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市場調查報告書

覆晶技術的全球市場預測 2022年:銅柱、無鉛、BGA、PGA、LGA、SIP、CSP

Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application & Geography - Global Forecast to 2022

出版商 MarketsandMarkets 商品編碼 355926
出版日期 內容資訊 英文 159 Pages
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覆晶技術的全球市場預測 2022年:銅柱、無鉛、BGA、PGA、LGA、SIP、CSP Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application & Geography - Global Forecast to 2022
出版日期: 2016年04月04日 內容資訊: 英文 159 Pages
簡介

全球覆晶技術市場規模,預計從2016到2022年以7.1%的年複合成長率發展,從2015年的190億1,000萬美元到2022年擴大到312億7,000萬美元。覆晶技術市場,由於電子設備的小型化、高性能的需求高漲,及家電市場上穩定的佔有率而受促進。

本報告提供全球覆晶技術市場相關調查,市場及系統概要,產業結構與價值鏈,對市場成長的各種影響因素與市場機會分析,封裝類型,晶圓凸塊流程,封裝技術、產品、用途,及地區/主要國家等各分類趨勢與市場規模的變化與預測,競爭環境,以及主要企業的簡介等彙整。

第1章 簡介

第2章 調查手法

第3章 摘要整理

第4章 重要考察

  • 全球覆晶技術市場上富有魅力的機會
  • 覆晶技術市場規模:各封裝類型
  • 覆晶技術市場規模:晶圓凸塊製程
  • 覆晶技術市場規模:各封裝技術
  • 覆晶技術市場規模:各產品
  • 覆晶技術市場規模:各用途
  • 覆晶技術市場規模:各地區

第5章 市場概要

  • 簡介
  • 市場區隔
    • 各晶圓凸塊製程
    • 各封裝類型
    • 各產品
    • 各用途
    • 地區分析
  • 市場動態
    • 成長推進因素
    • 阻礙成長要素
    • 機會
    • 課題

第6章 產業趨勢

  • 簡介
  • 價值鏈分析
  • 波特的五力分析

第7章 覆晶技術市場:各晶圓凸塊製程

  • 簡介
  • 銅柱
  • 無鉛
  • 錫-鉛的共晶焊料 (Sn-Pb共晶焊料)
  • 金-Stud+鍍金焊料

第8章 覆晶技術市場:各封裝技術

  • 簡介
  • 2D IC 封裝技術
  • 2.5D IC 封裝技術
  • 3D IC 封裝技術
  • 2D、2.5D、3D IC封裝技術比較

第9章 覆晶技術市場:各封裝類型

  • 簡介
  • FC BGA (FLIP CHIP BALL GRID ARRAY)
  • FC PGA (FLIP CHIP PIN GRID ARRAY)
  • FC LGA (FLIP CHIP LAND GRID ARRAY)
  • FC QFN (FLIP CHIP QUAD FLAT NO-LEAD)
  • FC SIP (FLIP CHIP SYSTEM-IN-PACKAGE)
  • FC CSP (FLIP CHIP-CHIP-SCALE PACKAGE)

第10章 覆晶技術市場:各產品

  • 簡介
  • 記憶體
  • 發光半導體 (LED)
  • CMOS影像感測器
  • RF、類比、混合信號,及電力IC
  • CPU
  • GPU
  • SOC

第11章 覆晶技術市場:各用途

  • 簡介
  • 家電
    • 智慧型手機、平板電腦
    • 筆記本型電腦
    • 桌上型個人電腦
    • 機上盒/混合機上盒
    • 遊戲主機
  • 通訊
    • 網路設備
    • 基地台
    • 伺服器
  • 汽車
    • ECU
    • 感測器
    • 電源模組
    • 其他
  • 產業
    • 產業用無線感測網路
    • ID、監測
    • 其他
  • 醫療設備
    • 病患監測設備
    • 智慧感應器系統
    • 其他
  • 智慧科技
    • 軍事&航太
    • 雷達設備
    • 衛星通信設備
    • 其他

第12章 地區分析

  • 簡介
  • 南北美洲
  • 歐洲
  • 亞太地區
  • 其他地區 (ROW)

