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市場調查報告書

全球和中國的先進封裝產業:2014年∼2015年

Global and China Advanced Packaging Industry Report, 2014-2015

出版商 ResearchInChina 商品編碼 134082
出版日期 內容資訊 英文 170 Pages
商品交期: 最快1-2個工作天內
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全球和中國的先進封裝產業:2014年∼2015年 Global and China Advanced Packaging Industry Report, 2014-2015
出版日期: 2015年07月06日 內容資訊: 英文 170 Pages
簡介

半導體的後工程 (組裝、檢驗) 外包 (OSAT) 的全球市場,2014年約達271億美元規模,與前一年同期比較增加7.9%。

本報告提供全球和中國的先進封裝產業調查分析、全球、中國的半導體市場/產業分析、先進封裝的技術趨勢、全球、中國的先進封裝產業分析、主要供應商分析相關的系統性資訊。

第1章 全球半導體產業

  • 市場概要
  • 供應鏈
  • 產業概要

第2章 IC封裝產業的下游工程市場

  • 全球記憶體市場
  • DRAM的需求與供給
  • NAND的需求與供給
  • 全球行動電話市場
  • 全球行動電話產業
  • 中國的行動電話市場
  • 筆記型電腦市場
  • 平板電腦市場
  • 伺服器市場

第3章 封裝趨勢與檢驗技術

  • HBM/HMC記憶體
  • 埋入零件基板
  • 埋入追蹤基板
  • PoP封裝
  • FOWLP
  • 所謂SIP封裝
  • SIP封裝產業/市場
  • 2.5D封裝
  • TSV(3D)封裝
  • 感測器/MEMS/CIS封裝

第4章 封裝、檢驗產業

  • 封裝、檢驗產業的規模
  • 中端封裝、檢驗產業
  • 中國的半導體封裝、檢驗產業
  • 中國的半導體封裝、檢驗供應商的排行榜
  • 半導體的檢驗
  • 全球封裝、檢驗供應商的排行榜等

第5章 封裝、檢驗供應商

  • ASE
  • Amkor
  • SPIL
  • STATS ChipPAC
  • PTI
  • Greatek
  • ChipMOS
  • KYEC
  • Unisem
  • FATC
  • JECT
  • UTAC
  • Lingsen Precision
  • Nantong Fujitsu Microelectronics
  • Walton Advanced Engineering
  • Chipbond
  • J-DEVICES
  • MPI
  • STS Semiconductor
  • Signetics
  • Hana Micron
  • NEPES
  • Tianshui Huatian Technology
  • China Wafer Level CSP

圖表

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄
Product Code: ZYW211

‘Global and China Advanced Packaging Industry Report, 2014-2015’ focuses on the followings:

  • 1. Analysis of Global Semiconductor Market and Industry
  • 2. Analysis of Chinese Semiconductor Market and Industry
  • 3. Technical Trends of Advanced Packaging
  • 4. Analysis of Global and China Advanced Packaging Industry
  • 5. Study of 24 Advanced Packaging Vendors

Global outsourced semiconductor assembly and test (OSAT) market was valued at about USD27.1 billion in 2014, expanding by 7.9% from 2013, is expected to swell by 7.0% to USD29 billion in 2015, and will further slow down to 3.8% in 2016, but start to accelerate with growth rate of 6.0% in 2017. Memory packaging and test is the largest single-product packaging and test in OSAT field, HMC and HBM are expected to spring up after 2017, accelerating the expansion of OSAT. It is predicted that SiP and ePoP will be main drivers behind OSAT growth in 2015 and 2016.

New technologies have mushroomed in OSAT field, but few of them were commercialized and used on a massive basis in recent years. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. On the one hand, these new technologies are not sufficiently mature and small in scale, leading to higher cost, like FOWLP attempting to replace FC-CSP. On the other hand, the reason lies in business model. Wafer-level packaging (WLP) has become more and more common, but the business model in which whether Foundry or OSAT dominates WLP still needs to be explored. As business model has not been fully shaped, downstream vendors will adopt a wait-and-see attitude. For future 2.5D and 3D packaging, most of silicon interposer layers may be completed by OSAT companies and part by Foundries. There may be also companies that specialize in silicon interposer layers.

