Cover Image
市場調查報告書

全球覆晶技術市場趨勢與預測:各晶圓凸塊流程(銅柱,錫鉛共晶焊料,無鉛焊料,金柱形凸塊),包裝流程,產品,用途,地區(2017年∼2022年)

Global Flip Chip Technology Market - By Wafer Bumping Process (Copper Pillar, Tin Lead Eutectic Solder, Lead Free Solder, Gold Stud Bumping), Packaging Process, Products, Application, Geography, Trends, Forecast - (2017 - 2022)

出版商 Mordor Intelligence LLP 商品編碼 547020
出版日期 內容資訊 英文 104 Pages
商品交期: 最快1-2個工作天內
價格
Back to Top
全球覆晶技術市場趨勢與預測:各晶圓凸塊流程(銅柱,錫鉛共晶焊料,無鉛焊料,金柱形凸塊),包裝流程,產品,用途,地區(2017年∼2022年) Global Flip Chip Technology Market - By Wafer Bumping Process (Copper Pillar, Tin Lead Eutectic Solder, Lead Free Solder, Gold Stud Bumping), Packaging Process, Products, Application, Geography, Trends, Forecast - (2017 - 2022)
出版日期: 2017年01月24日 內容資訊: 英文 104 Pages
簡介

全球覆晶技術市場,2016年價值達到201億9000萬美元,預計從2017年到2022年以7.56%的年複合成長率成長到312億6000萬美元。覆晶的小型化和出色的性能,I/O彈性等特性對這個市場急速成長有所貢獻。

本報告提供全球覆晶技術市場相關調查,市場概要,各晶圓傾銷流程、包裝流程、產品、用途、地區的市場趨勢,市場規模的變化與預測,市場成長、阻礙因素分析,市場佔有率,競爭情形,主要企業的簡介等,全面的資訊。

目錄

第1章 簡介

  • 調查成果
  • 市場定義
  • 市場規模

第2章 調查方法

  • 簡介
  • 調查手法

第3章 摘要整理

第4章 市場概要

  • 目前市場方案
  • 市場成長要素
    • 高包裝密度
    • 整合的容易度
  • 市場阻礙因素
  • 產業魅力 - 波特的五力分析
    • 供應商談判力
    • 消費者談判力
    • 新加入廠商的威脅
    • 替代產品及服務的威脅
    • 產業內的競爭
  • 產業價值鏈分析

第5章 市場區隔

第6章 全球覆晶技術市場:各晶圓凸塊流程

  • 銅柱
  • 錫鉛共晶焊料(Sn-Pb共晶焊料)
  • 無鉛焊料
  • 焊接金凸塊

第7章 全球覆晶技術市場:各包裝流程

  • 2D IC
  • 2.5D IC
  • 3D IC

第8章 全球覆晶技術市場:各產品

  • 記憶體
  • 高亮度發光二極體(LED)
  • RFIC,電源IC,類比IC
  • 成像
  • 2D邏輯SoC(System on a Chip)

第9章 全球覆晶技術市場:各用途

  • 醫療設備
  • 產業
  • 汽車
  • 圖形 處理 單位 & 晶片組
  • 智慧科技
  • 機器人技術
  • 電子設備

第10章 全球覆晶技術市場:各地區

  • 北美
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 西班牙
    • 義大利
    • 其他
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 澳洲
    • 印尼
    • 馬來西亞
    • 新加坡
    • 韓國
    • 其他
  • 中東、非洲
  • 南美

第11章 競爭分析 - 企業簡介

  • Amkor Technology
  • IBM Corp.
  • Intel Corp.
  • Taiwan Semiconductor Manufacturing Co.
  • Samsung Electronics Co. Ltd.
  • Texas Instruments Inc.
  • Global Foundries U.S Inc.
  • Stats Chippac Ltd.
  • NEPES PTE. LTD
  • Powertech Technology

第12章 競爭情形

  • 市場佔有率分析
  • 開發趨勢分析
  • 投資機會

第13章 覆晶技術的未來展望

目錄

Market Insights

The global flip chip technology packaging market estimated at USD 20.19 billion in 2016 is projected to reach USD 31.26 billion by 2022, at a CAGR of 7.56% during the forecast period 2017-2022. The rapid growth of this market is propelled by its numerous advantages like smaller-size, higher-performance, and greatest I/O flexibility over the competitive methodologies.

Market Dynamics

The major driving forces of the flip chip technology market have been the developments in the packaging of electronics like improving performance, maintaining high packaging density and increasing the reliability of circuits. However, the high cost associated with the implementation of the flip chip technology is impeding the growth of the market.