第13章 競爭環境

  • 簡介
  • 市場排行榜分析
  • 競爭情形、趨勢

第14章 企業簡介 (概要、產品與服務、財務、策略&開發)

  • 簡介
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (TSMC LTD.)
  • SAMSUNG ELECTRONICS CO., LTD.
  • INTEL CORP.
  • UNITED MICROELECTRONICS CORP.
  • ASE GROUP
  • AMKOR TECHNOLOGY
  • SILICONWARE PRECISION INDUSTRIES CO., LTD.
  • POWERTECH TECHNOLOGY, INC.
  • STATS CHIPPAC LTD.
  • JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

第15章 附錄

圖表

目錄
Product Code: SE 4203

Miniaturization of semiconductor devices, improved performance, and reduced size driving the flip chip technology market

The flip chip technology market is expected to grow from USD 19.01 billion in 2015 to USD 31.27 billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The flip chip technology market is driven by factors such as increasing demand for miniaturization and high performance in electronic devices, and strong penetration in the consumer electronics market.

The market for CPU of flip chip technology to gain maximum traction during the forecast period

CPUs packaged using the flip chip technology are estimated to hold the largest market share during the forecast period. The market for LED is expected to gain traction and grow at the highest CAGR in the next six years. These are the most sustainable product segments for the flip chip technology market. CPUs have a wide range of applications in computers, smartphones (application processor), high-end networks such as servers, wearables, and now automotive. The performance of application processor in smartphones and tablets remains a key feature leading to fierce competition among brands. Therefore, increasing need for more functionality and reduced package size is expected to drive the integration of flip chip technology in baseband and application processors for mobile platforms.

The market in APAC expected to witness highest growth during the forecast period

APAC accounted for the major market share of the overall flip chip technology market in 2015. Moreover, the market in APAC is expected to grow at the highest CAGR between 2016 and 2022. Asia-Pacific is a major manufacturing hub and expected to provide ample opportunities for the growth of flip chip technology. The growing demand for high performance in smartphones and automotive MCUs is driving the market in this region.

In the process of determining and verifying the market size for several segments and sub-segments gathered through the secondary research, extensive primary interviews with key people have been conducted. The break-up of profile of primary participants is as given below:

  • By Company Type: Tier 1 - 22%, Tier 2 - 45% and Tier 3 - 33%
  • By Designation: C-level - 43%, Manager level - 57%
  • By Region: North America - 12%, Europe - 38%, APAC - 25%, RoW - 25%

Owing to the rise in the demand for flip chip packaging solutions in smartphones, computers, and tablets, the flip chip technology market is expected to have huge opportunity for growth in the next six years.

Various key players in the flip chip technology market profiled in the report are as follows:

  • 1. TSMC, Ltd. (Taiwan)
  • 2. Samsung (South Korea)
  • 3. Intel Corporation (U.S.)
  • 4. United Microelectronics Corporation (Taiwan)
  • 5. ASE Group (Taiwan)
  • 6. Amkor Technology (U.S.)
  • 7. STATS ChipPAC (Singapore)
  • 8. Powertech Technology (Taiwan)
  • 9. SPIL, Co., Ltd. (Taiwan)
  • 10. JCET, Co., Ltd. (China)

The report would help key players/new entrants in this market in the following ways:

  • 1. This report segments the flip chip technology market comprehensively and provides the closest approximations of the size of the overall market and sub-segments across different verticals and regions.
  • 2. The report helps stakeholders understand the pulse of the market and provides them information on key market drivers, restraints, challenges, and opportunities.
  • 3. This report would help stakeholders to better understand a competitor and gain more insights to improve their position in the business. The competitive landscape section includes competitor ecosystem, new product developments, partnerships, mergers and acquisitions.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. OBJECTIVES OF THE STUDY
  • 1.2. MARKET DEFINITION
  • 1.3. STUDY SCOPE
    • 1.3.1. MARKETS COVERED
    • 1.3.2. YEARS CONSIDERED FOR THE STUDY
  • 1.4. CURRENCY
  • 1.5. LIMITATIONS
  • 1.6. MARKET STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Key data from secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Key data from primary sources
      • 2.1.2.2. Key industry insights
      • 2.1.2.3. Breakdown of primaries
  • 2.2. MARKET SIZE ESTIMATION
    • 2.2.1. BOTTOM-UP APPROACH
    • 2.2.2. TOP-DOWN APPROACH
    • 2.2.3. MARKET SHARE ESTIMATION
  • 2.3. MARKET BREAKDOWN AND DATA TRIANGULATION
  • 2.4. RESEARCH ASSUMPTIONS
    • 2.4.1. ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHTS

  • 4.1. ATTRACTIVE OPPORTUNITIES IN THE GLOBAL FLIP CHIP TECHNOLOGY MARKET
  • 4.2. FLIP CHIP TECHNOLOGY MARKET SIZE, BY PACKAGING TYPE, 2016-2022
  • 4.3. FLIP CHIP TECHNOLOGY MARKET SIZE, BY WAFER BUMPING PROCESS, 2016-2022
  • 4.4. FLIP CHIP TECHNOLOGY MARKET SIZE, BY PACKAGING TECHNOLOGY, 2016-2022
  • 4.5. FLIP CHIP TECHNOLOGY MARKET SIZE, BY PRODUCT, 2016-2022
  • 4.6. FLIP CHIP TECHNOLOGY MARKET SIZE, BY APPLICATION, 2016-2022
  • 4.7. FLIP CHIP TECHNOLOGY MARKET SIZE, BY GEOGRAPHY

5. MARKET OVERVIEW

  • 5.1. INTRODUCTION
  • 5.2. MARKET SEGMENTATION
    • 5.2.1. FLIP CHIP TECHNOLOGY MARKET, BY WAFER BUMPING PROCESS
    • 5.2.2. FLIP CHIP TECHNOLOGY MARKET, BY PACKAGING TECHNOLOGY
    • 5.2.3. FLIP CHIP TECHNOLOGY MARKET, BY PACKAGING TYPE
    • 5.2.4. FLIP CHIP TECHNOLOGY MARKET, BY PRODUCT
    • 5.2.5. FLIP CHIP TECHNOLOGY MARKET, BY APPLICATION
    • 5.2.6. GEOGRAPHIC ANALYSIS
  • 5.3. MARKET DYNAMICS
    • 5.3.1. DRIVERS
      • 5.3.1.1. Increasing demand for miniaturization and high-performing electronic devices
      • 5.3.1.2. Penetration in the consumer electronics sub segment
    • 5.3.2. RESTRAINTS
      • 5.3.2.1. Reliability challenges
    • 5.3.3. OPPORTUNITIES
      • 5.3.3.1. Growth in the IC industry
    • 5.3.4. CHALLENGES
      • 5.3.4.1. High cost associated with flip chip packaging solutions

6. INDUSTRY TRENDS

  • 6.1. INTRODUCTION
  • 6.2. VALUE CHAIN ANALYSIS
  • 6.3. PORTER'S FIVE FORCES ANALYSIS
    • 6.3.1. THREAT OF NEW ENTRANTS
    • 6.3.2. THREAT OF SUBSTITUTES
    • 6.3.3. BARGAINING POWER OF SUPPLIERS
    • 6.3.4. BARGAINING POWER OF BUYERS
    • 6.3.5. INTENSITY OF COMPETITIVE RIVALRY

7. FLIP CHIP TECHNOLOGY MARKET, BY WAFER BUMPING PROCESS

  • 7.1. INTRODUCTION
  • 7.2. COPPER (CU) PILLAR
    • 7.2.1. BENEFITS OF COPPER PILLAR BUMPING PROCESS OVER OTHER WAFER BUMPING PROCESSES
  • 7.3. LEAD (PB)-FREE
  • 7.4. TIN-LEAD (SN-PB) EUTECTIC SOLDER
  • 7.5. GOLD-STUD+ PLATED SOLDER