Two pronounced trends of OSAT industry are: 1) Revenue growth of large companies far exceeds that of small ones, as the former has more funding for R&D than the latter, and OSAT industry hungers for new technologies. Long-term development of the companies cannot be realized without adequate technology accumulation. 2) Chinese OAST companies grow at the fastest rate, largely due to strong liquidity and hot stock market, which provide strong financial backing for OSAT companies, thus giving them adequate funds for R&D and capacity expansion. Chinese OSAT companies, by virtue of powerful weapon of capital, enter the stage of rapid development, and will boost its scale and technical competence via more acquisitions.

Table of Contents

1. Global Semiconductor Industry

  • 1.1. Market Overview
  • 1.2. Supply Chain
  • 1.3. Industry Overview

2. Downstream Markets of IC Packaging Industry

  • 2.1. Global Memory Market
  • 2.2. Supply and Demand of DRAM
  • 2.3. Supply and Demand of NAND
  • 2.4. Global Mobile Phone Market
  • 2.5. Global Mobile Phone Industry
  • 2.6. Chinese Mobile Phone Marekt
  • 2.7. Laptop Computer Market
  • 2.8. Tablet PC Market
  • 2.9. Server Market

3. Trends of Packaging & Test Technology

  • 3.1. HBM/HMC Memory
  • 3.2. Embedded Component Substrate
  • 3.3. Embedded Trace Substrate
  • 3.4. POP Packaging
  • 3.5. FOWLP
  • 3.6. Introduction of SiP Packaging
  • 3.7. SiP Packaging Industy and Market
    • 3.7.1. Murata
    • 3.7.2. USI
  • 3.8. 2.5D Packaging (SI/GLASS/ORGANIC INTERPOSER)
    • 3.8.1. Introduction of 2.5D Packaging
    • 3.8.2. Applications of 2.5D Packaging
    • 3.8.3. Business Model of 2.5D Packaging
    • 3.8.4. 2.5D Interposer Market Size
    • 3.8.5. Suppliers of 2.5D Packaging
  • 3.9. TSV (3D) Packaging
    • 3.9.1. TSV Packaging Equipment
  • 3.10. SENSOR/MEMS/CIS Packaging
    • 3.10.1. MEMS Market Size
    • 3.10.2. Trends of Sensor/MEMS/CIS Packaging

4. Packaging & Test Industry

  • 4.1. Packaging & Test Industry Size
  • 4.2. Middle-end Packaging & Test Industy
  • 4.3. China Semiconductor Packaging & Test Industy
  • 4.4. Ranking of Chinese Semiconductor Packaging & Test Vendors
  • 4.5. Semiconductor Test
  • 4.6. Ranking of Global Packaging & Test Vendors
  • 4.7. Foundry Industry Size
  • 4.8. Chinese IC Market
  • 4.9. China Semiconductor Industry
  • 4.10. Chinese Government's Supportive Policies for Semiconductor Industry
  • 4.11. Recent M&As in China's Semiconductor Field
  • 4.12. Forecast of China IC Industry Development
  • 4.13. Development Goals of China Foundry Industry

5. Packaging & Test Vendors

  • 5.1. ASE
  • 5.2. Amkor
  • 5.3. SPIL
  • 5.4. STATS ChipPAC
  • 5.5. PTI
  • 5.6. Greatek
  • 5.7. ChipMOS
  • 5.8. KYEC
  • 5.9. Unisem
  • 5.10. FATC
  • 5.11. JECT
  • 5.12. UTAC
  • 5.13. Lingsen Precision
  • 5.14. Nantong Fujitsu Microelectronics
  • 5.15. Walton Advanced Engineering
  • 5.16. Chipbond
  • 5.17. J-DEVICES
  • 5.18. MPI
  • 5.19. STS Semiconductor
  • 5.20. Signetics
  • 5.21. Hana Micron
  • 5.22. NEPES
  • 5.23. Tianshui Huatian Technology
  • 5.24. China Wafer Level CSP

