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市場調查報告書
商品編碼
1432346

混合儲存立方體：市場佔有率分析、產業趨勢、成長預測（2024-2029）

Hybrid Memory Cube - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

混合儲存立方體（HMC）市場規模預計到2024年為14.5億美元，到2029年達到29.2億美元，在預測期內（2024-2029年）複合年成長率為15.11%。

混合儲存立方體市場

混合記憶體立方體是一項突破性技術，代表著目前記憶體架構的模式轉移。

主要亮點

  • 推動混合儲存立方體（HMC）市場擴張的關鍵因素是伺服器群和員工數量的增加、商業設備出貨的增加、創投庫存以及消費硬體領域組裝活動的增加。由於對高頻寬的需求不斷增加、人工智慧的使用增加以及電子設備小型化的趨勢等因素，HMC和HBM市場正在擴大。
  • HMC 正在透過實現可取代傳統 DRAM 系統的進步來重新定義記憶體。 HMC 正在記憶體市場制定新標準，與現有系統（例如 CPU）所達到的計算速度相符。
  • HMC 打破了記憶體障礙並顯著提高了頻寬和效能。 HMC 的架構比目前記憶體架構的效率顯著提高，每位元能耗比目前 DRAM 技術低 70%。
  • 對行動性的不斷成長的需求以及雲端服務日益成長的影響力預計將進一步增加對 HMC 解決方案的需求。這是因為 HMC 的高頻寬提高了網路系統的效能以匹配線路速度。
  • COVID-19大流行影響了全球工業部門，2020年全球經濟受到負面影響。半導體、消費性電子、旅遊、汽車等眾多產業受到疫情的嚴重影響，對混合儲存立方體市場產生了負面影響。

混合儲存立方體市場趨勢

網路和通訊產業預計將錄得顯著成長

  • 全球通訊產業正在經歷基礎設施向寬頻和行動技術發展的持續轉型。
  • 混合記憶體立方體擴大用於高效能運算 (HPC)。 HPC 可以指一組分散式和平行化技術，用於連接計算單元以更快地執行更複雜的任務。
  • 邊緣運算網路和通訊技術支援透過連接的分散式通訊設備進行長距離資訊傳輸。
  • 資訊傳輸、交換、處理、分析和搜尋方面的快速技術創新對於各種新興通訊技術的成功至關重要，這可能會間接影響預測期內 HMC 市場的成長。 5G的出現預計將提振HMC市場。

亞太地區預估複合年成長率最快

  • 由於消費群和資料流量不斷成長，該地區的零售、醫療保健和 IT/通訊行業需要先進、高速的資料處理系統。此外，中國希望在通訊、物聯網、巨量資料和雲端運算等應用領域建立世界一流的IC設計單位，這有望進一步提振HMC市場。
  • 連網型設備產生的大量資料以及巨量資料應用的出現給資料中心的儲存系統和容量帶來了巨大的壓力，企業正在尋找解決方案。 HMC 具有巨大的潛力，不僅可以減少工作負載，還可以提高資料中心效能並降低功耗。
  • 亞太地區網際網路基礎設施的發展導致該地區採用模組化資料中心。這就是亞太地區各種規模和產業的企業都在擁抱數位革命的原因。這也推動資料中心供應商和使用者繼續增加對模組化資料中心建置和服務的投資。由於這些重要措施，預計亞太地區在預測期內的成長率最高，達 58.57%。

混合立方內存產業概況

混合儲存立方體市場的主要公司眾多，因此公司之間的競爭非常激烈。主要參與者包括美光科技、三星、英特爾和富士通。這些參與者為其產品帶來的創新以及預測消費者需求並將新產品推向市場的能力使他們比其他參與者俱有競爭優勢。透過在 HMC 領域對研發、策略合作夥伴關係和併購的大量投資，公司獲得了可觀的市場佔有率。

  • 2023 年 1 月 - Aerospike 讓資料能夠處理具有全球彈性的應用程式、即時操作或實現近乎即時的決策。

其他福利：

  • Excel 格式的市場預測 (ME) 表
  • 3 個月的分析師支持

目錄

第1章簡介

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章市場動態

  • 市場概況
  • 市場促進因素與市場約束因素介紹
  • 市場促進因素
    • 企業儲存應用需求增加
  • 市場限制因素
    • 現有 DRAM 的存在
  • 產業吸引力－波特五力分析
    • 買家/消費者的議價能力
    • 供應商的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭公司之間敵對關係的強度

第5章市場區隔

  • 按最終用戶產業
    • 企業儲存
    • 通訊和網路
    • 其他最終用戶產業
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
    • 歐洲
      • 英國
      • 德國
      • 法國
      • 其他歐洲國家
    • 亞太地區
      • 中國
      • 日本
      • 韓國
      • 台灣
      • 其他亞太地區
    • 世界其他地區
      • 拉丁美洲
      • 中東/非洲

第6章 競爭形勢

  • 公司簡介
    • Micron Technologies Inc.
    • Intel Corporation
    • Xilinx Inc.
    • Fujitsu Ltd.
    • Semtech Corporation
    • Open Silicon Inc.
    • ARM Holdings PLC
    • Samsung Electronics Co. Ltd.
    • IBM Corporation
    • Altera Corporation

第7章 投資分析

第8章 市場機會及未來趨勢

簡介目錄
Product Code: 46357

The Hybrid Memory Cube Market size is estimated at USD 1.45 billion in 2024, and is expected to reach USD 2.92 billion by 2029, growing at a CAGR of 15.11% during the forecast period (2024-2029).

Hybrid Memory Cube - Market

A hybrid memory cube (henceforth called HMC) is a revolutionary technology that signifies a paradigm shift from current memory architectures.

