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市場調查報告書
近距離無線與NFC：行銷．技術動向
Short-reach Radio and Near Field Communications - Marketing and Technological Trends
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近距離無線與NFC：行銷．技術動向 是由出版商Practel, Inc.在2009年10月所出版的。
這份英文市場調查報告書價格從美金3990起跳。
本報告書內容包括：有關WPAN及WLAN用近距離通訊技術、特別以Bluetooth．ZigBee．UWB．IEEE802.11n．NFC為對象，分析市場、相關技術的特徵、規格及應用程式、NFC對應元件開發的重要性、WPAN/WLAN裝置供應商調查、2009年至2013年的市場預測等，內容綱要摘記如下：
第1章 介紹
第2章 UWB：技術及市場的特徵
- 歷史
- 定義
- 頻率分配
- 主要特徵
- 規格．法規
- 應用程式
- 課題
- 應用程式的摘要
- UWB市場
- 產業：UWB
第3章 ZigBee
- 概要
- 詳細
- 協議棧
- 相互運用性
- 安全
- 平台的檢討
- 電池壽命
- ZigBee技術的優點與限制
- 標準化程序
- ZigBee IP
- IEEE 802.15.4 - ZigBee的基礎
- 應用程式規格－簡介
- 應用程式
- 「綠色(環保)」的ZigBee
- 市場
- 產業
第4章 IEEE 802.15.1 (Bluetooth)
第5章 802.11n技術
- 先進技術及IEEE 802.11n： MIMO及其他
- 特徵
- 適用
- 優點與應用程式
- 市場
- 產業
第6章 NFC
- 概要
- 特徵
- 規格
- 安全
- 比較
- 應用程式
- NFC市場
- 供應商
第7章 結論
圖表清單
Abstract
This report analyzes short-range communications technologies for WPAN and
WLAN; particular, the following markets and related technologies were
addressed:
- Bluetooth (BT)
- ZigBee
- UWB
- IEEE802.11n
- Near Field Communications.
The report analyzes technologies features, standards and applications with
emphasis on the importance of developing NFC-able devices.
The report also stresses the following trends:
- Progress in the development of multi-protocols SoCs with integration on
single IC elements that support several technologies
- As a result, multi-modal communications using, for example, a single
handset become visible (for example, when a user environment is changed from
WPAN to WLAN).
- NFC is finding various applications where it has a significant role as an
independent technology; or it is used for initiation of communications
channels in other technologies environments (physical browsing is a new
intuitive human-computer interfacing paradigm for mobile users. Services,
such as information retrieval and distribution, peer- to- peer communication,
payment or ticketing, and professional applications can be initiated by simply
touching an object with a user' s personal device (or even bringing two devices
close to each other without touching)
It is expected that one of the most important NFC application will be an
integration of NFC technology into cell phones to transfer them into devices
that may eventually replace credit cards. The concept of a “wireless
wallet” is discussed in details, as well as a concept of m-payments with
its advantages and issues.
The report contains a detailed survey of WPAN/WLAN equipment vendors; and
estimates of the markets developing for the 2009-2013 time frame.
Methodology
Considerable research was done using the Internet. Information from various
Web sites was studied and analyzed; evaluation of publicly available marketing
and technical publications was conducted. Telephone conversations and
interviews were held with industry analysts, technical experts and executives.
The overriding objective throughout the work has been to provide valid and
relevant information. This has led to a continual review and update of the
information content.
Intended Audience
This report is useful for technical and marketing staff involved in the
developing of short-reach communications markets and applications. It
addresses NFC and short-reach communications technologies applications and
marketing features.
For systems vendors, integrators and others, the report provides an analysis
and assessment of competing products currently available as well as an
estimation of the overall opportunities in the coming years. The end users can
gain a more thorough understanding of products' market and capabilities as
well as the economics of using combinations of NFC with other technologies to
improve operational efficiency.
