Abstract
A Strategic Report on the Latest Technologies in IC Packaging With
Forecasts of Key Markets
Report Coverage
- Stacked Packages
- Through Silicon Vias (TSV)
- System in Package (SiP)
- Fan-in QFN
- WLPs including Fan-out Style
- Interconnect and Bumping
- Substrates
- Wire Bonds
Report Highlights
- Technology Updates
- Research News
- New Products Introductions
- Industry Outlook
- End Markets/Applications
- Market Analysis and Forecasts, 2010 - 2015
Synopsis
Despite a global recession, the demand for handheld portable products remains
strong. To continue to meet the ever-increasing needs for higher bandwidth, IC
packaging technologies are continually being pushed to the limit. This report
details the advances in those limits.
New Venture Research (NVR) in its report, ‘Advanced IC
Packaging Technologies, Materials, and Markets, 2011 Edition’, uses
information from IC packaging industry insiders to present the most realistic
forecasts available regarding advanced IC packaging. Throughout the report,
the latest advanced packaging products, services, and research from numerous
companies and organizations are described.
Chapter 3, Stacked Packages, explains the basics of this critical
packaging technology, along with a sampling of the latest products. Forecasts
include units, prices, packaging revenue, package types, device types,
first-level interconnection, and applications.
Chapter 4, TSV Market (3D and 2.5D stacking) is covered in depth,
including various methods of connecting the devices, specific company
applications, and numerous examples of the latest new products and processes.
Unit projections are forecast and an examination of the markets which are
incorporating this technology first are included.
Chapter 5, System in Package (SiP) Solutions, presents information on
the evolving market for ICs combined with passive devices within a single
package. Forecasts include units, prices, packaging revenue, device types,
interconnection, and applications.
Chapter 6, Fan-in QFN Packages, examines the latest new product
introductions plus market forecasts for Fan-in QFN Packages. Forecasts include
units, prices, packaging revenue and applications.
Chapter 7, Wafer-Level Packages Including Fanout Style, explains the
latest new product introductions plus market forecasts for WLP by product,
pitch and re-configured wafer-level packages.
Chapter 8, Interconnection, Wire Bond, Flip Chip, and Bumping, contains
a review of first-level package interconnection. Revenue and unit forecasts of
wirebond and flip chip interconnection are provided for PGA, BGA, and FBGA
packages, plus wire bond material by wire width. Unit forecasts are provided
for total flip chip interconnection, both in package and as direct chip attach
(DCA), bump styles, and UBM processes.
Chapter 9, Substrates, presents the market, including an overview of
substrate types and materials, and highlights of recent developments in
substrates. Forecasts are provided for substrate units, area, and revenue by
package type and substrate material,and package pitch for PGA, BGA and FBGA.
Chapter 10, Mobile Applications for IC Devices, presents product
applications such as cellular handsets and infrastructure, tablets, set-top
boxes, DVD players/recorders, digital cameras/ camcorders, personal
navigation, audio products, notebook/ netbooks and PCs, servers and
workstations. Trends in advanced IC packaging are important to your business.
Advanced IC Packaging Technologies, Materials, and Markets - 2011 Edition will
provide you with an effective and economical tool for assessing the future of
this market.
About the Author
Sandra Winkler is the senior analyst for IC packaging at New Venture
Research (NVR). She began her analyst career as an independent consultant to
the telecommunications industry over 20 years ago. Since 1995, Ms. Winkler has
authored all of NVR's widely cited reports on IC packaging. She has spoken at
numerous industry conferences, writes columns for Chip Scale Review magazine
and contributes articles to the IEEE CPMT SCV Chapter Newsletter. Ms. Winkler
is a senior member of IEEE/CPMT and serves on the executive committee for the
IEEE-CPMT-SCV chapter where she is also the Program Co-Chair. She holds a MBA
from Santa Clara University.
About the NVR
New Venture Research Corp. (NVR) was established in 1988 to provide
advanced business research services for the high technology electronics
sector. Initially, the company's focus was on providing startup businesses
with market research and strategic planning consulting services since we were
located in Silicon Valley, California. Later, the company expanded into
providing business development and merger & acquisition services to large and
small as well as old and new firms.
Today, NVR is a global provider of business intelligence, growth management
and advisory services to companies in the information technology,
telecommunications, consumer, scientific instrumentation and advanced
electronics markets.