8. FLIP CHIP TECHNOLOGY MARKET, BY PACKAGING TECHNOLOGY

  • 8.1. INTRODUCTION
  • 8.2. 2D IC PACKAGING TECHNOLOGY
  • 8.3. 2.5D IC PACKAGING TECHNOLOGY
    • 8.3.1. MAJOR BENEFITS OF 2.5D IC PACKAGING OVER THE TRADITIONAL 2D IC PACKAGING TECHNOLOGY
  • 8.4. 3D IC PACKAGING TECHNOLOGY
  • 8.5. COMPARISON BETWEEN 2D, 2.5D, 3D IC PACKAGING TECHNOLOGY

9. FLIP CHIP TECHNOLOGY MARKET, BY PACKAGING TYPE

  • 9.1. INTRODUCTION
  • 9.2. FC BGA (FLIP CHIP BALL GRID ARRAY)
  • 9.3. FC PGA (FLIP CHIP PIN GRID ARRAY)
  • 9.4. FC LGA (FLIP CHIP LAND GRID ARRAY)
  • 9.5. FC QFN (FLIP CHIP QUAD FLAT NO-LEAD)
  • 9.6. FC SIP (FLIP CHIP SYSTEM-IN-PACKAGE)
  • 9.7. FC CSP (FLIP CHIP-CHIP-SCALE PACKAGE)

10. FLIP CHIP TECHNOLOGY MARKET, BY PRODUCT

  • 10.1. INTRODUCTION
  • 10.2. MEMORY
  • 10.3. LIGHT-EMITTING DIODE (LED)
  • 10.4. CMOS IMAGE SENSOR
  • 10.5. RF, ANALOG, MIXED SIGNAL, AND POWER IC
  • 10.6. CPU
  • 10.7. GPU
  • 10.8. SOC

11. FLIP CHIP TECHNOLOGY MARKET, BY APPLICATION

  • 11.1. INTRODUCTION
  • 11.2. CONSUMER ELECTRONICS
    • 11.2.1. SMARTPHONES & TABLETS
    • 11.2.2. LAPTOPS
    • 11.2.3. DESKTOP PC
    • 11.2.4. SET-TOP BOX/HYBRID SET TOP BOX
    • 11.2.5. GAME STATIONS
  • 11.3. TELECOMMUNICATIONS
    • 11.3.1. NETWORK EQUIPMENT
    • 11.3.2. BASE STATIONS
    • 11.3.3. SERVERS
  • 11.4. AUTOMOTIVE
    • 11.4.1. ECU
    • 11.4.2. SENSORS
    • 11.4.3. POWER MODULES
    • 11.4.4. OTHERS
  • 11.5. INDUSTRIAL
    • 11.5.1. INDUSTRIAL WIRELESS SENSOR NETWORK
    • 11.5.2. IDENTIFICATION AND MONITORING
    • 11.5.3. OTHERS
  • 11.6. MEDICAL DEVICES
    • 11.6.1. PATIENT MONITORING DEVICES
    • 11.6.2. SMART SENSOR SYSTEM
    • 11.6.3. OTHERS
  • 11.7. SMART TECHNOLOGIES
    • 11.7.1. MILITARY & AEROSPACE
    • 11.7.2. RADAR EQUIPMENT
    • 11.7.3. SATELLITE COMMUNICATION DEVICES
    • 11.7.4. OTHERS

12. GEOGRAPHIC ANALYSIS

  • 12.1. INTRODUCTION
  • 12.2. AMERICAS
    • 12.2.1. NORTH AMERICA
      • 12.2.1.1. U.S.
      • 12.2.1.2. Canada
      • 12.2.1.3. Brazil
      • 12.2.1.4. Argentina
      • 12.2.1.5. Others
  • 12.3. EUROPE
    • 12.3.1. GERMANY
    • 12.3.2. FRANCE
    • 12.3.3. U.K.
    • 12.3.4. OTHERS
  • 12.4. ASIA-PACIFIC
    • 12.4.1. CHINA
    • 12.4.2. JAPAN
    • 12.4.3. TAIWAN
    • 12.4.4. SOUTH KOREA
    • 12.4.5. OTHERS
  • 12.5. REST OF THE WORLD (ROW)
    • 12.5.1. MIDDLE EAST & AFRICA
    • 12.5.2. RUSSIA

