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市場調查報告書

HMC (混合記憶體立方體) 及HBM (寬帶記憶體) 的全球市場的預測 ∼2022年:各容量、用途、地區

Hybrid Memory Cube and High-Bandwidth Memory Market by Density (2GB, 4GB and 8GB), Application (Enterprise Storage, Consumer Electronics (PCS, Gaming Consoles and Laptops) and Networking and Telecommunication), & Geography - Global Forecast to 2022

出版商 MarketsandMarkets 商品編碼 356156
出版日期 內容資訊 英文 125 Pages
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HMC (混合記憶體立方體) 及HBM (寬帶記憶體) 的全球市場的預測 ∼2022年:各容量、用途、地區 Hybrid Memory Cube and High-Bandwidth Memory Market by Density (2GB, 4GB and 8GB), Application (Enterprise Storage, Consumer Electronics (PCS, Gaming Consoles and Laptops) and Networking and Telecommunication), & Geography - Global Forecast to 2022
出版日期: 2016年04月11日 內容資訊: 英文 125 Pages
簡介

全球HMC (混合記憶體立方體) 及HBM (寬帶記憶體) 的市場,預計從2016年到2022年以53.96%的年複合成長率 (CAGR) 發展,2022年成長到9億5380萬美元的規模。網路和企業儲存部門的引進擴大對該市場的成長有貢獻。

本報告提供全球HMC (混合記憶體立方體) 及HBM (寬帶記憶體) 的市場調查,市場及產品定義和概要,產業結構與價值鏈,對市場成長的各種影響因素與市場機會分析,各容量、用途、地區/主要國家趨勢與市場規模的變化與預測,競爭環境與市場排行榜,以及主要企業的簡介等彙整。

第1章 簡介

第2章 調查手法

第3章 摘要整理

第4章 重要考察

  • 由於R&D擴大的新成長可能性
  • HMC&HBM市場成長:各用途
  • 亞太地區的HMC&HBM市場
  • 各地區市場分析
  • CE產品相關市場分析
  • HMC&HBM市場預測:各用途

第5章 市場概要

  • 簡介
  • 市場區隔
  • 市場動態
    • 成長推進因素
    • 阻礙成長要素
    • 市場機會
    • 課題

第6章 產業趨勢

  • 簡介
  • 價值鏈分析
  • 波特的五力分析

第7章 市場分析:各容量

  • 簡介
  • HMC
    • HMCC規格1.1及2.0
    • 2GB
    • 4GB
  • HBM
    • JEDEC HBM GENERATION 1&2規格
    • 2GB
    • 4GB
    • 8GB

第8章 市場分析:各用途

  • 簡介
  • 企業儲存
  • CE產品
    • PC
    • 筆記型電腦
    • 遊戲主機
  • 網路&通訊
  • 產業用途

第9章 地區分析

  • 簡介
  • 北美
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 其他
  • 亞太地區
    • 中國
    • 日本
    • 韓國
    • 台灣
    • 其他
  • 其他地區
    • 南美
    • 中東
    • 非洲

第10章 競爭環境

  • 概要
  • HMC&HBM市場:比較分析
  • 市場排行榜
  • 競爭情形、趨勢
    • 新產品的投入
    • 契約、聯盟、協定
    • 收購
    • 擴張

第11章 企業簡介

  • 簡介
  • MICRON TECHNOLOGY, INC.
  • SAMSUNG ELECTRONICS CO., LTD.
  • SK HYNIX, INC.
  • ADVANCED MICRO DEVICES, INC.
  • INTEL CORPORATION
  • 富士通
  • IBM CORPORATION
  • XILINX INC.
  • NVIDIA CORPORATION
  • OPEN-SILICON, INC.
  • ARIRA
    • 產業概要
    • 財務趨勢
    • 產品與服務
    • 主要策略
    • 近幾年的發展趨勢等

第12章 附錄

圖表

目錄
Product Code: SE 4220

Hybrid Memory Cube and High-Bandwidth Memory market to grow at a CAGR of 56.96%

According to the new market research report on Hybrid Memory Cube and High-Bandwidth Memory, this market is expected to be worth USD 953.8 million by 2022, growing at a CAGR of 53.96% between 2016 and 2022. The growth of the Hybrid Memory Cube and High-Bandwidth Memory market can be attributed to its growing applications in the networking and enterprise storage sector. The exponentially increasing demand for an enriched end-user experience and increased performance in next-generation mainstream computing applications is driving the market for high-density Hybrid Memory Cube and High-Bandwidth Memory devices. The DRAM memory manufacturing industry is expected to face significant challenges over the next six to eight years as it would witness the evolution of these memory technologies.

