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市場調查報告書

IC封裝的全球市場:2016年版

The Worldwide IC Packaging Market - 2016 Edition: The Most Comprehensive Report Available on the Global IC Packaging Industry

出版商 New Venture Research 商品編碼 275970
出版日期 內容資訊 英文 495 Pages
商品交期: 最快1-2個工作天內
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IC封裝的全球市場:2016年版 The Worldwide IC Packaging Market - 2016 Edition: The Most Comprehensive Report Available on the Global IC Packaging Industry
出版日期: 2016年11月28日 內容資訊: 英文 495 Pages
簡介

2015年的全球IC製造、出貨數估計約3800億,預計今後5年以超過4%的年複合成長率發展。

本報告提供全球IC封裝的市場調查,全世界的經濟環境和電子產業趨勢,各設備類型、包裝系列趨勢與市場規模的變化與預測,OSAT市場趨勢與策略分析,主要OSAT企業簡介等彙整資料。

第1章 簡介

第2章 摘要整理

第3章 經濟的展望、全球的情形

  • 電子產業的預測
  • 全球市場、半導體市場:概要
  • 不均等的經濟復甦
  • 全球GDP
  • 全球電子產品市場
  • 電子產業:預測摘要
    • 通訊市場
      • 蜂巢式終端設備
      • LAN
      • DSL、纜線數據機
      • 電信級設備
    • 電腦市場
      • PC
      • 平板電腦
      • 伺服器
      • 存儲系統
      • 螢幕
      • 印表機
    • 針對消費者產品市場
      • TV
      • 機上盒
      • 數位相機
      • 個人導航設備
    • 產業的產品市場
      • 流程控制
      • 檢驗、檢測
      • 其他
    • 醫療市場
      • 醫療診斷
      • 治療
      • 監測
      • 手術
    • 汽車市場
    • 民航、防衛、其他運輸市場

第4章 IC封裝市場分析:各半導體設備

  • 全球半導體設備市場
    • 整體市場預測
    • 各功能的預測
    • 各用途趨勢
  • IC市場預測:各地區
  • 市場預測:各設備類型
  • 電晶體
  • 處理器設備
    • MPU
    • MCU (4、8、16、32比特∼)
    • DSP
  • 記憶體設備
    • DRAM
    • SRAM
    • flash
    • ROM/EPROM
    • EEPROM
  • 邏輯裝置
    • 數位雙極的
    • 標準邏輯
    • 閘門陣列
    • 標準單元&PLD
    • 顯示器駕駛者&觸控螢幕控制器
    • 各種SPL
  • 類比設備
    • 放大器、比較儀
    • 介面
    • 電壓調整器、標準
    • 數據轉換器
    • 各種專用類比

第5章 IC封裝:概要、全球市場分析

  • 概要
  • IC包裝家庭
  • 全球IC封裝
  • IC封裝市場預測
    • IC封裝市場:各I/O點數
    • 包裝價格趨勢
  • IC包裝家庭的預測
    • TO包裝
    • DIP
    • SOT
    • SO
    • TSOP
    • CC
    • QFP
    • DFN
    • QFN
    • PGA
    • BGA
    • FBGA
    • WLP
    • DCA
  • 先進IC封裝
    • MCP (多晶片包裝)
    • FOWLP (Fan-Out Wafer-Level Package)
    • Multirow QFN 包裝
    • 覆晶連接
    • TSV連接

第6章 OSAT市場、策略分析

  • 半導體市場上外包
  • OSAT市場預測
    • 出貨數
    • 收益
    • 包裝ASP
  • OSAT市場領導

第7章 OSAT企業簡介

  • 3D Plus
  • ASE
  • Advotech
  • AIC Semiconductor
  • Amkor Technology
  • Anst China
  • Azimuth
  • Carsem
  • Chant World Technology
  • China Wafer Level CSP
  • ChipMOS
  • Cirtek
  • Connectec Japan
  • CORWIL Technology
  • Deca Technologies
  • FlipChip Int'l
  • Greatek Electronics
  • Hana Microelectronics
  • HANA Micron
  • I2A Technologies
  • J-Devices
  • Jiangsu Changjiang Electronics
  • Lingsen Precision
  • NANIUM
  • Nantong Fujitsu
  • Nepes Corp.
  • OSE
  • Powertech
  • Shinko Electric
  • Signetics Corp.
  • Sigurd
  • SPiL
  • SPEL
  • STATS ChipPAC
  • Tera Probe
  • Tianshui Huatian Tech
  • Unisem
  • UTAC
  • Vigilant Technology
  • Walton Advanced Eng.
  • Xintec