Selected Charts:

  • Global Semiconductor Market Size, 2013-2019E
  • Global Semiconductor Market Breakdown by Product, 2012-2016E
  • Market Size Growth of Various Semiconductor Products, 2012-2016E
  • Semiconductor Outsourced Supply Chain
  • Semiconductor Company Systems
  • Semiconductor Outsourced Supply Chain Example
  • Food Chain IC CAD Design Industry
  • Top25 Semiconductor Sales Leaders, 2014Q1
  • Top25 Semiconductor Sales Leaders, 2015Q1
  • Worldwide IC Sales by Company Headquarters Location, 1990-2013
  • Fabless IC Sales Market Share by Company Headquarters Location, 2013
  • Top10 IC Vendors in China, 2008-2013
  • Global Memory Market Size, 2009-2016E
  • Global Memory Market by Type, 2014
  • Automotive Memory Market Size, 2008-2015
  • Automotive Memory Market by Technology, 2010-2015
  • Capex of DRAM Industry, 2008-2015
  • Oversupply Ratio of DRAM, 2013-2016E
  • DRAM Demand by Device, 2013-2015
  • DRAM GB/System, 2013-2015
  • Oversupply Ratio of DRAM, 2014Q1-2016Q4E
  • Capex of NAND Industry, 2008-2015
  • Mainstream Tech-node on Typical Smartphone IC, 2011-2018E
  • Average IC Costs Per Mobile Phone, 2008-2016E
  • Frequency Bands Per Mobile Handset Device, 2000-2018E
  • Cellular Terminal Shipment Forecast by Cellular Standard, 2000-2018E
  • LTE-enabled Cellular Terminal Forecast, 2011-2018E
  • Global Mobile Phone Shipments, 2007-2015
  • Global 3G/4G Mobile Phone Shipments Breakdown by Region, 2011-2014
  • Worldwide Smartphone Sales to End Users by Vendor, 2014 (Thousands of Units)
  • Worldwide Smartphone Sales to End Users by Operating System, 2014 (Thousands of Units)
  • Shipments of Global Top10 Mobile Phone Vendors, 2014
  • Shipments of Major Mobile Phone Vendors, 2015Q1
  • Market Share of Major Mobile Phone Vendors, 2015Q1
  • Market Share of Major Mobile Phone Operating Systems, 2015Q1
  • Worldwide Smartphone Sales to End Users by Vendor, 2014 (Thousands of Units)
  • Worldwide Smartphone Sales to End Users by Operating System, 2014 (Thousands of Units)
  • Market Share of Major Chinese Smartphone Vendors, 2014
  • Market Share of Major Vendors in Chinese 4G Mobile Phone Market, 2014
  • Laptop Computer Shipments, 2008-2015
  • Shipments of Major Global Notebook PC ODM Vendors, 2010-2014
  • Global Tablet PC Shipments, 2011-2016E
  • Shipments of Top5 Tablet PC Vendors, 2014Q4
  • Shipments, Market Share and Growth of Top5 Tablet PC Vendors, 2014
  • Global Server Market Size, 2013-2018E
  • Worldwide Server Systems Factory Revenue of Top5 Corporate Family, 2013
  • Worldwide Server Systems Factory Revenue of Top5 Corporate Family, 2014Q4
  • Market Share of Global Server Vendors, 2015
  • HBM Architecture
  • Mobile DRAM Trend
  • Advantages of WIDE IO
  • SK Hynix WIDE IO2 Roadmap
  • HMC Architecture
  • Benefits of HMC
  • Advantages of Embedded Passive/Active Substrate
  • Embedded Component Substrate Process
  • Comparison of Embedded Active & Passive Components
  • Roadmap of Embedded Passive Substrate
  • Structure Roadmap of Embedded Active Substrate