Hybrid Memory Cube and High-Bandwidth Memory market in APAC expected to grow at the highest rate

This report covers regions including North America, Europe, Asia-Pacific, and Rest of the World (RoW). The market in APAC is expected to grow at a high CAGR between 2016 and 2022. The major drivers for the growth of the Hybrid Memory Cube and High-Bandwidth Memory market in APAC are the rising demand for data centers in enterprise storage applications and increasing manufacturing activities in the automotive and industrial sectors, backed by strong economic growth.

Breakdown of profile of primary participants:

  • By Company Type: Tier 1 - 25%, Tier 2 - 50%, and Tier 3 - 25%
  • By Designation: C level - 35%, Director level - 25%, and others - 40%
  • By Region: North America - 45%, APAC - 20%, Europe - 30%, and RoW - 5%

The companies that are profiled in the report are Samsung Electronics Co., Ltd. (South Korea), SK Hynix, Inc. (South Korea), Micron Technology, Inc. (U.S.), Intel Corporation (U.S.), Fujitsu Ltd. (Japan), IBM (U.S.), Xilinx Inc. (U.S.), Advanced Micro Devices, Inc. (U.S.), Nvidia Corporation (U.S.), Open-Silicon, Inc. (U.S.) and Arira (U.S.)

Reasons to Buy the Report:

  • This report includes the market statistics pertaining to type, application and geography along with their respective revenue.
  • The Porter's Five Forces framework has been provided along with the value chain analysis to provide an in-depth insight into the Hybrid Memory Cube and High-Bandwidth Memory market.
  • The major drivers, restraints, challenges, and opportunities for the Hybrid Memory Cube and High-Bandwidth Memory market have been detailed in this report.
  • Illustrative segmentation, analysis, and forecast for markets based on type, application, and geography have been conducted to give an overall view of the Hybrid Memory Cube and High-Bandwidth Memory market.
  • A detailed competitive landscape has been provided including key players, in-depth analysis, and revenue of key players.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. OBJECTIVES OF THE STUDY
  • 1.2. MARKET DEFINITION
  • 1.3. MARKET SCOPE
    • 1.3.1. MARKETS COVERED
    • 1.3.2. YEARS CONSIDERED FOR THE STUDY
  • 1.4. CURRENCY
  • 1.5. LIMITATION
  • 1.6. STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. INTRODUCTION
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Key data from secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Key data from primary sources
      • 2.1.2.2. Key industry insights
  • 2.2. MARKET SIZE ESTIMATION
    • 2.2.1. BOTTOM-UP APPROACH
    • 2.2.2. TOP-DOWN APPROACH
  • 2.3. MARKET BREAKDOWN & DATA TRIANGULATION
  • 2.4. RESEARCH ASSUMPTIONS AND LIMITATIONS
    • 2.4.1. ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHTS

  • 4.1. INCREASING RESEARCH & DEVELOPMENT ACTIVITIES EXPECTED TO OFFER NEW GROWTH AVENUES FOR THE HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET
  • 4.2. HYBRID MEMORY CUBE, AND HIGH-BANDWIDTH MEMORY MARKET GROWTH, BY APPLICATION
  • 4.3. HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET IN APAC
  • 4.4. HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY REGION
  • 4.5. HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY CONSUMER ELECTRONICS APPLICATION
  • 4.6. HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKETS, BY APPLICATION (2022)