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目錄
Product Code: PKG16

Report Highlights

Industry Overview

  • Economic Overview
  • Semiconductor Industry Analysis

Worldwide IC Packaging Market Forecasts, 2014-2020

  • Units
  • Package Prices
  • Packaging Revenue
  • By Semiconductor Product
  • By Package Family
  • By I/O Range

OSAT IC Packaging Market Forecasts, 2014-2020

  • Units
  • Package Prices
  • Packaging Revenue
  • Competitive Rankings
  • Company Profiles

Synopsis

Integrated circuits are beyond question one of the most significant inventions of the 20th Century. Billions of ICs are manufactured every year, and are used in a vast range of products. In 2015, nearly 380 billion ICs were manufactured and shipped by semiconductor companies across the globe, and over the next five years, it is expected that the market will expand at a compounded annual growth rate of more than 4%.

At one time, the methods and technologies used to package and protect delicate integrated circuits were relatively simple. However, as IC devices themselves have become more powerful, the sophistication and complexity of IC packaging have also matured. Today, there are dozens of different types of packages in hundreds, even thousands of variations.

The Worldwide IC Packaging Market, 2016 Edition, a new report from New Venture Research (NVR) provides in-depth analysis of semiconductor devices and the IC packaging industry. Using extensively researched historical and current market trend data, the report examines the global IC packaging market, providing 5-year forecasts from a number of perspectives, including packaging type, I/O count, and application. Forecasts are provided for unit shipments, annual revenues and packaging pricing for 31 separate IC device types, as well as 14 major packaging categories comprised of 44 market segments. The report also includes an economic and major product overview of the global electronics industry, as well as a focused analysis of the Outsourced Semiconductor Assembly and Test (OSAT) industry segment.

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The report is divided into seven chapters. Following an Introductory chapter (Chapter 1) and an Executive Summary (Chapter 2), the report presents an Economic Outlook and Worldwide Electronics Industry Forecast (Chapter 3). In Chapter 4, the report dives deeply into an examination of each Semiconductor product type, with forecasts provided in terms of packaging types, applications and major world regions. This is followed in Chapter 5 with detailed analysis of each packaging market segment, with forecasts provided in terms of IC device types and I/O count. The chapter also provides an overview of advanced packaging products and technologies. (For a much deeper analysis of advanced IC packaging markets and technologies, check out the companion report, Advanced IC Packaging Technologies, Materials and Markets, 2016 Edition.)

Chapter 6 extends NVR's long-term coverage of the OSAT market, a significant and significantly growing segment of the overall semiconductor market sector. This market segment is well worth targeted consideration. Already by 2015, the market penetration of OSATs was more than 50% of the total IC packaging market, and its dollar share is expected to expand to nearly two-thirds by 2020. To help you further assess this specialized group of companies, profiles of 41 OSAT competitors are provided in Chapter 7.

The Worldwide IC Packaging Market, 2016 Edition, continues NVRs leadership position in measuring the current status and future development of IC packaging. This report is an effective and economical tool for any company interested in competing in the semiconductor industry, as an aid in assessing these markets and for gaining an advantage in potential areas for their own growth.

Jerry Watkins is an independent senior analyst with nearly 30 years of market research and consulting experience in the high-tech industry. He has worked for leading research companies such as Frost & Sullivan, Lucid Information Services, and NSI Research both in management and as a writer. Mr. Watkins has authored many syndicated reports, previously in the office automation and telecommunications sectors and more recently in the merchant embedded computing and IC packaging industries. He holds two university degrees, a B.A. in History, as well as a M.A. in International Studies, and has lived and worked in the heart of Silicon Valley for over half of his adult life.