Table of Contents
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: Stacked Packages
- Types of Stacked Packages
- The Ins and Outs of Stacked Packages
- Interconnection
- Stacked Package as a Multicomponent Package
- Wafer Thinning
- End Markets and Application Trends
- New Product Introductions
- Stacked Package Forecasts
- Stacked Packages by Application
- End Markets for Stacked Packages
- Potential Markets
- Stacked Packages by Device Type
- Stacked Packages by Interconnection
Chapter 4: Through Silicon Via (TSV) Market
- Overview
- Creating the Vias
- Issues
- 3D Die-Stacking Technology Requirements
- 2.5D - Silicon Interposers and Microbumps
- Wafer-to-Wafer Bonding
- Die-to-Wafer Bonding
- Die-to-Die Bonding
- Via First, Middle, or Last Technology
- Via Etching and Filling
- Specific Company Applications
- Companies with TSV Designs
- New Product Highlights
- Advances in Test
- Moving Forward
- Industry Consortiums
- Market Potential
- Forecasts for 2.5D and 3D
Chapter 5: System in Package (SiP) Solutions
- Overview
- New Product Introductions/Highlights
- SiP Forecasts
- Summary
- SiPs by Application
- SiPs by Device Type
- SiPs by Interconnection
Chapter 6: Fan-in QFN Packages
- Overview
- New Product Introductions
- Market Forecasts
Chapter 7: Wafer-Level Packages including Fan-out
- WLPs
- Wafer-Level Package Overview
- New Product / Process Introductions
- Market Forecasts for WLP
- Forecasts by Product
- Forecasts by Pitch
- Forecasts of Fan-out WLP
Chapter 8: Interconnection, Wire Bond, Flip Chip and
- Bumping
- Interconnection Overview
- Wire Bonding
- Flip Chip
- TAB
- Wafer-Bumping and Process Overview
- Alternatives to Solder
- Product Highlights
- Flip Chip Applications
- Forecasts for:
- Interconnect by Package Units
- Wire Bond Package Units and Materials
- Flip Chip
- Flip Chip Bumps
- UBM Process Techniques
- Total Wire Bond and Flip Chip
Chapter 9: Substrates
- Overview
- Ceramic
- Laminate
- HDIS
- Flex Tape
- Embedded Passives
- Thermal Substrates
- Product Highlights
- Forecasts
- Units by Pitch
- Units, Area, Revenue by Package Family
- Units, Area, Revenue by Material
Chapter 10: State of the Industry and Applications for Mobile Devices
- Overview of Current Market Status
- Mobile Electronic Applications for IC device by Product Group
- Total IC for each Product Category
- Total IC Revenue
Partial List of Figures and Tables
- Dual-Die TSOP Stack
- STATS ChipPAC's PiP
- High Performance Stakpak
- DAG Process Steps
- Dice Before Grinding Method
- Die Thickness Relative Strength
- 8-Gigabit TSV DRAM Package Outline and Cross Section
- A Schematic Illustration Showing the CoW Bonding Process
- Micro-Bump and UMB Pad Structure
- Die Stack FBGA Packages, 2010-2015
- PoP Packages, 2010-2015
- PiP Packages, 2010-2015
- TSOP Stacked Packages, 2010-2015
- QFN Stacked Packages, 2010-2015
- MCM Stacked Packages
- Stacked WLPs, 2010 - 2015
- Stacked Package Assembly Revenue, 2010 - 2015
- Total ICs in Stacked Packages, 2010-2015
- Stacked ICs as a Percentage of Total ICs, 2010-2015
- Stacked Packaging Revenue as a Percentage of Total
- Packaging Revenue, 2010-2015
- Application Breakdown for Stacked Packages, 2010
- Cellular Handsets vs. Stacked Packages, 2010-2015
- Market for Various End Products Using Stacked Packages
- Total Memory Devices in FBGAs
- Total Memory Devices in WLPs
- Stacked Packages by Device Type
- Interconnection of Stacked Packages, 2010-2015
- SiPs, 2010-2015
- SiPs by Device Type, 2010-2015
- Interconnection of SiPs, 2010-2015
- Applications for SiPs, 2010
- QFN Interconnection Forecast, 2010-2015
- PGA Interconnection Forecast, 2010-2015
- BGA Interconnection Forecast, 2010-2015
- FBGA Interconnection Forecast, 2010-2015
- Total Flip Chip Forecast, 2010-2015
- Flip Chip Bump Styles, 2010-2015
- UBM Process, 2010-2015
- Bump Composition Units, 2010-2015
- Devices in QFN Packages
- Array QFN Forecast, 2010-2015
The latest advanced packaging products, services, and research of the
following companies and organizations are interspersed throughout the report:
- Amkor Technology
- Avago Technologies
- Brewer Science
- Cadence Design Systems
- Dow Chemical
- Elpida Memory
- Endicott Interconnect Technologies
- EPWorks
- FlipChip International
- Fraunhofer Institute for Reliability and Microintegration
- Fujikura Ltd.
- Georgia Institute of Technology, 3D Systems Packaging Center
- IBM Corp.
- IBM T.J. Watson Research Center
- Imec
- Infineon Technologies
- ITRI
- KSG Leiterplatten
- Mentor Graphics
- Micron Technology
- Micro Systems Engineering
- NAMICS
- Nanium
- Nokia Japan
- Pac Tech Packing Technologies
- Powertech Technology
- Renesas Electronics Corp.
- Rochester Institute of Technology
- Samsung
- Sandia National Laboratory
- SphereTek
- SPTS, SPP Process Technology Systems
- STATS ChipPAC
- STMicroelectronics
- Sumitomo Bakelite
- SunRay Scientific
- Suss MicroTec
- Technical University Berlin
- Texas Instruments
- Tokyo Ohka Kogyo
- University Erlangen-Nuremberg, Institute for Manufacturing Automation and
Production Systems
- UTAC
- Wacker
- Xilinx
- Zymet