5. MARKET OVERVIEW

  • 5.1. INTRODUCTION
  • 5.2. MARKET SEGMENTATION
    • 5.2.1. HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY DENSITY
    • 5.2.2. HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY APPLICATION
    • 5.2.3. HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY GEOGRAPHY
  • 5.3. MARKET DYNAMICS
    • 5.3.1. DRIVERS
      • 5.3.1.1. Need for high-bandwidth, low-power consuming, and highly scalable memory device
      • 5.3.1.2. Growing demand for enterprise storage application
    • 5.3.2. RESTRAINTS
      • 5.3.2.1. Declining ASP of traditional DRAM memory
    • 5.3.3. OPPORTUNITIES
      • 5.3.3.1. Increasing adoption of cloud-based services
      • 5.3.3.2. Growing big data applications
    • 5.3.4. CHALLENGE
      • 5.3.4.1. Manufacturing and fabrication challenge

6. INDUSTRY TRENDS

  • 6.1. INTRODUCTION
  • 6.2. VALUE CHAIN ANALYSIS
  • 6.3. PORTER'S FIVE FORCES ANALYSIS
    • 6.3.1. THREAT OF NEW ENTRANTS
    • 6.3.2. THREAT OF SUBSTITUTES
    • 6.3.3. BARGAINING POWER OF SUPPLIERS
    • 6.3.4. BARGAINING POWER OF BUYERS
    • 6.3.5. INTENSITY OF RIVALRY

7. HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY DENSITY

  • 7.1. INTRODUCTION
  • 7.2. HYBRID MEMORY CUBE (HMC)
    • 7.2.1. HYBRID MEMORY CUBE CONSORTIUM (HMCC) SPECIFICATION 1.1 AND 2.0
    • 7.2.2. HYBRID MEMORY CUBE (2GB)
    • 7.2.3. HYBRID MEMORY CUBE (4GB)
  • 7.3. HIGH-BANDWIDTH MEMORY(HBM)
    • 7.3.1. JEDEC HIGH-BANDWIDTH MEMORY GENERATION 1 AND 2 SPECIFICATION
    • 7.3.2. HIGH-BANDWIDTH MEMORY (2GB)
    • 7.3.3. HIGH-BANDWIDTH MEMORY (4GB)
    • 7.3.4. HIGH-BANDWIDTH MEMORY (8GB)

8. HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY APPLICATION

  • 8.1. INTRODUCTION
  • 8.2. ENTERPRISE STORAGE
  • 8.3. CONSUMER ELECTRONICS
    • 8.3.1. PCS
    • 8.3.2. LAPTOPS
    • 8.3.3. GAMING CONSOLES
  • 8.4. NETWORKING & TELECOMMUNICATION
  • 8.5. INDUSTRIAL APPLICATIONS

9. GEOGRAPHIC ANALYSIS

  • 9.1. INTRODUCTION
  • 9.2. NORTH AMERICA
    • 9.2.1. U.S.
    • 9.2.2. CANADA
    • 9.2.3. MEXICO
  • 9.3. EUROPE
    • 9.3.1. U.K.
    • 9.3.2. GERMANY
    • 9.3.3. FRANCE
    • 9.3.4. OTHERS
  • 9.4. APAC
    • 9.4.1. CHINA
    • 9.4.2. JAPAN
    • 9.4.3. SOUTH KOREA
    • 9.4.4. TAIWAN
    • 9.4.5. OTHERS
  • 9.5. REST OF THE WORLD (ROW)
    • 9.5.1. SOUTH AMERICA
    • 9.5.2. MIDDLE EAST
    • 9.5.3. AFRICA

10. COMPETITIVE LANDSCAPE

  • 10.1. OVERVIEW
  • 10.2. HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET: COMPARATIVE ANALYSIS
  • 10.3. MARKET RANKING ANALYSIS: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, 2015
  • 10.4. COMPETITIVE SITUATIONS AND TRENDS
    • 10.4.1. NEW PRODUCT LAUNCHES
    • 10.4.2. CONTRACTS, PATNERSHIPS, AND COLLABORATIONS
    • 10.4.3. ACQUISITIONS
    • 10.4.4. EXPANSIONS