Table of Contents

1: Introduction

2: Executive Summary

3: Economic Outlook and Worldwide

  • Electronics Industry Forecast
  • World and Semiconductor Overview
  • Not All Economies Recovering Equally; Unrest Remains
  • World GDP
  • Global Electronics Market
  • Electronics Industry Summary Forecast
    • Communications Markets, including: Cellular Handsets, LANs, DSL & Cable Modems, Carrier-class Equipment
    • Computers Markets, including: PCs, Tablets, Servers, Storage Systems, Monitors, Printers
    • Consumer Markets, including: TVs, Settop Boxes, Digital Cameras, Personal Navigation Devices
    • Industrial Markets, including: Process Control, Test & Measurements, Other Industrial
    • Medical Markets, including: Medical Diagnostics, Therapeutic, Monitoring & Surgical
    • Automotive Markets
    • Commercial Aviation, Defense and Other Transportation Markets

4: IC Packaging Market Analysis by Semiconductor Device

  • Worldwide Semiconductor Device Market
    • Total Market Forecasts
    • IC Function Forecasts
    • IC Application Trends
  • Covers: Consumer, Transportation, Computer Communications, Industrial & Other
  • IC Market Forecasts by Major World Regions
  • Market Forecasts by Device Type
  • Transistors
  • Processor Devices: MPUs, MCUs (4-bit, 8-bit, 16-bit, 32+-bit), DSPs
  • Memory Devices: DRAM, SRAM, Flash, ROM/EPROM, EEPROM
  • Logic Devices: Digital Bipolar, Standard Logic, Gate Arrays, Standard Cell & PLDs, Display Drivers & Touch Screen Controllers, Special Purpose Logic (Consumer, Computers, Communications, Automotive, Multipurpose & Other)
  • Analog Devices: Amplifiers & Comparators, Interfaces, Voltage Regulators & References, Data Converters, Application-Specific Analog (Consumer, Computers, Communications, Automotive, Industrial & Other)

5: IC Packaging Overview and Total Worldwide Market Analysis

  • Overview
  • IC Package Families
  • Worldwide IC Packaging
  • Total IC Packaging Market Forecasts
    • IC Packaging Market by I/O Count
    • Package Pricing Trends
  • IC Package Families Forecasts
    • Transistor Outline Packaging Markets
    • Dual In-Line Package Markets
    • Small Outline Transistor Market
    • Small Outline Markets
    • Thin Small Outline Package Markets
    • Chip Carrier Markets
    • Quad Flat Pack Markets
    • Dual Flat Pack No Lead Markets
    • Quad Flat Pack No Lead Markets
    • Pin Grid Array Package Markets
    • Ball Grid Array Package Markets
    • Fine-Pitch Ball Grid Array Package Markets
    • Wafer-Level Packaging Markets
    • Direct Chip Attach Markets
  • Advanced IC Packaging
    • Multichip Packages
    • Fan-Out Wafer-Level Package (FOWLP)
    • Multirow QFN Packages
    • Flip Chip Interconnection
    • Through-Silicon Via Interconnect Solutions

6: OSAT Market and Strategy Analysis

  • Outsourcing in the Semiconductor Market
  • OSAT Market Forecasts, including: Unit Shipments, Revenues, Package ASP
  • OSAT Market Leaders

7 OSAT Company Profiles

  • 3D Plus
  • ASE
  • Advotech
  • AIC Semiconductor
  • Amkor Technology
  • Anst China
  • Azimuth
  • Carsem
  • Chant World Technology
  • China Wafer Level CSP
  • ChipMOS
  • Cirtek
  • CONNECTEC Japan
  • CORWIL Technology
  • Deca Technologies
  • FlipChip Int'l
  • Greatek Electronics
  • Hana Microelectronics
  • HANA Micron
  • I2A Technologies
  • J-Devices
  • Jiangsu Changjiang Electronics
  • Lingsen Precision
  • NANIUM
  • Nantong Fujitsu
  • Nepes Corp.
  • OSE
  • Powertech
  • Shinko Electric
  • Signetics Corp.
  • Sigurd
  • SPiL
  • SPEL
  • STATS ChipPAC
  • Tera Probe
  • Tianshui Huatian Tech
  • Unisem
  • UTAC
  • Vigilant Technology
  • Walton Advanced Eng.
  • Xintec
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