Table of Contents
1.0 Introduction
- 1.1 General
- 1.2 NFC Specifics
- 1.3 Short-reach Radio Specifics
- 1.4 Report Structure
- 1.5 Methodology
- 1.6 Intended Audience
2.0 UWB: Technology and Market Specifics
- 2.1 History
- 2.2 Definition
- 2.3 Spectrum Allocation
- 2.4 Major Features
- 2.4.1 Communications Features
- 2.5 Standards and Regulations
- 2.5.1 Multiband OFDM
- 2.5.2 DS-UWB
- 2.5.3 Comparison
- 2.5.4 IEEE
- 2.5.5 FCC and ETSI
- 2.5.6 ECMA International
- 2.5.7 European Regulators
- 2.5.7.1 EUWB
- 2.5.8 Worldwide
- 2.5.9 Comparison
- 2.5.9.1 Impulse Radio- Pulse Link, Time Domain
- 2.5.9.2 DS-CDMA - Motorola and other
- 2.5.9.3 Multi-Band OFDM (FH) - MBOA
- 2.6 Applications
- 2.7 Issues
- 2.8 Applications Summary
- 2.9 UWB Market
- 2.9.1 General
- 2.9.2 Forecast
- 2.9.2.1 Conditions
- 2.9.2.2 Drivers
- 2.9.2.3 Analysis
- 2.9.3 Comments
- 2.10 Industry: UWB
- Alereon (chipsets)
- Artimi (merged with Staccato - November 2008)
- BBN (UWB radio, first responders)
- Belkin (USB)
- Camero (radar, equipment for first responders)
- Fujitsu Components (antenna, filter)
- General Atomics (chipsets)
- GeFen (HDMI Extender)
- Intel (ICs)
- Parco (RFID-Health Care)
- Pulse~ Link (chipsets)
- Sigma Designs
- Staccato (chipsets)
- Time Domain (chipsets-fusion of communications & radar)
- Toshiba (Wireless USB)
- Ubisense (RFID-tracking)
- Wisair (chipsets)
- Zebra (Real Time Locating Systems)
3.0 ZigBee
- 3.1 General
- 3.2 Details
- 3.2.1 Major Features
- 3.2.2 Device Types
- 3.3 Protocol Stack
- 3.3.1 Physical and MAC layers - IEEE802.15.4
- 3.3.2 Frame
- 3.3.3 Upper Layers
- 3.4 Interoperability
- 3.5 Security
- 3.6 Platform Considerations
- 3.7 Battery Life
- 3.8 ZigBee Technology Benefits and Limitations
- 3.9 Standardization Process
- 3.9.1 ZigBee Alliance
- 3.9.2 Example: Smart Energy Profile-ICT for Smart Grid
- 3.10 ZigBee IP
- 3.11 IEEE 802.15.4 - ZigBee Basis
- 3.12 Application Specifics - Profiles
- 3.13 Applications
- 3.13.1 General
- 3.13.2 Home
- 3.13.3 PC
- 3.13.4 Manufacturing
- 3.13.5 WSN-UGS and ZigBee
- 3.14 “Green” ZigBee
- 3.15 Market
- 3.15.1 Expectations
- 3.15.2 Segments
- 3.15.3 Forecast
- 3.16 Industry
- Airbee (Software)
- Amber (RF Modules)
- Arch Rock (IP)
- Atmel (Chipsets)
- Atmel and TazTag (NFC+ZigBee)
- CEL (Modules; NFC+ZigBee)
- Chipcon - TI (Chipsets)
- Cirronet-RFM (Modules-Industrial Applications)
- Crossbow (WSN, Environment Monitoring, motes)
- Digi (Radios, Routers, Energy Management)
- Duolog (Transceivers)
- Ember (Chipsets, HAN applications)
- EnergyHub (Smart Home)
- GreenPeak (WSN)
- Helicomm (Modules)
- Jennic (Chipsets-Modules)
- Freescale (Chipsets)
- Nuri Telecom (AMR Application)
- Oki (Chipsets)
- Open Peak (Power Management)
- Renesas (Platforms, AMR)
- Silicon Laboratories (Chipsets, Modules)
- Synapse (Module, Protocols)
- Telegesis (Integrator, Modules)
- TI (Chipsets)
4.0 IEEE 802.15.1 (Bluetooth)
- 4.1 Protocol Stack
- 4.1.2 Transport layer
- 4.1.2.1 Radio Layer
- 4.1.2.2 Baseband and Link Layers
- 4.1.3 Middleware Layer
- 4.2 Bluetooth Security
- 4.3 Highlights
- 4.4 Market
5.0 802.11n Technology
- 5.1 Advanced Technologies and IEEE 802.11n: MIMO and Others
- 5.1.1 General
- 5.1.2 MIMO
- 5.1.2.1 “True MIMO”
- 5.1.2.2 BeamFlex
- 5.1.2.3 Atheros
- 5.1.3 Spatial Multiplexing
- 5.1.4 OFDM
- 5.1.5 Channel Bonding
- 5.1.6 Packet Aggregation
- 5.2 Features
- 5.2.1 Specifics
- 5.2.2 Channel Bandwidth
- 5.3 Adaptation
- 5.4 Benefits and Applications
- 5.4.1 Benefits
- 5.4.2 Applications
- 5.5 Market
- 5.5.1 General: Drivers
- 5.5.2 Market Forecast
- 5.5.2.1 Model Assumptions
- 5.5.2.2 Forecast
- 5.5.2.2.1 Chipsets
- 5.5.2.2.2 Equipment
- 5.6 Industry
- Aerohive (AP)
- Aruba (AP)
- Asus (Router)
- Atheros (Chipsets; combo BT-802.1n)
- Buffalo (Router, AP)
- Belkin (Router, Adaptors)
- Broadcom (Chipsets; combo)
- Cisco (AP)
- Colubris-HP ProCurve (AP)
- CSR (Chips)
- D-Link (Router)
- Encore (Adapter)
- Edimax (Router, Adapter)
- Extreme (AP)
- Extricom (AP)
- Gemtek (Router)
- Intel (Chipsets)
- Linksys (Routers)
- Marvell (Chipsets)
- Meru (Family of Products)
- Metalink (Chipsets)
- Motorola (Tools, AP)
- NEC (Router)
- Netgear (Router, AP)
- RedPine (Chipsets)
- Ruckus (AP)
- Ralink (Chipsets)
- Product Line Brief
- Siemens (AP)
- SiGe (Chipsets)
- TopCom (Router)
- Trapeze (Controller)
- TrendNet (Routers, AP)
- ZyXel (AP, Router, Adapter)
6.0 Near Field Communications
- 6.1 General
- 6.2 Characteristics
- 6.3 Standards
- 6.3.1 General
- 6.3.2 ECMA (Near Field Communication Interface and Protocol (NFCIP-1)
- 6.3.3 ISO
- 6.3.4 NFC Forum
- 6.3.4.1 General
- 6.3.4.2 Specifications
- 6.3.4.3 Summary
- 6.3.5 Single Wire Protocol
- 6.3.6 NFC and ETSI
- 6.4 Security
- 6.5 Comparison
- 6.5.1 Bluetooth
- 6.5.2 RFID
- 6.6 Applications
- 6.6.1 General
- 6.6.2 Primary Users
- 6.6.3 Mobile Phone - Major Application
- 6.6.3.1 Example
- 6.6.3.2 Danger
- 6.6.4 WPAN Applications
- 6.6.5 Payment and Ticketing
- 6.6.6 Smart Poster
- 6.6.7 NFC and WiFi
- 6.6.8 NFC and UWB
- 6.6.9 Trials
- 6.7 NFC Market
- 6.7.1 General
- 6.7.2 Market Drivers
- 6.7.3 Estimate
- 6.8 Vendors
- Alvin
- Arygon
- Infineon
- Innovision
- Inside Contactless
- Legic
- Mocapay
- Motorola
- NEC
- Nokia
- Nexperts
- NXP
- OTI
- Reslink
- Sagem Orga
- Sony
- STmicroelectronics
- StolPan
- Toppan Forms
- Twinlinx
- UPM Raflatac
- Venyon
- VivoTech
- Wireless Dynamics
- Zenius
7.0 Conclusions
FIGURES:
- Figure 1: UWB Spectrum
- Figure 2: OFDM Frequency Segments
- Figure 3: DS-UWB Spectrum Characteristics
- Figure 4: Spectrum Regulations-UWB
- Figure 5: Spectrum Illustration
- Figure 6: Europe
- Figure 7: Japan and Korea
- Figure 8: Canada
- Figure 9: Market Estimate: UWB Circuitry ($B)
- Figure 10: Market Estimate: UWB IC Shipments (Unit M)
- Figure 11: Estimate of UWB Market - Communications Applications ($B)
- Figure 12: UWB IC-WSN-UGS Market Segment ($M)
- Figure 13: ZigBee Protocol Stack
- Figure 14: Profiles
- Figure 15: Estimate: ZigBee Modules Market Worldwide ($M)
- Figure 16: Estimate: ZigBee Modules Market Worldwide (M Units)
- Figure 17: ZigBee Market Segmentation (2009)
- Figure 18: ZigBee Market Segmentation (2013)
- Figure 19: Bluetooth Protocol Stack
- Figure 20: Piconets Illustration
- Figure 21: Global Bluetooth Revenue Market Forecast ($B)
- Figure 22: Two-antenna MIMO system with two-stream SDM example
- Figure 23: 802.11 Protocol Family MAC Frame Structure
- Figure 24: Addressable Market: Worldwide WiFi Chipsets Shipping (Unit M)
- Figure 25: Addressable Market: 802.11n Chipsets Worldwide Shipping (Unit M)
- Figure 26: Addressable Market: WiFi Chipsets Worldwide Shipping ($B)
- Figure 27: Addressable Market: 802.11n Chipsets Worldwide Shipping ($B)
- Figure 28: Market Geography: 802.11 Chipsets Production
- Figure 29: Addressable Market Estimate: 802.11n Equipment Shipping ($B)
- Figure 30: Addressable Market: 802.11n Equipment Sales (Unit M)
- Figure 31: Standardization
- Figure 32: NFC ECMA and ISO Standards
- Figure 33: ISO Protocols
- Figure 34: NFC Forum Activities
- Figure 35: Mobile Phone with NFC
- Figure 36: Cell Phones Addressable Market (Millions Units)
- Figure 37: Cell Phones and Accessories-Addressable market ($B)
- Figure 38: NFC-able Cell Phones: Addressable Market (Units Million)
- Figure 39: NFC-able Cell Phones: Addressable Market ($M)
- Figure 40: NFC-able Cell Phone Rate of Penetration
- Figure 41: NFC Electronics Market Estimate ($M)
- Figure 42: Market Estimate: UWB-NFC Electronics Sales ($M).
- Figure 43: NFC Market Geography
TABLES:
- Table 1: Comparison: DS-UWB and MB-OFDM
- Table 2: FCC Emission Limits
- Table 3: Comparison
- Table 4: UWB Applications: Summary
- Table 5: UWB Market Segments
- Table 6: ZigBee Parameters
- Table 7: ZigBee Smart Energy Profile Feature Set
- Table 8: BT Advanced Characteristics
- Table 9: Comparison of Different 802.11 Members Transfer Rates
- Table 10: 802.11n Advantages
- Table 11: NFC Features
- Table 12: NFC History
- Table 13: NFC Development
- Table 14: Bluetooth and NFC
- Table 15: NFC-based Payment Systems -Trials
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