11. COMPANY PROFILE (Overview, Financial*, Products & Services, Strategy, and Developments)

  • 11.1. INTRODUCTION
  • 11.2. MICRON TECHNOLOGY, INC.
  • 11.3. SAMSUNG ELECTRONICS CO., LTD.
  • 11.4. SK HYNIX, INC.
  • 11.5. ADVANCED MICRO DEVICES, INC.
  • 11.6. INTEL CORPORATION
  • 11.7. FUJITSU LTD.
  • 11.8. IBM CORPORATION
  • 11.9. XILINX INC.
  • 11.10. NVIDIA CORPORATION
  • 11.11. OPEN-SILICON, INC.
  • 11.12. ARIRA

*Details might not be captured in case of unlisted companies

12. APPENDIX

  • 12.1. INSIGHTS OF INDUSTRY EXPERTS
  • 12.2. DISCUSSION GUIDE
  • 12.3. KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 12.4. INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE
  • 12.5. AVAILABLE CUSTOMIZATIONS
  • 12.6. RELATED REPORTS

LIST OF TABLES

  • TABLE 1: GROWING DEMAND FOR ENTERPRISE STORAGE APPLICATION PROPELS THE GROWTH OF THE HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET
  • TABLE 2: DECLINING ASP OF VOLATILE MEMORY EXPECTED TO RESTRAIN THE GROWTH OF THE HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET
  • TABLE 3: GROWING BIG DATA APPLICATIONS WOULD DRIVE THE DEMAND FOR HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET
  • TABLE 4: MANUFACTURING AND FABRICATION CHALLENGE IS THE MAJOR CHALLENGE FOR THE HYBRID MEMORY CUBE MARKET
  • TABLE 5: HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET, 2015-2022 (USD MILLION)
  • TABLE 6: HYBRID MEMORY CUBE MARKET, BY APPLICATION, 2015-2022 (USD MILLION)
  • TABLE 7: HYBRID MEMORY CUBE MARKET, BY CONSUMER ELECTRONICS APPLICATION, 2015-2022 (USD MILLION)
  • TABLE 8: COMPARISON BETWEEN DDR3 AND DDR4 VS. HYBRID MEMORY CUBE
  • TABLE 9: COMPARISON BETWEEN HYBRID MEMORY CUBE CONSORTIUM VERSION 1.1 AND 2.0
  • TABLE 10: 2GB HYBRID MEMORY CUBE SPECIFICATIONS
  • TABLE 11: 4GB HYBRID MEMORY CUBE SPECIFICATIONS
  • TABLE 12: HYBRID MEMORY CUBE MARKET, BY DENSITY, 2015-2022 (USD MILLION)
  • TABLE 13: COMPARISON BETWEEN DDR3 AND GDDR5 VS. HIGH-BANDWIDTH MEMORY
  • TABLE 14: HIGH-BANDWIDTH MEMORY MARKET, BY APPLICATION, 2015-2022 (USD MILLION)
  • TABLE 15: HIGH-BANDWIDTH MEMORY MARKET, BY CONSUMER ELECTRONICS APPLICATION, 2015-2022 (USD MILLION)
  • TABLE 16: COMPARISON BETWEEN HBM1 AND HBM2
  • TABLE 17: 2GB HIGH-BANDWIDTH MEMORY HBM2 SPECIFICATIONS
  • TABLE 18: 4GB HIGH-BANDWIDTH MEMORY HBM2 SPECIFICATIONS
  • TABLE 19: 8GB HIGH-BANDWIDTH MEMORY HBM2 SPECIFICATIONS
  • TABLE 20: HIGH-BANDWIDTH MEMORY MARKET, BY DENSITY, 2015-2022 (USD MILLION)
  • TABLE 21: HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET, BY APPLICATION, 2015-2022 (USD MILLION)
  • TABLE 22: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR ENTERPRISE STORAGE, BY TYPE, 2015-2022 (USD MILLION)
  • TABLE 23: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR ENTERPRISE SECTOR, BY REGION, 2015-2022 (USD MILLION)
  • TABLE 24: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR CONSUMER ELECTRONICS , BY TYPE, 2015-2022 (USD MILLION)