  • FOWLP and PLP Process Comparison
  • Why Embedded Trace?
  • Embedded Trace Package Features
  • Embedded Trace Package Sweet Spot (for Wire Bonding)
  • Embedded Trace Package Sweet Spot (for FLIP CHIP)
  • Development Trend of PoP Packaging
  • Samsung Widcon
  • ePoP Architecture
  • Application of FOWLP
  • Fan-Out eWLP (Embedded Wafer-Level Packaging) Architecture
  • Embedded Fan-Out Wafer Level Package (eWLP) vs. PBGA (Plastic Ball Grid Array)
  • Thermal Management between PBGA and InFO-WLP of Baseband Chip Set (TSMC Results)
  • SiP Module Technologies
  • Business Model of ASE and USI
  • SoC, SiP and SoB
  • SiP Roadmap
  • Market Share of Major SiP Packaging Vendors, 2014
  • Sales and Operation Margin of Murata, FY2009-FY2016
  • Sales Breakdown of Murata by Product, FY2013-FY2015
  • Major Products of Murata
  • Sales Breakdown of Murata by Application, FY2013-FY2016
  • Operation Income Bridge of Murata, FY2014-FY2015
  • Quarterly Sales, Order and Backlog of Murata, 2012Q2-2015Q1
  • Revenue and Operating Margin of USI, 2008-2015
  • Revenue of USI by Application, 2011-2014
  • Output of USI's Products, 2011-2014
  • Cost Structure of USI, 2014
  • ASE (USI) SiP Module Roadmap for System Integration
  • ASE (USI) SiP Module Roadmap for Miniaturization
  • ASE (USI) SiP Module Roadmap Advanced Process
  • Challenges of 2.5D Packaging Technology
  • Current 2.5D Packaging Business Model
  • Future 2.5D Packaging Business Model
  • 2.5D Interposer Manufacturing Revenue
  • Breakdown by Interposer Bulk Material, 2010-2017
  • Applications of TSV
  • Suppliers of TSV Equipment
  • TSV Packaging Equipment Distribution, 2012-2017E
  • MEMS -NEMS Trend
  • MEMS Shipments, 2013\2018E
  • MEMS Market Size, 2012-2018E
  • Main MEMS Players, 2014-2015
  • Avago's FBAR MEMS Filter with TSV
  • CIS Packaging Trend
  • Cross-section SEM Image of a BI-CIS
  • OSAT Market Size, 2008-2018E
  • Share of IC Package Value Add, 1990-2020E
  • Global Shipments of IC Packaging Type, 2011/2013/2018E
  • BUMPED WAFER PRODUCTION BY PITCH (300mm Equivalent), 2013/2018E
  • Middle-End Packaging Industry Process
  • China Semiconductor Packaging & Test Industry Size, 2009-2015
  • Number of Capacity of Chinese Semiconductor Packaging & Test Vendors, 2010-2014
  • Top30 Chinese IC Packaging & Test Vendors by Revenue, 2014
  • Ranking of FIQFN Vendors, 2013
  • Ranking of FOWLP Vendors, 2013
  • Ranking of Stacked Package Vendors, 2013
  • Ranking of Global Top24 OSAT Companies by Revenue, 2013-2015
  • Operating Margin and Gross Margin Comparison of Major Global OSAT Companies, 2013-2015
  • Global Foundry Market Size, 2008-2017E
  • Chinese IC Market Size, 2011-2017E
  • China's IC Imports, 2006-2013
  • China's IC Exports, 2006-2013
  • China's IC Industry Sales, 2008-2014
  • Capex of China's IC Industry, 2008-2014
  • Top10 Chinese IC Design Houses by Sales, 2004/2014
  • China Foundry Sales Share of the Pure-play IC Foundry Market, 2002-2018E
  • China National IC Fund Structure