13. COMPETITIVE LANDSCAPE

  • 13.1. INTRODUCTION
  • 13.2. MARKET RANKING ANALYSIS, 2015
  • 13.3. COMPETITIVE SITUATIONS AND TRENDS
    • 13.3.1. COLLABORATIONS
    • 13.3.2. ACQUISITIONS, JOINT VENTURES, AND AGREEMENTS
    • 13.3.3. OTHERS

14. COMPANY PROFILES (Overview, Products and Services, Financials, Strategy & Development)*

  • 14.1. INTRODUCTION
  • 14.2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (TSMC LTD.)
  • 14.3. SAMSUNG ELECTRONICS CO., LTD.
  • 14.4. INTEL CORP.
  • 14.5. UNITED MICROELECTRONICS CORP.
  • 14.6. ASE GROUP
  • 14.7. AMKOR TECHNOLOGY
  • 14.8. SILICONWARE PRECISION INDUSTRIES CO., LTD.
  • 14.9. POWERTECH TECHNOLOGY, INC.
  • 14.10. STATS CHIPPAC LTD.
  • 14.11. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

*Details on Overview, Products and Services, Financials, Strategy & Development might not be Captured in case of Unlisted Companies.

15. APPENDIX

  • 15.1. INSIGHTS OF INDUSTRY EXPERTS
  • 15.2. DISCUSSION GUIDE
  • 15.3. KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 15.4. INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE
  • 15.5. AVAILABLE CUSTOMIZATIONS
  • 15.6. RELATED REPORTS

