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市場調查報告書

未來的有機電子製造

The Future of Organic Electronics Manufacturing

出版商 NanoMarkets
出版日期 2009年01月 商品編碼 66966
內容資訊 英文 115 Pages
價格
US $ 995 PDF By E-mail - Advanced User License (5 users)
US $ 1495 PDF By E-mail - Group Version (10 users)
US $ 1795 PDF By E-mail - Enterprise Version (Company Wide)


未來的有機電子製造 是由出版商NanoMarkets在2009年01月所出版的。 這份英文市場調查報告書包含115 Pages 價格從美金995起跳。

簡介

未來的有機電子製造

本報告書內容包括:有機電子企業的各種製造技術分析、從聚合物記憶體等新興領域到有機EL等既有產品等的介紹、傳統工廠面臨的課題、未來5年的預測等。內容綱要摘要如下:

實施概要

  • 有機製造方法摘要
  • 設備製造商的機會
  • 材料供應商的機會
  • 主要設備供應商
  • 有機電子的能力預測摘要

第1章 介紹

  • 本書的背景
  • 本書的目的及範圍
  • 調查方法
  • 架構

第2章 有機電子的主要製造動向

  • 有機電子現在及未來的製造技術
    • 傳統及新型蒸鍍技術
    • 印刷
    • 微影技術
    • 其他相關技術
    • 結晶化
  • 產品分類別製造要件
    • 有機EL
    • 有機薄膜電晶體
    • 有機太陽電池
    • 有機光檢測器
  • 提昇穩定性
  • 本章的重點

第3章 有機電子製造技術

  • 介紹
  • 有機EL
  • OTFT
  • 太陽電池
  • 光檢測器及感應器
  • 特殊材料
  • 設備
  • 本章的重點

第4章 有機半導體設備能力預測

  • 介紹及預測方法
  • 設備別8年能力預測
  • 設備別8年設備預測
  • 製造設備別8年能力預測

圖表

目錄

Abstract

This report examines the evolving set of printing and deposition technologies that are being redesigned for an organic electronics environment; ink-jet and organic vapor deposition, for example. It also analyzes the various manufacturing technologies that organic electronics firms are utilizing now and how well they are performing. Its product coverage ranges from emerging areas such as polymer memories to relatively established areas such as OLEDs, and it is especially focused on how the lessons in the established OLED plants are being extended to organic electronics more generally. A five-year capacity forecast is included in this report that is based on breakouts by type of manufacturing technology utilized and the type of device manufactured. We also profile the activities of firms and research groups that have developed novel equipment to meet the thermal and environmental needs of organic electronics materials.

Table of Contents

Executive Summary

  • E.1 Summary of Organic Manufacturing Methods
    • E.1.1 Printing vs. Blanket Deposition
    • E.1.2 Major Deposition Methods
    • E.1.3 Major Device Categories and Requirements
  • E.2 Opportunities for Equipment Producers
  • E.3 Opportunities for Materials Suppliers
  • E.4 Major Equipment Suppliers
  • E.5 Summary of Capacity Forecasts for Organic Electronics

Chapter One: Introduction

  • 1.1 Background to this Report
    • 1.1.1 Perspective #1: Availability of Equipment
    • 1.1.2 Perspective #2: Availability of Materials
    • 1.1.3 Perspective #3: Device and Process Readiness
    • 1.1.4 Perspective #4: Market Readiness
  • 1.2 Objectives and Scope
  • 1.3 Methodology
  • 1.4 Plan of this Report

Chapter Two: Key Manufacturing Trends in Organic Electronics

  • 2.1 Current and Future Manufacturing Technologies for Organic Electronics
    • 2.1.1 Classical and Novel Vapor Deposition Techniques
    • 2.1.2 Printing
    • 2.1.3 Patterning Techniques
    • 2.1.4 Other Relevant Techniques
    • 2.1.5 Note on Crystallinity
  • 2.2 Manufacturing Requirements by Product Category
    • 2.2.1 OLED
    • 2.2.2 Organic Thin Film Transistors
    • 2.2.3 Organic Photovoltaics
    • 2.2.4 Organic Photodetectors
  • 2.3 Enhancement of Stability
  • 2.4 Key Points Made in This Chapter