  • Organizational Structure of ASE
  • Revenue and Gross Margin of ASE, 2003-2015
  • Revenue and Operating Margin of ASE, 2009-2015
  • Monthly Revenue of ASE, May 2013-May 2015
  • Revenue of ASE by Business, 2010-2015
  • Revenue and Gross Margin of ASE Packaging, 2013Q1-2015Q1
  • Revenue of ASE Packaging by Type, 2013Q1-2015Q1
  • Revenue and Gross Margin of ASE Testing, 2013Q1-2015Q1
  • Revenue and Gross Margin of ASE Material, 2013Q1-2015Q1
  • EMS Revenue and Gross Margin of ASE, 2013Q1-2015Q1
  • IC ATM Revenue Structure of ASE by Application, 2013Q1-2015Q1
  • EMS Revenue Structure of ASE by Application, 2013Q1-2015Q1
  • Machinery & Equipment Capital Expenditure vs. EBITDA of ASE, 2013Q1-2015 Q1
  • Major Customers of ASE
  • Revenue, Gross Margin and Operating Margin of Amkor, 2005-2015
  • Revenue of Amkor by Packaging Type, 2007-2015
  • Shipments of Amkor by Packaging Type, 2012-2015
  • Revenue of Amkor by Application, 2012-2015
  • Amkor's Capital Intensity, 2012-2015
  • Debt and Cash of Amkor, 2012-2015
  • Property, Plant and Equipment of Amkor by Region 2012\2013
  • Revenue and Shipments of Amkor by Region, 2012
  • Net Sales of Amkor by Country Based on Customer Location, 2012-2014
  • Organizational Structure of SPIL
  • Revenue, Gross Margin and Operating Margin of SPIL, 2005-2015
  • Monthly Revenue of SPIL, May 2013-May 2015
  • Quarterly Revenue, Gross Margin and Operating Margin of SPIL, 2013Q1-2015Q1
  • Revenue of SPIL by Region, 2005-2015
  • Revenue of SPIL by Application, 2005-2015
  • Revenue of SPIL by Business, 2005-2015
  • Capacity of SPIL, 2006-2015
  • Equity Structure of New STATS ChipPAC
  • Revenue and Gross Margin of STATS ChipPAC, 2004-2015
  • Revenue of STATS ChipPAC by Packaging Type, 2006-2015
  • Revenue of STATS ChipPAC by Application, 2006-2015
  • Revenue of STATS ChipPAC by Region, 2006-2015
  • Organizational Structure of PTI
  • Revenue and Gross Margin of PTI, 2008-2015
  • Monthly Revenue of PTI, May 2013-May 2015
  • Revenue Mix of PTI by Application, 2014Q1-2015Q1
  • Revenue, Gross Margin and Operating Margin of Greatek, 2005-2015
  • Monthly Revenue and Growth of Greatek, May 2013-May 2015
  • Revenue and Gross Margin of ChipMOS, 2003-2015
  • Revenue and Operating Margin of ChipMOS, 2009-2015
  • Revenue of ChipMOS by Business, 2010-2015
  • Revenue of ChipMOS by Product, 2010-2015
  • Utilization Rate and EBITDA Margin of ChipMOS, 2011-2015
  • Cash Flow and CAPEX of ChipMOS, 2011-2015
  • Technology Roadmap of ChipMOS, 2014-2016
  • ChipMOS Technology Development & Business Alignment
  • Revenue and Gross Margin of KYEC, 2003-2015
  • Revenue and Operating Margin of KYEC, 2009-2015
  • Monthly Revenue of KYEC, May 2013-May 2015
  • Distribution of KYEC's Plants
  • Testing Platforms of KYEC
  • Revenue and EBITDA of Unisem, 2006-2015
  • Revenue and EBITDA of Unisem, 2012Q1-2015Q1
  • Quarterly Gross Margin of Unisem, 2012Q1-2015Q1
  • Quarterly Revenue Structure of Unisem by Technology, 2012Q2-2015Q1