LIST OF TABLES

  • TABLE 1: ANALYSIS OF MARKET DRIVERS
  • TABLE 2: ANALYSIS OF MARKET RESTRAINTS
  • TABLE 3: ANALYSIS OF MARKET OPPORTUNITIES
  • TABLE 4: ANALYSIS OF MARKET CHALLENGES
  • TABLE 5: FLIP CHIP TECHNOLOGY MARKET SIZE, BY WAFER BUMPING PROCESS, 2013-2022 (USD BILLION)
  • TABLE 6: FLIP CHIP TECHNOLOGY MARKET SIZE, BY PACKAGING TECHNOLOGY, 2013-2022 (USD BILLION)
  • TABLE 7: FLIP CHIP TECHNOLOGY MARKET SIZE, BY PACKAGING TYPE, 2013-2022 (USD MILLION)
  • TABLE 8: FLIP CHIP TECHNOLOGY MARKET SIZE FOR FC BGA, BY PRODUCT, 2013-2022 (USD MILLION)
  • TABLE 9: FLIP CHIP TECHNOLOGY MARKET SIZE FOR FC PGA, BY PRODUCT, 2013-2022 (USD MILLION)
  • TABLE 10: FLIP CHIP TECHNOLOGY MARKET SIZE FOR FC LGA, BY PRODUCT, 2013-2022 (USD MILLION)
  • TABLE 11: FLIP CHIP TECHNOLOGY MARKET SIZE FOR FC QFN, BY PRODUCT, 2013-2022 (USD MILLION)
  • TABLE 12: FLIP CHIP TECHNOLOGY MARKET SIZE FOR FC SIP, BY PRODUCT, 2013-2022 (USD MILLION)
  • TABLE 13: FLIP CHIP TECHNOLOGY MARKET SIZE FOR FC CSP, BY PRODUCT, 2013-2022 (USD MILLION)
  • TABLE 14: FLIP CHIP TECHNOLOGY MARKET SIZE, BY PRODUCT, 2013-2022 (USD MILLION)
  • TABLE 15: FLIP CHIP TECHNOLOGY MARKET SIZE FOR MEMORY, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 16: FLIP CHIP TECHNOLOGY MARKET SIZE FOR MEMORY, BY PACKAGING TYPE, 2013-2022 (USD MILLION)
  • TABLE 17: FLIP CHIP TECHNOLOGY MARKET SIZE FOR LED, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 18: FLIP CHIP TECHNOLOGY MARKET SIZE FOR LED, BY PACKAGING TYPE, 2013-2022 (USD MILLION)
  • TABLE 19: FLIP CHIP TECHNOLOGY MARKET SIZE FOR CMOS IMAGE SENSOR, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 20: FLIP CHIP TECHNOLOGY MARKET SIZE FOR CMOS IMAGE SENSOR, BY PACKAGING TYPE, 2013-2022 (USD MILLION)
  • TABLE 21: FLIP CHIP TECHNOLOGY MARKET SIZE FOR RF, ANALOG, MIXED SIGNAL, AND POWER IC, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 22: FLIP CHIP TECHNOLOGY MARKET SIZE FOR RF, ANALOG, MIXED SIGNAL, AND POWER IC, BY PACKAGING TYPE, 2013-2022 (USD MILLION)
  • TABLE 23: FLIP CHIP TECHNOLOGY MARKET SIZE FOR CPU, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 24: FLIP CHIP TECHNOLOGY MARKET SIZE FOR CPU, BY PACKAGING TYPE, 2013-2022 (USD MILLION)
  • TABLE 25: FLIP CHIP TECHNOLOGY MARKET SIZE FOR GPU, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 26: FLIP CHIP TECHNOLOGY MARKET SIZE FOR GPU, BY PACKAGING TYPE, 2013-2022 (USD MILLION)
  • TABLE 27: FLIP CHIP TECHNOLOGY MARKET SIZE FOR SOC, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION)
  • TABLE 28: FLIP CHIP TECHNOLOGY MARKET SIZE FOR SOC, BY PACKAGING TYPE, 2013-2022 (USD MILLION)
  • TABLE 29: FLIP CHIP TECHNOLOGY MARKET SIZE, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 30: FLIP CHIP TECHNOLOGY MARKET SIZE, BY CONSUMER ELECTRONICS, 2013-2022 (USD MILLION)