  • TABLE 25: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2015-2022 (USD MILLION)
  • TABLE 26: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY CONSUMER ELECTRONICS APPLICATION, 2015-2022 (USD MILLION)
  • TABLE 27: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR PCS, BY TYPE, 2015-2022 (USD MILLION)
  • TABLE 28: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR PCS, BY REGION, 2015-2022 (USD MILLION)
  • TABLE 29: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR LAPTOPS, BY TYPE, 2015-2022 (USD MILLION)
  • TABLE 30: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR LAPTOPS, BY REGION, 2015-2022 (USD MILLION)
  • TABLE 31: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR GAMING CONSOLES, BY TYPE, 2015-2022 (USD MILLION)
  • TABLE 32: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR GAMING CONSOLES, BY REGION, 2015-2022 (USD MILLION)
  • TABLE 33: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR NETWORKING & TELECOMMUNICATION, BY TYPE, 2015-2022 (USD MILLION)
  • TABLE 34: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR NETWORKING & TELECOMMUNICATION, BY REGION, 2015-2022 (USD MILLION)
  • TABLE 35: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET FOR INDUSTRIAL APPLICATION, BY TYPE, 2015-2022 (USD MILLION)
  • TABLE 36: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET IN INDUSTRIAL APPLICATION, BY REGION, 2015-2022 (USD MILLION)
  • TABLE 37: HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET, BY REGION, 2015-2022 (USD MILLION)
  • TABLE 38: HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN NORTH AMERICA, BY APPLICATION, 2015-2022 (USD MILLION)
  • TABLE 39: HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN NORTH AMERICA, BY COUNTRY, 2015-2022 (USD MILLION)
  • TABLE 40: HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN EUROPE, BY APPLICATION, 2015-2022 (USD MILLION)
  • TABLE 41: HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN EUROPE, BY COUNTRY, 2015-2022 (USD MILLION)
  • TABLE 42: HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN APAC, BY APPLICATION, 2015-2022 (USD MILLION)
  • TABLE 43: HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN APAC, BY COUNTRY, 2015-2022 (USD MILLION)
  • TABLE 44: HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKETIN ROW, BY APPLICATION, 2015-2022 (USD MILLION)
  • TABLE 45: HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET IN ROW, BY REGION, 2015-2022 (USD MILLION)
  • TABLE 46: GLOBAL HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET RATING, BY KEY PLAYER, 2015
  • TABLE 47: GLOBAL HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET RANKING, BY KEY PLAYER, 2015
  • TABLE 48: NEW PRODUCT LAUNCHES, 2013-2016
  • TABLE 49: CONTRACTS, PARTNERSHIPS, COLLABORATIONS, 2013-2015
  • TABLE 50: ACQUISITIONS, 2013-2015
  • TABLE 51: EXPANSIONS, 2014-2015