  • Quarterly Revenue Structure of Unisem by Application, 2012Q2-2015Q1
  • Organizational Structure of Formosa Plastics
  • Organizational Structure of FATC
  • Revenue and Operating Margin of FATC, 2006-2015
  • Revenue and Gross Margin of FATC, 2009-2015
  • Monthly Revenue of FATC, May 2013-May 2015
  • Revenue and Operating Margin of JECT, 2006-2015
  • Output of JECT, 2011-2014
  • Chip Packaging Cost Structure of JECT, 2012-2014
  • Revenue of JECT by Product, 2013-2014
  • Global CU Pilluar Capacity, 2012
  • Assets and Liabilities of JECT, 2009-2014
  • Quarterly Revenue of JECT, 2007Q1-2015Q1
  • Quarterly Net Income of JECT, 2007Q1-2015Q1
  • Revenue and Profit of JECT's Major Subsidiaries, 2013-2014
  • JCET Roadmap
  • Revenue and Gross Margin of UTAC, 2010-2015
  • Revenue of UTAC by Business, 2010-2014
  • Revenue of UTAC by Business, 2010-2015
  • Revenue of UTAC by Product, 2010-2015
  • Revenue of UTAC by Customer, 2011-2013
  • Technological Distribution of UTAC
  • Global Distribution of UTAC
  • Revenue and Operating Margin of Lingsen Precision, 2007-2015
  • Revenue and Gross Margin of Lingsen Precision, 2009-2015
  • Monthly Revenue of Lingsen Precision, May 2013-May 2015
  • Revenue and Operating Income of Nantong Fujitsu Microelectronics, 2007-2015
  • Balance Sheet of Nantong Fujitsu Microelectronics, 2012-2014
  • Cash Flows of Nantong Fujitsu Microelectronics, 2012-2014
  • Key Ratio of Nantong Fujitsu Microelectronics, 2012-2014
  • Revenue and Operating Margin of Walton Advanced Engineering, 2007-2015
  • Revenue and Gross Margin of Walton Advanced Engineering, 2009-2015
  • Monthly Revenue and Growth of Walton Advanced Engineering, May 2013-May 2015
  • Revenue and Operating Margin of Chipbond, 2006-2015
  • Revenue and Gross Margin of Chipbond, 2009-2015
  • Monthly Revenue and Growth of Chipbond, May 2013-May 2015
  • Revenue of Chipbond by Business, 2012
  • Global Gold Bumping Vendor Capacity Share, 2013
  • Organizational Structure of J-DEVICES
  • Revenue and PBT of MPI, FY2007-FY2015
  • Equity and Assets of MPI, FY2010-FY2014
  • Revenue of MPI by Region, FY2011-FY2014
  • Organizational Structure of STS Semiconductor
  • Revenue and Operating Margin of STS Semiconductor, 2006-2015
  • Revenue of STS Semiconductor by Business, 2011-2013
  • Capacity of STS Semiconductor, 2011-2013
  • Output of STS Semiconductor, 2011-2013
  • Customer Distribution of STS Semiconductor, 2013-2015
  • Shareholder Structure of Signetics
  • Revenue and Operating Margin of Signetics, 2007-2015
  • Revenue and Operating Margin of Hana Micron, 2006-2015
  • Revenue of Hana Micron by Customer, 2014
  • Revenue of Hana Micron by Market, 2013Q1-2014Q4
  • Revenue and Operating Margin of Nepes, 2007-2015
  • Quarterly Revenue of Nepes by Division, 2013-2014
  • Revenue and Operating Margin of Tianshui Huatian Technology, 2006-2015
  • Revenue and Operating Income of China Wafer Level CSP, 2010-2015
  • Revenue of China Wafer Level CSP by Customer, 2014
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