Chapter Three: Organic Electronics Manufacturing Technologies

  • 3.1 Introduction
  • 3.2 OLEDs
    • 3.2.1 Evaporated Small Molecule (Kodak and UDC)
    • 3.2.2 Small Molecule Solution Processing (DuPont)
    • 3.2.3 Printed Polymer (CDT/Sumitomo)
    • 3.2.4 Roll-to-Roll Polymer (GE)
    • 3.2.5 Market Context, Competition
  • 3.3 OTFT
    • 3.3.1 Pentacene-OLED Backplane (Sony)
    • 3.3.2 Pentacene-E-Paper Backplane (Polymer Vision)
    • 3.3.3 Printed Polymer-E Paper Backplane (Plastic Logic)
    • 3.3.4 Printed Organic RFID Chips (PolyIC, IMEC)
    • 3.3.5 Other Processes (Infineon, 3M, ORFID, etc.)
    • 3.3.6 Notes on Stability
    • 3.3.7 Competitors to OTFTs by Target Market Application
  • 3.4 Solar Cells
    • 3.4.1 Printed Bulk Heterojunction (Konarka)
    • 3.4.2 Transparent Cell Technology (Solarmer)
    • 3.4.3 Printed Dye Solar Cells (G24i)
    • 3.4.4 Market Risk and Competitors
  • 3.5 Photodetectors and Sensors
    • 3.5.1 X-Ray Detector (Siemens)
    • 3.5.2 Printed Biodetector (NANOIDENT)
    • 3.5.3 PARC
    • 3.6 Specialized Materials
    • 3.6.1 Substrates
    • 3.6.2 Semiconductors
    • 3.6.3 Barrier Materials
  • 3.7 Equipment
    • 3.7.1 Generic Equipment
    • 3.7.2 Printers
  • 3.8 Key Points Made in this Chapter

Chapter Four: Organic Semiconductor-Based Device Capacity Forecasts

  • 4.1 Introduction and Forecasting Methodology
    • 4.1.1 Forecasting Capacity
    • 4.1.2 Forecasting Equipment
    • 4.1.3 Changes from Previous NanoMarkets Reports
    • 4.1.4 Data Sources
  • 4.2 Eight-year Capacity Forecasts by Type of Device Produced
    • 4.2.1 Organic Light Emitting Diodes (OLEDs)
    • 4.2.2 Organic Thin-Film Transistors (OTFTs)
    • 4.2.3 Organic Photovoltaics (OPVs)
    • 4.2.4 Organic Photodetectors and Sensors (OPDs)
  • 4.3 Eight-year Equipment Forecasts by Type of Device Produced
    • 4.3.1 Methodology
    • 4.3.2 OLED
    • 4.3.3 OTFT
    • 4.3.4 OPV
    • 4.3.5 OPD
  • 4.4 Eight-year Capacity Forecasts by Type of Manufacturing Equipment Used
  • Abbreviations and Acronyms Used in This Report

List of Exhibits

  • Exhibit E-1: Worldwide Organic Manufacturing Capacity (million sq.meters/yr)
  • Exhibit E-2: Worldwide Organic Manufacturing Equipment Outlay ($ millions/yr)
  • Exhibit 4-1: Worldwide OLED Capacity
  • Exhibit 4-2: Worldwide Capacity for OTFT-Based Backplanes
  • Exhibit 4-3: Worldwide Capacity for OTFT-Based RFID
  • Exhibit 4-4: Worldwide Capacity for OTFT-Based Backplanes and RFID
  • Exhibit 4-5: Worldwide Capacity for OPV- and DSC- Based Solar
  • Exhibit 4-6: Worldwide OPD Device Capacity
  • Exhibit 4-7: OLED Display Process Comparison*
  • Exhibit 4-8: Unit Operations Capacity Costs (US$ per square meter per year annual capacity)
  • Exhibit 4-9: Capacity Demand for Benchmark Devices by Unit Operation
  • Exhibit 4-10: Equipment Costs by Device (US$ per square meter per annual capacity)
  • Exhibit 4-11: OLED Display Capital Expenditure
  • Exhibit 4-12: OLED Lighting Capital Expenditure
  • Exhibit 4-13: OTFT-based Backplanes Capital Expenditure
  • Exhibit 4-14: OTFT-based RFID Capital Expenditure
  • Exhibit 4-15: Worldwide OPV and DSC Capital Expenditure
  • Exhibit 4-16: Worldwide Capacity by Equipment Type (Millions m2/yr)
  • Exhibit 4-17: Worldwide Capital Expenditure by Equipment Type ($ Millions/yr)
  • Exhibit 4-18: Worldwide Organic Manufacturing Capacity (million square meters/yr)
  • Exhibit 4-19: Worldwide Organic Manufacturing Equipment Outlay ($ millions/yr)
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