  • TABLE 31: FLIP CHIP TECHNOLOGY MARKET SIZE FOR CONSUMER ELECTRONICS, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 32: AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 33: FLIP CHIP TECHNOLOGY MARKET SIZE, BY TELECOMMUNICATION APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 34: FLIP CHIP TECHNOLOGY MARKET SIZE FOR TELECOMMUNICATION, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 35: AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 36: FLIP CHIP TECHNOLOGY MARKET SIZE, BY AUTOMOTIVE APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 37: FLIP CHIP TECHNOLOGY MARKET SIZE FOR AUTOMOTIVE, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 38: AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 39: FLIP CHIP TECHNOLOGY MARKET SIZE, BY INDUSTRIAL, 2013-2022 (USD MILLION)
  • TABLE 40: FLIP CHIP TECHNOLOGY MARKET SIZE FOR INDUSTRIAL, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 41: AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 42: FLIP CHIP TECHNOLOGY MARKET SIZE, BY MEDICAL DEVICES, 2013-2022 (USD MILLION)
  • TABLE 43: FLIP CHIP TECHNOLOGY MARKET SIZE FOR MEDICAL DEVICES, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 44: AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 45: FLIP CHIP TECHNOLOGY MARKET SIZE, BY SMART TECHNOLOGIES, 2013-2022 (USD MILLION)
  • TABLE 46: FLIP CHIP TECHNOLOGY MARKET SIZE FOR SMART TECHNOLOGIES, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 47: AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 48: GLOBAL FLIP CHIP TECHNOLOGY MARKET SIZE, BY MILITARY AND AEROSPACE APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 49: FLIP CHIP TECHNOLOGY MARKET SIZE FOR MILITARY & AEROSPACE APPLICATION, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 50: AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE FOR MILITARY & AEROSPACE APPLICATION, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 51: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 52: AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 53: NORTH AMERICA: FLIP CHIP TECHNOLOGY MARKET SIZE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 54: SOUTH AMERICA: FLIP CHIP TECHNOLOGY MARKET SIZE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 55: FLIP CHIP TECHNOLOGY MARKET SIZE IN AMERICAS, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 56: FLIP CHIP TECHNOLOGY MARKET SIZE IN NORTH AMERICA, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 57: FLIP CHIP TECHNOLOGY MARKET SIZE IN SOUTH AMERICA, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 58: EUROPE: FLIP CHIP TECHNOLOGY MARKET SIZE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 59: FLIP CHIP TECHNOLOGY MARKET SIZE IN EUROPE, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 60: FLIP CHIP TECHNOLOGY MARKET SIZE IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 61: FLIP CHIP TECHNOLOGY MARKET SIZE IN APAC, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 62: ROW: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 63: FLIP CHIP TECHNOLOGY MARKET SIZE IN ROW, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 64: MOST SIGNIFICANT COLLABORATIONS IN THE FLIP CHIP TECHNOLOGY MARKET, 2010-2015
  • TABLE 65: MOST SIGNIFICANT ACQUISITIONS, JOINT VENTURES, AND AGREEMENTS IN THE FLIP CHIP TECHNOLOGY MARKET, 2014-2015
  • TABLE 66: MOST SIGNIFICANT OTHER STRATEGIES IN THE FLIP CHIP TECHNOLOGY MARKET, 2014-2015

