q2. The revenue of ROM, NOR Flash and
Foundry Business Group made up 41%, 51% and 8% of Macronix ' stotal revenue
separately in 1Q 2011.
In 2011, NanyaTechnology expanded its output of memory to 60,000 pieces,
30,000 pcsof which are 50/42nm standard memory, and the rest 30,000 ones are
special memories like Mobile DRAM.
Inotera provides DRAM wafer foundry services and its customers are
NanyaCorporation and Micron Technology. The company reached full capacity of
50-nm process products in 2010 and introduced 42-nm process DRAM products in
2011.
The growth of Winbondis mainly motivated by Nor Flash, of which Serial Nor
Flash made up around 90% of Flash shipment. In Q1 2011, the sales of Nor
Flash, Specialty DRAM and Mobile DRAM accounted for 31%, 36% and 28% of
Winbond' stotal revenue respectively. The main customers of Mobile DRAM include
Micron and Spansion.
Table of Contents
1. Global and China Mobile Phone Market
- 1.1. Global Mobile Phone Market Size
- 1.2. Market Share of Mobile Phone Manufacturers
- 1.3. Smart Phone Market and Industry
- 1.4. Mobile Phone Industry in China
2. Global and China Tablet PC Market and Industry
- 2.1. Global Tablet PC Market Size
- 2.2. Chinese Tablet PC Market
- 2.2.1. Price Distribution
- 2.2.2. Operating System and Hardware
- 2.3. Assembly and ODM
3. Memory Industry and Market
- 3.1. Industry Overview
- 3.1.1. Product and Technology
- 3.1.2. Market Size
- 3.1.3. DRAM Packaging and Testing
- 3.1.4. Flash Packaging and Testing
- 3.1.5. eMMC
- 3.2. DRAM Market
- 3.2.1. DRAM Supply Market
- 3.2.2. DRAM Demand Market
- 3.2.3. Competition
- 3.3. Flash Market
4. Memory Used in Mobile Devices
- 4.1. Mobile DRAM Product and Application
- 4.2. Mobile DRAM Market
- 4.2.1. Mobile DRAM Market Size
- 4.2.2. Mobile DRAM Application Market
- 4.2.3. Production of Mobile DRAM Manufacturers
- 4.3. Flash Used in Mobile Devices
5. Memory Vendors
- 5.1. Samsung
- 5.2. Hynix
- 5.3. Toshiba
- 5.4. Elpida
- 5.5. Micron
- 5.6. Spansion
- 5.7. Macronix
- 5.8. Inotera
- 5.9. Winbond
- 5.10. Powerchip
- 5.11. Promos
- 5.12. Nanya
Selected Charts
- Shipment of Mobile Phone Worldwide, 2007-2014
- QuaterlyGlobal Mobile Phone Shipment and Annual Growth Rate, Q1 2008-Q1
2011
- QuaterlyShipment of CDMA and WCDMA Mobile Phone, 2007-2011
- Global Mobile Phone Shipment by Brand, Q1 2010-Q1 2011
- Market Shares of Major Mobile Phone Brands by Revenue, Q1 2009-Q3 2010
- Shipment of Mobile Phone Worldwide by Brand, 2009-2010
- Operating Margin of Global Top5 Mobile Phone Manufacturers, Q1 2009-Q4 2010
- Shipment of Smart Phone Operating System Worldwide, Q3 2010
- Market Share of Global Smart Phone Manufatcturers, Q1 2011
- Market Share of Smart Phone Operating System, 2009-2012
- Smart Phone Shipment of Global Mobile Phone Manufacturers, 2010-2011
- Chinese Mobile Phone Export Volume and Growth Rate, 2000-2010
- Chinese Mobile Phone Export Value and Growth Rate, 2002-2010
- Chinese Mobile Phone Export Volume and ASP, 2002-2010
- Chinese Mobile Phone Output by Region, 2010
- Shipment of NETBOOK,iPadand Tablet PC, 2008-2012
- Shipment of Global Major Tablet PC Brands, 2011-2012
- DRAM and NAND Technology Development of Major Memory Vendors