Market Segmentation

The global flip chip technology market can be segmented by the wafer bumping process (copper pillar, tin-lead eutectic solder, lead-free solder, gold stud bumping); by packaging process (2D IC, 2.5D IC, 3D IC), by products (memory, high brightness light-emitting diode, RF, power and analog Ics, imaging and 2D logic sol); by application (medical devices, industrial application, automotive, GPUs and chipsets, smart technologies and electronic devices) and by geography.

Key Market Players

The report also considers key trends that will impact the industry and profiles of leading companies with majority shares in the global flip chip technology market, such as:

Amkor Technology

IBM Corp.

Taiwan Semiconductor Manufacturing Co.

Intel Corp.

Samsung Electronics Co. Ltd.

Texas Instruments Inc.

Global Foundries U.S Inc.

Stats Chippac Ltd.

Nepes Pte. Ltd.

Powertech Technology

Report Offerings

Market definition for global flip chip market along with identification of key drivers and restraints for the market.

Market analysis for the global flip chip market, with region specific assessments and competition analysis on a global and regional scale.

Identification of factors instrumental in changing the market scenarios, rising prospective opportunities and identification of key companies which can influence the market on global and regional scales.

Extensively researched competitive landscape section with profiles of major companies along with their strategic initiatives and market shares.

Identification and analysis of the macro and micro factors that affect the global flip chip market on both global and regional scales.

A comprehensive list of key market players along with the analysis of their current strategic interests and key financial information.

Table of Contents

1. Introduction

  • 1.1 Study Deliverables
  • 1.2 Market Definition
  • 1.3 Market Scope

2. Research Methodology

  • 2.1 Introduction
  • 2.2 Analysis Methodology

3. Executive Summary

4. Market Overview

  • 4.1 Current Market Scenario
  • 4.2 Market Drivers
    • 4.2.1 High Packaging Density
    • 4.2.2 Ease of Integration
  • 4.3 Market Restraints
  • 4.4 Industry Attractiveness- Porter's Five Forces
    • 4.4.1 Bargaining Power of Suppliers
    • 4.4.2 Bargaining Power of Consumers
    • 4.4.3 Threat of New Entrants
    • 4.4.4 Threat of Substitute Products and Services
    • 4.4.5 Competitive Rivalry within the Industry
  • 4.5 Industry Value Chain Analysis

5. Market Segmentation

6. By Wafer Bumping Process

  • 6.1 Copper Pillar
  • 6.2 Tin-Lead Eutectic Solder (Sn-Pb Eutectic Solder)
  • 6.3 Lead Free Solder
  • 6.4 Gold Stud Bumping

7. By Packaging Process

  • 7.1 2D IC
  • 7.2 2.5D IC
  • 7.3 3D IC

8. By Products

  • 8.1 Memory
  • 8.2 High Brightness, Light-Emitting Diode (LED)
  • 8.3 RF, Power and Analog Ics
  • 8.4 Imaging
  • 8.5 2D Logic Soc

9. By Application

  • 9.1 Medical Devices
  • 9.2 Industrial Applications
  • 9.3 Automotive
  • 9.4 GPUs and Chipsets
  • 9.5 Smart Technologies
  • 9.6 Robotics
  • 9.7 Electronic Devices

10. By Geography

  • 10.1 North America
    • 10.1.1 US
    • 10.1.2 Canada
  • 10.2 Europe
    • 10.2.1 Germany
    • 10.2.2 UK
    • 10.2.3 France
    • 10.2.4 Spain
    • 10.2.5 Italy
    • 10.2.6 Others
  • 10.3 Asia-Pacific
    • 10.3.1 China
    • 10.3.2 Japan
    • 10.3.3 India
    • 10.3.4 Australia
    • 10.3.5 Indonesia
    • 10.3.6 Malaysia
    • 10.3.7 Singapore
    • 10.3.8 South Korea
    • 10.3.9 Others
  • 10.4 Middle East & Africa
  • 10.5 Latin America

11. Competitive Analysis - Company Profiles

  • 11.1 Amkor Technology
  • 11.2 IBM Corp.
  • 11.3 Intel Corp.
  • 11.4 Taiwan Semiconductor Manufacturing Co.
  • 11.5 Samsung Electronics Co. Ltd.
  • 11.6 Texas Instruments Inc.
  • 11.7 Global Foundries U.S Inc.
  • 11.8 Stats Chippac Ltd.
  • 11.9 NEPES PTE. LTD.
  • 11.10 Powertech Technology

12. Competitive Landscape

  • 12.1 Market Share Analysis
  • 12.2 Analysis of Development Trends
  • 12.3 Oppurtunities for Investments in Flip Chip Technology

13. Future of the Flip Chip Technology

Back to Top