LIST OF FIGURES

  • FIGURE 1: FLIP CHIP TECHNOLOGY MARKET SEGMENTATION
  • FIGURE 2: FLIP CHIP TECHNOLOGY MARKET: RESEARCH DESIGN
  • FIGURE 3: PROCESS FLOW OF MARKET SIZE ESTIMATION
  • FIGURE 4: MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
  • FIGURE 5: MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
  • FIGURE 6: MARKET BREAKDOWN & DATA TRIANGULATION
  • FIGURE 7: ASSUMPTIONS OF THE RESEARCH STUDY
  • FIGURE 8: FLIP CHIP TECHNOLOGY MARKET SIZE, BY PACKAGING TYPE, 2016-2022
  • FIGURE 9: 2D IC PACKAGING TECHNOLOGY TO HOLD THE LARGEST MARKET SIZE IN 2016, WHILE THE 3D IC PACKAGING TECHNOLOGY TO GROW AT THE HIGHEST RATE DURING 2016-2022
  • FIGURE 10: COPPER (CU) PILLAR BUMPING PROCESS TO HOLD LARGEST MARKET SIZE 2016
  • FIGURE 11: LED EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD
  • FIGURE 12: CONSUMER ELECTRONICS APPLICATION TO HOLD LARGEST MARKET SIZE IN 2016 AND ALSO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 13: APAC HELD THE LARGEST MARKET IN 2015 AND EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 14: INCREASING DEMAND FOR MINIATURIZATION ALONG WITH HIGH PERFORMANCE IN ELECTRONICS DEVICES TO SPUR THE MARKET GROWTH
  • FIGURE 15: THE MARKET FOR FC CSP TO GROW AT A HIGH RATE DURING THE FORECAST PERIOD
  • FIGURE 16: COPPER (CU) PILLAR PROCESS TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 17: THE MARKET FOR 3D IC PACKAGING TECHNOLOGY TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 18: THE MARKET FOR LED OF FLIP CHIP TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 19: THE MARKET FOR CONSUMER ELECTRONICS SEGMENT TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 20: THE FLIP CHIP TECHNOLOGY MARKET IN THE APAC EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD
  • FIGURE 21: FLIP CHIP TECHNOLOGY MARKET, BY GEOGRAPHY
  • FIGURE 22: FLIP CHIP TECHNOLOGY MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
  • FIGURE 23: ECOSYSTEM OF FLIP CHIP TECHNOLOGY
  • FIGURE 24: PORTER'S FIVE FORCES ANALYSIS, 2015
  • FIGURE 25: PORTER'S FIVE FORCES ANALYSIS, 2015
  • FIGURE 26: FLIP CHIP TECHNOLOGY MARKET: THREAT OF NEW ENTRANTS
  • FIGURE 27: FLIP CHIP TECHNOLOGY MARKET: THREAT OF SUBSTITUTES
  • FIGURE 28: FLIP CHIP TECHNOLOGY MARKET: BARGAINING POWER OF SUPPLIERS
  • FIGURE 29: FLIP CHIP TECHNOLOGY MARKET: BARGAINING POWER OF BUYERS 52  
  • FIGURE 30: FLIP CHIP TECHNOLOGY MARKET: INTENSITY OF COMPETITIVE RIVALRY
  • FIGURE 31: MARKET, BY WAFER BUMPING PROCESS
  • FIGURE 32: MARKET FOR COPPER (CU) PILLAR BUMPING PROCESS EXPECTED TO GROW AT THE HIGHEST RATE
  • FIGURE 33: MARKET, BY PACKAGING TECHNOLOGY
  • FIGURE 34: MARKET FOR 3D IC PACKAGING TECHNOLOGY EXPECTED TO GROW AT THE HIGHEST RATE
  • FIGURE 35: ILLUSTRATION OF 2D IC PACKAGING TECHNOLOGY
  • FIGURE 36: ILLUSTRATION OF 2.5D IC PACKAGING TECHNOLOGY
  • FIGURE 37: ILLUSTRATION OF 3D IC PACKAGING TECHNOLOGY
  • FIGURE 38: MARKET, BY PACKAGING TYPE
  • FIGURE 39: MARKET FOR FC CSP PACKAGING TYPE IS EXPECTED TO GROW AT THE HIGHEST RATE
  • FIGURE 40: MARKET, BY PRODUCT
  • FIGURE 41: MARKET FOR LED EXPECTED TO GROW AT THE HIGHEST RATE
  • FIGURE 42: MARKET, BY APPLICATION
  • FIGURE 43: MARKET FOR CONSUMER ELECTRONICS APPLICATION EXPECTED TO GROW AT THE HIGHEST RATE
  • FIGURE 44: GEOGRAPHIC SNAPSHOT, 2015
  • FIGURE 45: THE FLIP CHIP TECHNOLOGY MARKET IN THE APAC REGION EXPECTED TO GROW AT THE HIGHEST RATE
  • FIGURE 46: AMERICAS SNAPSHOT
  • FIGURE 47: FLIP CHIP TECHNOLOGY MARKET SIZE IN BRAZIL, 2013-2022 (USD MILLION)
  • FIGURE 48: FLIP CHIP TECHNOLOGY MARKET SIZE IN ARGENTINA, 2013-2022 (USD MILLION)
  • FIGURE 49: FLIP CHIP TECHNOLOGY MARKET SIZE IN OTHER COUNTRIES, 2013-2022 (USD MILLION)
  • FIGURE 50: EUROPE SNAPSHOT
  • FIGURE 51: APAC SNAPSHOT
  • FIGURE 52: COMPANIES ADOPTED COLLABORATIONS AS THE KEY GROWTH STRATEGY BETWEEN 2010 AND 2015
  • FIGURE 53: MARKET RANKING ANALYSIS FOR THE FLIP CHIP TECHNOLOGY MARKET, 2015
  • FIGURE 54: MARKET EVALUATION FRAMEWORK
  • FIGURE 55: BATTLE FOR MARKET SHARE: COLLABORATION WAS THE KEY STRATEGY
  • FIGURE 56: GEOGRAPHY REVENUE MIX FOR TOP FIVE PLAYERS
  • FIGURE 57: TSMC LTD.: COMPANY SNAPSHOT
  • FIGURE 58: TSMC LTD.: SWOT ANALYSIS
  • FIGURE 59: SAMSUNG ELECTRONICS CO., LTD.: COMPANY SNAPSHOT
  • FIGURE 60: SAMSUNG ELECTRONICS CO., LTD.: SWOT ANALYSIS
  • FIGURE 61: INTEL CORP.: COMPANY SNAPSHOT
  • FIGURE 62: INTEL CORP.: SWOT ANALYSIS
  • FIGURE 63: UNITED MICROELECTRONICS CORP.: COMPANY SNAPSHOT
  • FIGURE 64: ASE GROUP.: COMPANY SNAPSHOT
  • FIGURE 65: ASE GROUP: SWOT ANALYSIS 137  
  • FIGURE 66: AMKOR TECHNOLOGY: COMPANY SNAPSHOT
  • FIGURE 67: AMKOR TECHNOLOGY: SWOT ANALYSIS
  • FIGURE 68: SPIL CO., LTD. : COMPANY SNAPSHOT
  • FIGURE 69: POWERTECH TECHNOLOGY, INC.: COMPANY SNAPSHOT
  • FIGURE 70: STATS CHIPPAC LTD.: COMPANY SNAPSHOT
  • FIGURE 71: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.: COMPANY SNAPSHOT
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