The Worldwide IC Packaging Market - 2016 Edition: The Most Comprehensive Report Available on the Global IC Packaging Industry
|出版商||New Venture Research||商品編碼||275970|
|出版日期||內容資訊||英文 495 Pages
|IC封裝的全球市場:2016年版 The Worldwide IC Packaging Market - 2016 Edition: The Most Comprehensive Report Available on the Global IC Packaging Industry|
|出版日期: 2016年11月28日||內容資訊: 英文 495 Pages||
Integrated circuits are beyond question one of the most significant inventions of the 20th Century. Billions of ICs are manufactured every year, and are used in a vast range of products. In 2015, nearly 380 billion ICs were manufactured and shipped by semiconductor companies across the globe, and over the next five years, it is expected that the market will expand at a compounded annual growth rate of more than 4%.
At one time, the methods and technologies used to package and protect delicate integrated circuits were relatively simple. However, as IC devices themselves have become more powerful, the sophistication and complexity of IC packaging have also matured. Today, there are dozens of different types of packages in hundreds, even thousands of variations.
The Worldwide IC Packaging Market, 2016 Edition, a new report from New Venture Research (NVR) provides in-depth analysis of semiconductor devices and the IC packaging industry. Using extensively researched historical and current market trend data, the report examines the global IC packaging market, providing 5-year forecasts from a number of perspectives, including packaging type, I/O count, and application. Forecasts are provided for unit shipments, annual revenues and packaging pricing for 31 separate IC device types, as well as 14 major packaging categories comprised of 44 market segments. The report also includes an economic and major product overview of the global electronics industry, as well as a focused analysis of the Outsourced Semiconductor Assembly and Test (OSAT) industry segment.
The report is divided into seven chapters. Following an Introductory chapter (Chapter 1) and an Executive Summary (Chapter 2), the report presents an Economic Outlook and Worldwide Electronics Industry Forecast (Chapter 3). In Chapter 4, the report dives deeply into an examination of each Semiconductor product type, with forecasts provided in terms of packaging types, applications and major world regions. This is followed in Chapter 5 with detailed analysis of each packaging market segment, with forecasts provided in terms of IC device types and I/O count. The chapter also provides an overview of advanced packaging products and technologies. (For a much deeper analysis of advanced IC packaging markets and technologies, check out the companion report, Advanced IC Packaging Technologies, Materials and Markets, 2016 Edition.)
Chapter 6 extends NVR's long-term coverage of the OSAT market, a significant and significantly growing segment of the overall semiconductor market sector. This market segment is well worth targeted consideration. Already by 2015, the market penetration of OSATs was more than 50% of the total IC packaging market, and its dollar share is expected to expand to nearly two-thirds by 2020. To help you further assess this specialized group of companies, profiles of 41 OSAT competitors are provided in Chapter 7.
The Worldwide IC Packaging Market, 2016 Edition, continues NVRs leadership position in measuring the current status and future development of IC packaging. This report is an effective and economical tool for any company interested in competing in the semiconductor industry, as an aid in assessing these markets and for gaining an advantage in potential areas for their own growth.
Jerry Watkins is an independent senior analyst with nearly 30 years of market research and consulting experience in the high-tech industry. He has worked for leading research companies such as Frost & Sullivan, Lucid Information Services, and NSI Research both in management and as a writer. Mr. Watkins has authored many syndicated reports, previously in the office automation and telecommunications sectors and more recently in the merchant embedded computing and IC packaging industries. He holds two university degrees, a B.A. in History, as well as a M.A. in International Studies, and has lived and worked in the heart of Silicon Valley for over half of his adult life.