Global Flip Chip Technology Market - By Wafer Bumping Process (Copper Pillar, Tin Lead Eutectic Solder, Lead Free Solder, Gold Stud Bumping), Packaging Process, Products, Application, Geography, Trends, Forecast - (2017 - 2022)
|出版商||Mordor Intelligence LLP||商品編碼||547020|
|出版日期||內容資訊||英文 104 Pages
|全球覆晶技術市場趨勢與預測:各晶圓凸塊流程(銅柱，錫鉛共晶焊料，無鉛焊料，金柱形凸塊)，包裝流程，產品，用途，地區(2017年∼2022年) Global Flip Chip Technology Market - By Wafer Bumping Process (Copper Pillar, Tin Lead Eutectic Solder, Lead Free Solder, Gold Stud Bumping), Packaging Process, Products, Application, Geography, Trends, Forecast - (2017 - 2022)|
|出版日期: 2017年01月24日||內容資訊: 英文 104 Pages||
The global flip chip technology packaging market estimated at USD 20.19 billion in 2016 is projected to reach USD 31.26 billion by 2022, at a CAGR of 7.56% during the forecast period 2017-2022. The rapid growth of this market is propelled by its numerous advantages like smaller-size, higher-performance, and greatest I/O flexibility over the competitive methodologies.
The major driving forces of the flip chip technology market have been the developments in the packaging of electronics like improving performance, maintaining high packaging density and increasing the reliability of circuits. However, the high cost associated with the implementation of the flip chip technology is impeding the growth of the market.
The global flip chip technology market can be segmented by the wafer bumping process (copper pillar, tin-lead eutectic solder, lead-free solder, gold stud bumping); by packaging process (2D IC, 2.5D IC, 3D IC), by products (memory, high brightness light-emitting diode, RF, power and analog Ics, imaging and 2D logic sol); by application (medical devices, industrial application, automotive, GPUs and chipsets, smart technologies and electronic devices) and by geography.
Key Market Players
The report also considers key trends that will impact the industry and profiles of leading companies with majority shares in the global flip chip technology market, such as:
Taiwan Semiconductor Manufacturing Co.
Samsung Electronics Co. Ltd.
Texas Instruments Inc.
Global Foundries U.S Inc.
Stats Chippac Ltd.
Nepes Pte. Ltd.
Market definition for global flip chip market along with identification of key drivers and restraints for the market.
Market analysis for the global flip chip market, with region specific assessments and competition analysis on a global and regional scale.
Identification of factors instrumental in changing the market scenarios, rising prospective opportunities and identification of key companies which can influence the market on global and regional scales.
Extensively researched competitive landscape section with profiles of major companies along with their strategic initiatives and market shares.
Identification and analysis of the macro and micro factors that affect the global flip chip market on both global and regional scales.
A comprehensive list of key market players along with the analysis of their current strategic interests and key financial information.