- Evolution of DRAM Products, 2003-2010
- Memory Market Size and Growth Rate, 2005-2015
- Memory Market Size, 2005-2015
- Comparison between eMMCand Common NAND Chip
- DRAM Industry Capital Investment, 2002-2011
- Global DRAM Wafer Investment, 2011
- DRAM Wafer FabQuantity, 2007-2012
- DRAM Wafer FabConstruction and Closed Numbers, 2000-2011
- Quarterly Operating Margin of Main DRAM Vendors
- DRAM Shipment Growth Rate, 2000-2012
- DRAM FabModel
- QuaterlyDRAM Bit Shipment of Major DRAM Vendors
- DRAM Revenue Model
- DRAM Consumption by Application
- PC Shipment by Product, 2005-2015F
- DRAM Quoted Price,Supplyand Demand, 2010
- DRAM Contract Price, June, 2011
- DDR3 2Gb Spot Price,June2010-June 2011
- Average Carrying Capacity of Standard Memory and the Growth Rate, 2006-2012
- DRAM Market Size and Growth Rate, 2005-2012
- DRAM Market Size by Application, 2005-2015
- Operating Revenue and Market Share of DRAM Vendors, Q3 2010-Q2 2011
- NOR Market Size and Growth Rate, 2005-2012
- Market Share of NOR Flash Manufacturers Worldwide
- NAND Flash Quoted Price, Q1 2011-Q2 2011
- NAND Market Size and Growth Rate , 2005-2012
- NAND Shipment by Application, 2008-2015
- NAND Average CarringCapacity by Application
- NAND Market Demand by Application, 2008-2015
- NAND Demand Market by Application,2008-2012
- Investment Expenditure of NAND Flash , 2004-2015
- NAND FabConstruction and Closed Numbers, 2000-2011
- NAND FabModel
- NAND Bit Shipment Model
- NAND Application Market Demand
- NAND ASP Model
- NAND Business Revenue of Major Memory Manufacturers
- Market Share of Global Flash Memory Manufacturers, 2008-2011F
- NAND ControllIC Manufacturers
- Comparison Between Standard DRAM and Mobile DRAM
- Comparison among DDR, DDR2 and DDR3
- Proportion of Mobile DRAM in the DRAM Market by Revenue
- Specifications of High-end Smart Phone, 2010
- Average CarringCapacity and Growth Rate of Memory in Smart Phone
- Average CarringCapacity and Growth Rate of Memory in Tablet PC
- Mobile DRAM Products of Major DRAM Manufacturers
- Specifications of Major Mobile DRAM Products
- Market Share of Mobile DRAM Manufacturers
- Global Flash Supply and Demand Market, Q1 2009-Q4 2011
- Proportion of Embedded Flash Shippment, 2005-2012F
- Shippmentof Flash Used in Mobile Phone
- eMMCShare of Total Flash Market
- eMMCDensity Trend
- Mobile Handset Booting Architecture
- eMMCBrands of Major NAND Manufacturers
- SAMSUNG Sales and Profits,2008-2010
- SAMSUNG Sales by Division, 2008-2010
- SAMSUNG Operating Profit by Division, 2008-2010
- SAMSUNG Memory Segment Sales by product, Q1 2010-Q4 2011
- SAMSUNG DRAM Shipment and ASP, Q1 2010-Q4 2011
- SAMSUNG NAND Shipment and ASP, Q1 2010-Q4 2011
- DRAM and NAND Revenue Contribution of Apple to SAMSUNG Electronics, 2011
- Technology Roadmap of SAMSUNG MCP
- SAMSUNG Mobile DRAM and MCP Product
- SAMSUNG eMMCProduct
- Operating Revenue and Gross Margin of Hynix, 2007-2011
- HYNIX Memory Segment Sales by Product, Q1 2010-Q4 2011
- HYNIX DRAM Shipment and ASP, Q1 2010-Q4 2011
- HYNIX NAND Shipment and ASP, Q1 2010-Q4 2011
- HynixSales by Application, Q1 2010-Q1 2011
- HYNIX DRAM Sales by Node, Q1 2010-Q4 2011
- HYNIX NAND Sales by Node, Q1 2010-Q4 2011
