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市場調查報告書

智慧包裝的全球市場:市場規模,未來預測,趨勢

Global Smart Packaging Market - by active packaging type (gas scavenger, moisture control, corrosion inhibitors), by intelligent packaging type (Sensors and indicators,) by appplication vertical, by geography, trends, forecast - (2017 - 2022)

出版商 Mordor Intelligence LLP 商品編碼 394605
出版日期 內容資訊 英文 138 Pages
商品交期: 最快1-2個工作天內
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智慧包裝的全球市場:市場規模,未來預測,趨勢 Global Smart Packaging Market - by active packaging type (gas scavenger, moisture control, corrosion inhibitors), by intelligent packaging type (Sensors and indicators,) by appplication vertical, by geography, trends, forecast - (2017 - 2022)
出版日期: 2017年01月15日 內容資訊: 英文 138 Pages
簡介

本報告提供全球智慧包裝的市場相關分析,提供技術·產品概要和市場基本結構,主要的推動及阻礙市場要素,各技術 (活性/智慧型包裝)·各用途·各地區的趨勢預測,最新的市場競爭趨勢,主要企業簡介 (概要·財務狀況·策略目標等),今後的市場成長機會等調查。

第1章 簡介

第2章 分析方法

第3章 摘要整理

第4章 市場概要

  • 市場動態
  • 推動市場要素
  • 阻礙市場要素
  • 產業的向心力:波特的五力分析
  • 市場機會

第5章 全球智慧·包裝市場:各技術的市場區隔

  • 活性·包裝
    • 氣體排放
    • 濕度控制
    • 避免碰撞
  • 智慧型·包裝
    • 感測器·顯示燈

第6章 全球智慧·包裝市場:各用途

  • 食品·飲料
  • 汽車
  • 醫療
  • 個人保養用品
  • 其他

第7章 全球智慧·包裝市場:各地區

  • 北美 (美國,加拿大)
  • 歐洲 (法國,英國等)
  • 亞太地區 (印度,中國,日本等)
  • 南美 (巴西)
  • 中東·非洲

第8章 主要供應商簡介

  • American Thermal Instruments
  • BASF
  • Avery Dennison
  • 3M
  • Temptime Corporation
  • Thin Film electronics ASA
  • Smartrac N.V.

第9章 競爭環境

  • 發展趨勢分析
  • 行銷·流通管道

第10章 今後的投資機會預測

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目錄

Market Insights

The Global Smart packaging market is valued at USD 31.94 billion in 2016 and is expected to reach a value of USD 41.64 billion by the end of 2022, growing at a projected CAGR of 4.52% during the forecast period of 2017 - 2022. With research showing that at least 30% of the total food production of around four billion tons going to waste around the world, the demand for appropriate packaging to increase the shelf life of products is increasing. There are two different types of smart packaging, active packaging, which includes the interaction of the packaging with the product and intelligent packaging, which adds extra functionality to the packaging with RFID sensors, LED displays, electronic microphones to convey important information regarding the product.

Market Dynamics

The drivers of the smart packaging market are the wide range of applications it provides, time-temperature indicators to identify ideal conditions for storage, freshness indicators, temperature sensors, RFID tags, thermochromic displays etc. With the rising number of geriatric population, rapid expansion of the healthcare industry, and the need for safe and properly packaged products, the growth of this market is inevitable. However, the cost of applying smart packaging techniques to the packaging industry could impede this industry.

The Active and Intelligent Packaging Industry Association (AIPIA) made up of leading companies in the packaging market have set focus on reducing food waste, and investment in R&D to find cost-effective and efficient ways to integrate smart technology in packaging. Market research indicates, that the US has the highest market share and it is predicted that the North American region shall lead the market propelled by rapid advances in newer and emerging technologies, such as quick, mobile marketing codes and printed electronics on packaging.

Market Segmentation

The global smart packaging market has been segmented by technology (gas scavenger, moisture control, corrosion inhibitors, indicators); application vertical (food & beverages, automotive, healthcare, personal care and others), and by geography.

Key Market Players

The report also considers key trends that shall impact the industry and profiles of leading companies with majority market share. Some of the top companies mentioned in the report are:

American Thermal Instruments

BASF

Avery Dennison

3M (Minnesota Mining and Manufacturing Company)

TempTime Corporation

Thin Film Electronics ASA

Smartrac N.V.

Report Offerings

Market definition for global smart packaging market along with identification of key drivers and restraints for the market.

Market analysis for the global smart packaging market, with region specific assessments and competition analysis on a global and regional scale.

Identification of factors instrumental in changing the market scenarios, rising prospective opportunities and identification of key companies which can influence the market on a global and regional scale.

Extensively researched competitive landscape section with profiles of major companies along with their strategic initiatives and market shares.

Identification and analysis of the macro and micro factors that affect the global smart packaging market on both global and regional scales.

A comprehensive list of key market players along with the analysis of their current strategic interests and key financial information.

Table of Contents

1. Introduction

  • 1.1 Study Deliverables
  • 1.2 Market Definition
  • 1.3 Market Scope

2. Research Methodology

  • 2.1 Introduction
  • 2.2 Analysis Methodology

3. Executive Summary

4. Market Overview

  • 4.1 Market Dynamics
  • 4.2 Market Drivers
  • 4.3 Market Restraints
  • 4.4 Industry Attractiveness - Porter's Five Forces
    • 4.4.1 Bargaining Power of Suppliers
    • 4.4.2 Bargaining Power of Consumers
    • 4.4.3 Threat of New Entrants
    • 4.4.4 Threat of Substitute Products
    • 4.4.5 Competitive Rivalry within the Industry
  • 4.5 Market Opportunities

5. Global Smart Packaging Market Segmentation - By Technology

  • 5.1 Active Packaging
    • 5.1.1 Gas Scavenger
    • 5.1.2 Moisture Control
    • 5.1.3 Corrosion Inhibitors
  • 5.2 Intelligent Packaging
    • 5.2.1 Sensors and Indicators

6. Global Smart Packaging Market Segmentation - By Application Vertical

  • 6.1 Food and Beverages
  • 6.2 Automotive
  • 6.3 Healthcare
  • 6.4 Personal Care
  • 6.5 Others

7. Global Smart Packaging Market Segmentation - By Geography

  • 7.1 North America
    • 7.1.1 US
    • 7.1.2 Others
  • 7.2 Europe
    • 7.2.1 France
    • 7.2.2 UK
    • 7.2.3 Others
  • 7.3 Asia-Pacific
    • 7.3.1 India
    • 7.3.2 China
    • 7.3.3 Japan
    • 7.3.4 Others
  • 7.4 Latin America
    • 7.4.1 Brazil
  • 7.5 Middle East & Africa

8. Key Vendor Profiles

  • 8.1 American Thermal Instruments
  • 8.2 BASF
  • 8.3 Avery Dennison
  • 8.4 3M
  • 8.5 Temptime Corporation
  • 8.6 Thin Film electronics ASA
  • 8.7 Smartrac N.V.

9. Competitive Landscape

  • 9.1 Analysis of Development Trends
  • 9.2 Marketing Channels

10. Future Outlook for Investment Opportunity

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