LIST OF FIGURES

  • FIGURE 1: MARKETS COVERED
  • FIGURE 2: RESEARCH DESIGN
  • FIGURE 3: RESEARCH METHODOLOGY
  • FIGURE 4: BREAKDOWN OF PRIMARIES
  • FIGURE 5: MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
  • FIGURE 6: MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
  • FIGURE 7: DATA TRIANGULATION
  • FIGURE 8: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET SIZE, BY APPLICATION (2016 VS. 2022)
  • FIGURE 9: ENTERPRISE STORAGE SECTOR EXPECTED TO GROW AT THE HIGHEST RATE BETWEEN 2016 AND 2022
  • FIGURE 10: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY REGION, 2015
  • FIGURE 11: NETRWORKING AND ENTERPRISE STORAGE SEGMENT TO CONTRIBUTE HIGHLY TO THE HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET DURING THE FORECAST PERIOD
  • FIGURE 12: NETWORKING AND TELECOMMUNICATION APPLICATION DOMINATED THE OVERALL HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET (2015)
  • FIGURE 13: CHINA HELD THE LARGEST SHARE OF THE APAC MARKET IN 2015
  • FIGURE 14: NORTH AMERICA HELD THE LARGEST MARKET SHARE OF THE HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET IN 2015
  • FIGURE 15: GAMING CONSOLES SEGMENT EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 16: HIGH-BANDWIDTH MEMORY EXPECTED TO BE THE MOST PREFERRED MEMORY TYPE FOR CONSUMER ELECTRONICS APPLICATION
  • FIGURE 17: SEGMENTATION, BY GEOGRAPHY
  • FIGURE 18: INCREASED DEMAND FOR HIGH BANDWIDTH AND LOW POWER CONSUMPTION IN THE HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET
  • FIGURE 19: VALUE CHAIN ANALYSIS (2015): MAJOR VALUE IS ADDED DURING THE FABRICATION AND SEMICONDUCTOR DEVICE MANUFACTURING PHASE
  • FIGURE 20: PORTER'S FIVE FORCES ANALYSIS
  • FIGURE 21: HIGH-BANDWIDTH MEMORY MARKET EXPECTED TO GROW AT A HIGHER RATE DURING THE FORECAST PERIOD
  • FIGURE 22: NETWORKING AND TELECOMMUNICATION MARKET EXPECTED TO DOMINATE THE HYBRID MEMORY CUBE MARKET IN 2016
  • FIGURE 23: MARKET FOR ENTERPRISE STORAGE SEGMENT EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 24: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET, BY APPLICATION
  • FIGURE 25: ENTERPRISE STORAGE APPLICATION EXPECTED TO LEAD THE HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET BY 2022
  • FIGURE 26: GAMING CONSOLE GROWING AT THE HIGHEST RATE FOR HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY IN CONSUMER ELECTRONICS SEGMENT (2016-2022)
  • FIGURE 27: HIGH-BANDWIDTH MEMORY TO HAVE HIGHER GROWTH RATE IN NETWORKING & TELECOMMUNICATION AS COMPARED TO HYBRID MEMORY CUBE DURING THE FORECAST PERIOD
  • FIGURE 28: CHINA EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 29: GEOGRAPHIC BENCHMARKING OF DIFFERENT APPLICATIONS (2016-2022)
  • FIGURE 30: NORTH AMERICA MARKET SNAPSHOT: DEMAND WOULD BE DRIVEN BY THE GROWTH IN THE ENTERPRISE STORAGE SECTOR
  • FIGURE 31: ASIA-PACIFIC HYBRID MEMORY CUBE & HIGH-BANDWIDTH MEMORY MARKET SNAPSHOT: CHINA TO BE THE FASTEST-GROWING MARKET
  • FIGURE 32: CHINA HOLDS THE LARGEST SHARE OF THE APAC MARKET FOR HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET (2015)
  • FIGURE 33: HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY INDUSTRY PLAYERS PREFER NEW PRODUCT LAUNCHES AS THE KEY STRATEGY
  • FIGURE 34: BATTLE FOR MARKET SHARE: COMPANIES FOLLOW NEW PRODUCT LAUNCHES AS THE KEY STRATEGY
  • FIGURE 35: MARKET EVOLUTION FRAMEWORK: VARIOUS NEW PRODUCT LAUNCHES FUELED THE GROWTH OF THE HYBRID MEMORY CUBE AND HIGH-BANDWIDTH MEMORY MARKET BETWEEN 2013 AND 2015
  • FIGURE 36: GEOGRAPHIC REVENUE MIX OF TOP FIVE MARKET PLAYERS
  • FIGURE 37: MICRON TECHNOLOGY, INC.: COMPANY SNAPSHOT
  • FIGURE 38: SAMSUNG ELECTRONICS CO., LTD: COMPANY SNAPSHOT
  • FIGURE 39: SAMSUNG ELECTRONICS CO., LTD: SWOT ANALYSIS
  • FIGURE 40: SK HYNIX, INC.: COMPANY SNAPSHOT
  • FIGURE 41: SK HYNIX, INC.: SWOT ANALYSIS
  • FIGURE 42: ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT
  • FIGURE 43: ADVANCED MICRO DEVICES, INC.: SWOT ANALYSIS
  • FIGURE 44: INTEL CORPORATION: COMPANY SNAPSHOT
  • FIGURE 45: INTEL CORPORATION: SWOT ANALYSIS
  • FIGURE 46: FUJITSU LTD: COMPANY SNAPSHOT
  • FIGURE 47: IBM CORPORATION: COMPANY SNAPSHOT
  • FIGURE 48: XILINX INC., LTD: COMPANY SNAPSHOT
  • FIGURE 49: NVIDIA CORPORATION: COMPANY SNAPSHOT
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