- Model Decoding of HYNIX MCP Memory for Mobile Phone
- Sales and Net Income of Toshiba,FY2004-FY2010
- Investment and R&D Expenditure of Toshiba, FY2010-FY2011
- Memory Product Sales of Toshiba,FY2007-FY2010
- NAND Flash Memory Product
- Toshiba eMMCProduct
- Operating Revenue and Gross Margin of Elpida, FY2006-FY2010
- Operating Revenue of DRAM Product in Elpida, FY2004-FY2010
- Capital Expenditure of Elpida, FY2011
- Operating Revenue and Net Income of Elpida, FY2003-FY2010
- Operating Revenue of Elpidaby Region, 2009-2010
- Mobile DDR/DDR2 DRAM Product of Elpida
- MICRON Sale and Gross Margin, FY2004-FY2011
- Revenue Structure of Micron by Product, FY2006-FY2010
- Revenue Structure of Micron by Application, FY2006-FY2010
- Business of Structure of Micron
- Operating Revenue of Micron by Business, FY2011Q1-Q3
- MICRON R&D and SG&A Expenses, Q3 FY2009-Q3 FY2011
- MICRON Cash Flow From Operations, Q1 FY2010-Q3 FY2011
- Operating Revenue and Gross Margin of Spansion, 2004-2010
- Quarterly Revenue and Gross Margin of Spansion, Q2 2009-Q1 2011
- Revenue of Spansionby Application, Q2 2010-Q1 2011
- Revenue of Spansionby Region, Q2 2010-Q1 2011
- Macronix Sales and Gross Margin, 2003-2011
- Macronix Sales Per Month, June 2009-June 2011
- Macronix Gross Margin, Q1 2009-Q1 2011
- Macronix Quarterly Sales Breakdown by Products, Q1 2010, Q4 2010, Q1 2010
- Macronix Quarterly Quantity Breakdown by Products, Q1 2010, Q4 2010, Q1
2010
- Macronix Quarterly Sales Breakdown by Technology, Q1 2010, Q4 2010, Q1 2010
- Macronix 8" Equivalent Wafer Out & Utilization Rate, Q1 2006-Q1 2011
- Macronix ROM Quantity Index, Q1 2006-Q1 2011
- Macronix ROM Shipments by Technology, Q1 2009-Q1 2011
- Macronix NOR Flash Quantity Index, Q1 2006-Q1 2011
- Macronix NOR Flash Shipments by Technology, Q1 2009-Q1 2011
- Macronix NOR Flash Breakdown, 2011Q1
- Revenue and Gross Margin of Inotera , 2004-2011
- Inotera Revenue and Gross Margin, Q1 2010-Q1 2011
- Inotera Wafer Shipments, Q1 2010-Q1 2011
- Inotera Quarterly Bit Shipments, Q1 2010-Q1 2011
- Revenue and Gross Margin of Winbond, 2006-2010
- Quarterly Revenue and Gross Margin of Winbond, Q2 2009-Q1 2011
- Wafer Process Technology of Winbond, Q1 2009-Q1 2011
- Operating Revenue Structure of Winbondby Product, Q2 2009-Q1 2011
- 12-inch Wafer Output of Winbondby Product, Q1 2009-Q2 2011
- Production Technology Migration Process of Winbond, Q1 2011-Q1 2012
- Operating Revenue and Gross Margin of Powerchip, 2004-2010
- Quarterly Operating Revenue and Gross Margin of Powerchip,Q1 2009-Q1 2011
- DRAM and Flash R&D Progression of Powership, Q1 2011-Q4 2011
- DRAM Product Specifications of Powership
- Revenue and Gross Margin of Promos, 2004-2010
- Quarterly Revenue and Gross Margin of Promos, Q1 2009-Q1 2011
- Promos MCP Product
- Operating Revenue and Gross Margin of Nanya, 2004-2010
- Quarterly Operating Revenue and Gross Margin of Nanya, Q1 2009-Q1 2011
- DRAM Sales Volume and Revenue of Nanya, 2008-2012F
- Capital Expenditure of Nanya, 2003-2011
- Cost Comparison between Micron and Elpidaby Process Technology, 2010
- Cost Saving with 50nm Process Technology
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