Key Highlights

  • The significant factors driving the Hybrid Memory Cube (HMC) market expansion are the rising number of server farms and employees, the rising shipments of business equipment, and the rising number of assembling activities in the venture stockpiling and consumer hardware sectors. The market for HMC and HBM is expanding due to factors like the rising need for high bandwidth, rising AI use, and developing trends in electronic device downsizing.
  • HMC is redefining memory by enabling advancements that can replace conventional DRAM-based systems. It is setting a new standard in the memory market that matches the computing speeds realized by existing systems (such as CPU).
  • HMC dramatically improves bandwidth and performance by breaking through the memory wall. The architecture of HMC is exponentially more efficient than current memory architectures, utilizing 70% less energy per bit than current DRAM technologies. For instance, Synopsys Inc. announced the availability of its next-generation Verification IP (VIP) for Micron's Hybrid Memory Cube (HMC) architecture. This can enable Micron's HMC with ease of use, fast integration, and optimum performance, resulting in accelerated verification closure.
  • The ever increasing demand for mobility and the rising impact of cloud services is expected to further create demand for HMC solutions, owing to their higher bandwidth, which boosts the capability of networking systems to match line speed performance.
  • The COVID-19 pandemic impacted worldwide sectors, and the global economy was negatively impacted in 2020. Many industries, such as semiconductors, consumer electronics, travel, and automobile, were severely impacted due to the pandemic, which negatively impacted the hybrid memory cube market.

Hybrid Memory Cube Market Trends

Networking and Telecommunication Segment is Expected to Register a Significant Growth

  • The global telecommunication sector is continuously transitioning as infrastructure improvements to broadband and mobile technologies continue.
  • Hybrid memory cubes are increasingly used for high-performance computing (HPC), which can be termed as the set of distributed and parallelization techniques used to connect computing units to perform more complex tasks faster.
  • Edge computing networks and telecommunication technologies support information transmission over distances via., connected and distributed communication devices.
  • Rapid innovations in transmitting, switching, processing, analyzing, and retrieving information are essential for the success of various emerging telecommunication technologies, and this is likely to indirectly influence the growth of the HMC market over the forecast period. The advent of 5G is expected to boost the HMC market.

Asia-Pacific is Expected to Witness Fastest CAGR

  • The region's industries, such as retail, healthcare, IT, and telecommunication, need advanced and fast data processing systems due to the increasing consumer base and data traffic. Moreover, China wishes to establish a world-class IC design unit in applications, such as telecommunications, IoT, big data, and cloud computing industries, which is expected to further boost the HMC market.
  • The enormous amount of data generated through the connected devices and the emergence of Big Data applications have put intense pressure on the data center memory systems and capacity, making the companies look for solutions to the problem. HMCs have a huge potential that could reduce not only the workload but also increase the performance and reduce power consumption by the data centers.
  • The development of internet infrastructure in Asia-Pacific leads to the employment of modular data centers in this region. Therefore, Asia-Pacific companies of all sizes and industries are embracing the digital revolution. It is also driving data center providers and users to continuously increase their investment in the construction and services of modular data centers. Due to these significant measures, Asia-Pacific is expected to account for the highest growth rate of 58.57% over the forecast period.

Hybrid Memory Cube Industry Overview

The competitive rivalry among the players in the hybrid memory cube market is high due to the presence of many major players. Some major players include Micron Technologies, Samsung, Intel, Fujitsu, and many more. The innovations brought about by these players in their products and their ability to introduce a new product in the market by forecasting the needs of their consumers has enabled them to gain a competitive advantage over other players. Hefty investments in research and development, strategic partnerships, and mergers and acquisitions in the field of HMC have enabled the companies to capture a significant market share.

  • January 2023 - Aerospike enabled businesses to make real-time or nearly real-time decisions with the help of its modern data platform, which can handle globally resilient applications, function at an infinite scale, and provide predictable performance and cost-effectiveness.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope Of The Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Introduction to Market Drivers and Restraints
  • 4.3 Market Drivers
    • 4.3.1 Increasing Demand for Enterprise Storage Application
  • 4.4 Market Restraints
    • 4.4.1 Strong Presence of Existing DRAMs
  • 4.5 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.5.1 Bargaining Power of Buyers/Consumers
    • 4.5.2 Bargaining Power of Suppliers
    • 4.5.3 Threat of New Entrants
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry

5 MARKET SEGMENTATION

  • 5.1 By End-user Industry
    • 5.1.1 Enterprise Storage
    • 5.1.2 Telecommunications and Networking
    • 5.1.3 Other End-user Industries
  • 5.2 Geography
    • 5.2.1 North America
      • 5.2.1.1 United States
      • 5.2.1.2 Canada
    • 5.2.2 Europe
      • 5.2.2.1 United Kingdom
      • 5.2.2.2 Germany
      • 5.2.2.3 France
      • 5.2.2.4 Rest of Europe
    • 5.2.3 Asia-Pacific
      • 5.2.3.1 China
      • 5.2.3.2 Japan
      • 5.2.3.3 South Korea
      • 5.2.3.4 Taiwan
      • 5.2.3.5 Rest of Asia-Pacific
    • 5.2.4 Rest of the World
      • 5.2.4.1 Latin America
      • 5.2.4.2 Middle-East & Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Micron Technologies Inc.
    • 6.1.2 Intel Corporation
    • 6.1.3 Xilinx Inc.
    • 6.1.4 Fujitsu Ltd.
    • 6.1.5 Semtech Corporation
    • 6.1.6 Open Silicon Inc.
    • 6.1.7 ARM Holdings PLC
    • 6.1.8 Samsung Electronics Co. Ltd.
    • 6.1.9 IBM Corporation
    • 6.1.10 Altera Corporation

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS