Cover Image
市場調查報告書

IoT (物聯網) 晶片的全球市場:應用領域 (穿戴式設備,醫療保健,家電品,大樓自動化,產業用,汽車,運輸),不同地區的預測 ∼2022年

IoT Chip Market by Component (MCU, FPGA, Memory, Sensor (Image, Inertial, Temperature, Pressure, Humidity, Flow, Level)), Connectivity Technology (Bluetooth, Wi-Fi, ZigBee, Ethernet, NFC, Cellular, Z-Wave), Vertical & Geography - Global Forecast to 2022

出版商 MarketsandMarkets 商品編碼 352130
出版日期 內容資訊 英文 177 Pages
訂單完成後即時交付
價格
Back to Top
IoT (物聯網) 晶片的全球市場:應用領域 (穿戴式設備,醫療保健,家電品,大樓自動化,產業用,汽車,運輸),不同地區的預測 ∼2022年 IoT Chip Market by Component (MCU, FPGA, Memory, Sensor (Image, Inertial, Temperature, Pressure, Humidity, Flow, Level)), Connectivity Technology (Bluetooth, Wi-Fi, ZigBee, Ethernet, NFC, Cellular, Z-Wave), Vertical & Geography - Global Forecast to 2022
出版日期: 2016年02月09日 內容資訊: 英文 177 Pages
簡介

全球IoT (物聯網) 晶片市場以金額為主的規模,預測將從2015年的45億8,000萬美元,以年複合成長率 (CAGR) 11.5%的速度成長,到2022年達到107億8,000萬美元的規模。連接性是IoT應用所需的功能,在消費者取向及企業基礎設施設備雙方都一樣重要。在內建設備的領域中,在各種應用程式中,連接性與網路處理相關功能,日益與內建處理器一體化。

本報告網羅全球IoT (物聯網) 晶片市場,概括市場概要,市場發展促進·阻礙因素,市場上課題及機會,再彙整各應用領域·各地區市場現況與展望相關調查分析,競爭環境,主要企業簡介等資訊。

第1章 簡介

第2章 調查手法

第3章 摘要整理

第4章 高級見解

第5章 市場概要

  • 簡介
  • 市場區隔
    • 市場,應用各產業
    • 市場,各地區
  • 物聯網 (IoT) 市場發展
  • 市場動態
    • 市場發展推動因素
      • 整合愈來愈多設備及應用的連接性功能
      • IoT預計在特定用途的微控制器單位 (MCU) 及柔軟的系統晶片 (SoC) 類型設計中將促進高成長
      • IPV6標準化及更多IP位址領域的可用性
      • 智慧型手機需求的擴大和其他連網型設備市場的擴大
      • 低成本的智慧無線感測網路劇增
    • 市場發展阻礙因素
      • 缺乏平台間的通用通訊標準
      • 需要改善的長壽電池技術和超低功率技術
    • 市場機會
      • 全球各國政府對IoT的研究開發的大幅資金援助
      • 創新領域間通用應用的市場機會
    • 課題
      • 隱私和資料的安全性
      • 許多主要終端市場上短的產品生命週期
    • 緊急的課題
      • 不穩定的全球經濟造成基礎設施投資的限制和IoT的全球經濟依存度的影響

第6章 產業趨勢

  • 簡介
  • 價值鏈分析
  • 波特的五力分析
  • 主要趨勢
    • 感測器的普及
    • 先進晶片的複雜化
    • 4G-LTE的下一步 (高速通訊標準的開發)
    • 智慧裝置及連接性的轉變

第7章 IoT晶片市場,應用各產業

  • 簡介
  • 穿戴式設備
    • 穿戴式設備部門相關產品
    • 穿戴式設備用途網羅的半導體零組件
  • 醫療保健 (醫療)
    • 醫療保健部門相關產品
    • 醫療保健用途網羅的半導體零組件
  • 家電品
    • 家電品部門相關產品
    • 家電用途網羅的半導體零組件
  • 大樓自動化
    • 大樓自動化部門相關產品
    • 大樓自動化用途網羅的半導體零組件
  • 產業用
  • 汽車,運輸

第8章 IoT晶片市場,各地區

  • 簡介
  • 北美
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 義大利
    • 其他歐洲
  • APAC (亞太地區)
    • 中國
    • 日本
    • 韓國
    • 其他APAC
  • ROW (其他地區)
    • 中東
    • 非洲

第9章 競爭環境

  • 概要
  • 比較分析
    • 競爭模式
  • 競爭情形·趨勢
    • 最近的趨勢
      • 新產品發表
      • 協定,夥伴關係,聯盟
      • 合併·收購

第10章 企業簡介 (概要,產品與服務,業績,策略·趨勢)

  • INTEL CORPORATION
  • QUALCOMM INCORPORATED
  • FREESCALE SEMICONDUCTOR INC.
  • TEXAS INSTRUMENTS INCORPORATED
  • NXP SEMICONDUCTORS
  • ARM HOLDINGS PLC.
  • ATMEL CORPORATION
  • MEDIATEK INC.
  • MICROCHIP TECHNOLOGY INC.
  • Renesas Electronics
  • STMICROELECTRONICS N.V.

第11章 附錄

圖表

目錄
Product Code: SE 4057

Integration of connectivity capabilities in an increasing number of devices and applications would drive the IoT chip market

The IoT chip market size, in terms of value, is expected to grow from USD 4.58 billion in 2015 to USD 10.78 billion by 2022, at a CAGR of 11.5% between 2016 and 2022. Connectivity is a key capability required in IoT applications, both for consumer and enterprise infrastructure devices. Within the embedded device space, connectivity and network processing-related functions are increasingly being combined with embedded processors in various applications.

Wearable device market to gain maximum traction during the forecast period

The wearable devices market is estimated to grow at the highest CAGR during the forecast period and hold the largest market share by 2022. The growing popularity of Internet of Things and the increasing adoption of smart watches and activity trackers in the consumer markets are the major factors driving the growth of the wearable device market. The IoT chip market is also expected to witness growth in healthcare, consumer electronics, building automation, industrial, and automotive & transportation applications.

APAC market for IoT chip to grow at the highest rate during the forecast period

Countries such as China, India, and Japan are aggressively taking initiatives such as heavy investments in R&D to encourage the adoption of Internet of Things in the region, which is expected to boost the demand for IoT chip in the near future. The APAC market comprises developing economies such as China and India-which have a huge potential for the applications of Internet of Things-and Japan, which is home to many large companies such as Fujitsu Ltd. and Toyota Motor Corporation. These emerging markets are driving the growth of the IoT chip market in APAC.

In the process of determining and verifying the market size for several segments and subsegments gathered through secondary research, extensive primary interviews were conducted with key people. The break-up of profile of primary participants is given below:

  • By Company Type: Tier 1 - 55 %, Tier 2 - 20% and Tier 3 - 25%
  • By Designation: C-level - 60%, Director Level - 25%, Others - 15%
  • By Region: North America - 10%, Europe - 20%, APAC - 40%, RoW - 30%

Governments across the globe are supporting and funding research and development in Internet of Things to boost their productivity. The investment of governments in future technologies provides huge opportunities for the semiconductor companies, thus driving the IoT chip market.

The key players in the IoT chip market profiled in the report are as follows:

  • 1. Intel Corporation
  • 2. Qualcomm Incorporated
  • 3. ARM Holdings PLC
  • 4. Atmel Corporation
  • 5. Texas Instruments Inc.
  • 6. Freescale Semiconductor, Inc.
  • 7. NXP Semiconductors
  • 8. Mediatek Inc.
  • 9. Microchip Technology Inc.
  • 10. Renesas Electronic Corporation
  • 11. ST Microelectronics

The report will help the market leaders/new entrants in this market in the following ways:

  • 1. This report segments the IoT chip market comprehensively and provides the closest approximations of the overall market size and that of the subsegments across the different verticals and regions.
  • 2. The report helps stakeholders to understand the pulse of the market and provides them information on key market drivers, restraints, challenges, and opportunities.
  • 3. This report would help stakeholders to better understand their competitors and gain more insights to enhance their position in the business. The competitive landscape section includes competitor ecosystem, new product developments, partnerships, and mergers and acquisitions.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. OBJECTIVES OF THE STUDY
  • 1.2. MARKET DEFINITION
  • 1.3. STUDY SCOPE
    • 1.3.1. MARKETS COVERED
    • 1.3.2. YEARS CONSIDERED FOR THE STUDY
  • 1.4. CURRENCY & PRICING
  • 1.5. LIMITATIONS
  • 1.6. STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Key data from secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Key data from primary sources
      • 2.1.2.2. Key industry insights
      • 2.1.2.3. Breakdown of Primaries
  • 2.2. DEMAND-SIDE ANALYSIS FOR IOT CHIP MARKET
    • 2.2.1. DEMAND-SIDE ANALYSIS
      • 2.2.1.1. Chip demand driven by internet of things (IoT)
  • 2.3. MARKET SIZE ESTIMATION
    • 2.3.1. BOTTOM-UP APPROACH
    • 2.3.2. TOP-DOWN APPROACH
  • 2.4. MARKET BREAKDOWN AND DATA TRIANGULATION
  • 2.5. RESEARCH ASSUMPTIONS AND LIMITATIONS
    • 2.5.1. ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHTS

  • 4.1. ATTRACTIVE MARKET OPPORTUNITIES IN IOT CHIP MARKET
  • 4.2. IOT CHIP MARKET IN WEARABLE DEVICES: BY GEOGRAPHY
  • 4.3. IOT CHIP MARKET, BY APPLICATION VERTICAL IN ASIA-PACIFIC
  • 4.4. IOT CHIP MARKET VALUE IN CONSUMER ELECTRONICS MARKET
  • 4.5. LIFE CYCLE ANALYSIS, BY GEOGRAPHY

5. MARKET OVERVIEW

  • 5.1. INTRODUCTION
  • 5.2. MARKET SEGMENTATION
    • 5.2.1. MARKET, BY APPLICATION VERTICAL
    • 5.2.2. MARKET, BY GEOGRAPHY
  • 5.3. MARKET EVOLUTION OF INTERNET OF THINGS
  • 5.4. MARKET DYNAMICS
    • 5.4.1. DRIVERS
      • 5.4.1.1. Integration of connectivity capabilities in an increasing number of devices and applications
      • 5.4.1.2. IoT expected to drive higher growth in application-specific microcontroller units (MCUs) and flexible System-on-Chip (SoC)-type designs
      • 5.4.1.3. Standardization of IPV6 and availability of more IP address space
      • 5.4.1.4. Increasing demand for smartphones and a growing market for other connected devices
      • 5.4.1.5. Explosion of low-cost, smart wireless sensor networks
    • 5.4.2. RESTRAINTS
      • 5.4.2.1. Lack of common communication standards across platforms
      • 5.4.2.2. Long-lasting battery technologies and ultra-low power technologies need further improvement
    • 5.4.3. OPPORTUNITIES
      • 5.4.3.1. Significant financial support from governments across the globe for research & development in IoT
      • 5.4.3.2. Opportunities for innovative cross-domain applications
    • 5.4.4. CHALLENGES
      • 5.4.4.1. Privacy & security of data
      • 5.4.4.2. Short product life cycle of many of the key end markets
    • 5.4.5. BURNING ISSUE
      • 5.4.5.1. Limits on infrastructure investment due to volatile global economy and effect of dependencies over global economy in IoT

6. INDUSTRY TRENDS

  • 6.1. INTRODUCTION
  • 6.2. VALUE CHAIN ANALYSIS
  • 6.3. PORTER'S FIVE FORCES ANALYSIS
    • 6.3.1. INTENSITY OF COMPETITIVE RIVALRY
    • 6.3.2. THREAT OF SUBSTITUTES
    • 6.3.3. BARGAINING POWER OF BUYERS
    • 6.3.4. BARGAINING POWER OF SUPPLIERS
    • 6.3.5. THREAT OF NEW ENTRANTS
  • 6.4. KEY TRENDS
    • 6.4.1. SENSOR PROLIFERATION
    • 6.4.2. INCREASING CHIP COMPLEXITY
    • 6.4.3. 4G-LTE AND BEYOND (DEVELOPMENT OF FASTER COMMUNICATION STANDARDS)
    • 6.4.4. SHIFT TOWARD SMART DEVICES AND CONNECTIVITY

7. IOT CHIP MARKET, BY APPLICATION VERTICAL

  • 7.1. INTRODUCTION
  • 7.2. WEARABLE DEVICES
    • 7.2.1. PRODUCTS COVERED UNDER WEARABLE DEVICES SEGMENT
      • 7.2.1.1. Activity monitors
      • 7.2.1.2. Smart watches
      • 7.2.1.3. Smart glasses
      • 7.2.1.4. Wearable cameras
    • 7.2.2. SEMICONDUCTOR COMPONENTS COVERED UNDER WEARABLE DEVICES APPLICATION
      • 7.2.2.1. Connectivity IC
      • 7.2.2.2. MCU
      • 7.2.2.3. Accelerometer
      • 7.2.2.4. Application processor
      • 7.2.2.5. Memory
      • 7.2.2.6. IMU
      • 7.2.2.7. Camera module
  • 7.3. HEALTHCARE
    • 7.3.1. PRODUCTS COVERED UNDER HEALTHCARE SEGMENT
      • 7.3.1.1. Fitness & heart rate monitor
      • 7.3.1.2. Blood pressure monitor
      • 7.3.1.3. Blood glucose meter
      • 7.3.1.4. Continuous glucose monitor
      • 7.3.1.5. Pulse oximeter
      • 7.3.1.6. Automated external defibrillator
      • 7.3.1.7. Programmable syringe pump
      • 7.3.1.8. Wearable injector
      • 7.3.1.9. Multi-parameter monitor
    • 7.3.2. SEMICONDUCTOR COMPONENTS COVERED UNDER HEALTHCARE APPLICATION
      • 7.3.2.1. Connectivity IC
      • 7.3.2.2. MCU
      • 7.3.2.3. Heart rate sensor
      • 7.3.2.4. Accelerometer
      • 7.3.2.5. Pressure sensor
      • 7.3.2.6. Temperature sensor
      • 7.3.2.7. Blood glucose sensor
      • 7.3.2.8. Blood oxygen sensor
      • 7.3.2.9. ECG sensor
  • 7.4. CONSUMER ELECTRONICS
    • 7.4.1. PRODUCTS COVERED UNDER CONSUMER ELECTRONICS SEGMENT
      • 7.4.1.1. Smart TV
      • 7.4.1.2. Refrigerator
      • 7.4.1.3. Washing machine
      • 7.4.1.4. Other products
    • 7.4.2. SEMICONDUCTOR COMPONENTS COVERED UNDER CONSUMER ELECTRONICS APPLICATION
      • 7.4.2.1. Connectivity IC (Wi-Fi)
      • 7.4.2.2. Connectivity IC (Wi-Fi + Ethernet)
      • 7.4.2.3. Connectivity IC (Wi-Fi + NFC)
      • 7.4.2.4. Connectivity IC (Wi-Fi + Bluetooth + Ethernet)
  • 7.5. BUILDING AUTOMATION
    • 7.5.1. PRODUCTS COVERED UNDER BUILDING AUTOMATION SEGMENT
      • 7.5.1.1. Occupancy sensor
      • 7.5.1.2. Daylight sensor
      • 7.5.1.3. Smart thermostats
      • 7.5.1.4. IP cameras
      • 7.5.1.5. Smart meters
      • 7.5.1.6. Smart locks
      • 7.5.1.7. Smoke detectors
      • 7.5.1.8. Lighting control actuators
      • 7.5.1.9. Gateways
    • 7.5.2. SEMICONDUCTOR COMPONENTS COVERED UNDER BUILDING AUTOMATION APPLICATION
      • 7.5.2.1. Connectivity IC
      • 7.5.2.2. Temperature sensor
      • 7.5.2.3. Humidity sensor
      • 7.5.2.4. Microprocessor
      • 7.5.2.5. MCU
      • 7.5.2.6. Memory
      • 7.5.2.7. Image sensor
      • 7.5.2.8. Gas sensors
      • 7.5.2.9. Ambient light sensor
  • 7.6. INDUSTRIAL
    • 7.6.1. SEMICONDUCTOR COMPONENTS COVERED UNDER INDUSTRIAL APPLICATION VERTICAL
      • 7.6.1.1. Temperature sensor
      • 7.6.1.2. Pressure sensor
      • 7.6.1.3. Level sensor
      • 7.6.1.4. Flow sensor
      • 7.6.1.5. Chemical & gas sensor
      • 7.6.1.6. Humidity sensor
      • 7.6.1.7. Motion & position sensor
      • 7.6.1.8. MCU
      • 7.6.1.9. Connectivity IC
  • 7.7. AUTOMOTIVE & TRANSPORTATION
    • 7.7.1. SEMICONDUCTOR COMPONENTS COVERED UNDER AUTOMOTIVE & TRANSPORTATION APPLICATION
      • 7.7.1.1. Connectivity IC
      • 7.7.1.2. MCU
      • 7.7.1.3. FPGA
      • 7.7.1.4. DSP
      • 7.7.1.5. Memory
      • 7.7.1.6. Image sensor

8. IOT CHIP MARKET, BY GEOGRAPHY

  • 8.1. INTRODUCTION
  • 8.2. NORTH AMERICA
    • 8.2.1. U.S.
    • 8.2.2. CANADA
    • 8.2.3. MEXICO
  • 8.3. EUROPE
    • 8.3.1. GERMANY
    • 8.3.2. FRANCE
    • 8.3.3. U.K.
    • 8.3.4. ITALY
    • 8.3.5. REST OF EUROPE
  • 8.4. APAC
    • 8.4.1. CHINA
    • 8.4.2. JAPAN
    • 8.4.3. KOREA
    • 8.4.4. REST OF APAC
  • 8.5. ROW
    • 8.5.1. MIDDLE EAST
    • 8.5.2. AFRICA

9. COMPETITIVE LANDSCAPE

  • 9.1. OVERVIEW
  • 9.2. COMPARATIVE ANALYSIS
    • 9.2.1. COMPETITIVE SCENARIO
  • 9.3. COMPETITIVE SITUATION & TRENDS
    • 9.3.1. RECENT DEVELOPMENTS
      • 9.3.1.1. New product launches
      • 9.3.1.2. Agreements, partnerships, and collaborations
      • 9.3.1.3. Mergers & acquisitions

10. COMPANY PROFILES (Overview, Products and Services, Financials, Strategy & Development)*

  • 10.1. INTEL CORPORATION
  • 10.2. QUALCOMM INCORPORATED
  • 10.3. FREESCALE SEMICONDUCTOR INC.
  • 10.4. TEXAS INSTRUMENTS INCORPORATED
  • 10.5. NXP SEMICONDUCTORS
  • 10.6. ARM HOLDINGS PLC.
  • 10.7. ATMEL CORPORATION
  • 10.8. MEDIATEK INC.
  • 10.9. MICROCHIP TECHNOLOGY INC.
  • 10.10. RENESAS ELECTRONIC CORPORATION
  • 10.11. STMICROELECTRONICS N.V.

*Details on Overview, Products and Services, Financials, Strategy & Development might not be Captured in case of Unlisted Companies.

11. APPENDIX

  • 11.1. INSIGHTS OF INDUSTRY EXPERTS
  • 11.2. DISCUSSION GUIDE
  • 11.3. INTRODUCING RT: REAL TIME MARKET INTELLIGENCE
  • 11.4. AVAILABLE CUSTOMIZATIONS
  • 11.5. RELATED REPORTS

LIST OF TABLES

  • TABLE 1: CONNECTIVITY CAPABILITIES INTEGRATED IN A LARGE NUMBER OF DEVICES AND APPLICATIONS PROPELS THE GROWTH OF IOT CHIP MARKET
  • TABLE 2: LACK OF COMMON COMMUNICATION STANDARD ACROSS PLATFORMS ACTS AS A HINDRANCE TO THE MARKET
  • TABLE 3: INTERNET OF THINGS: UK GOVERNMENT FUNDINGS FOR INTERNET OF THINGS
  • TABLE 4: FINANCIAL SUPPORT FROM GOVERNMENTS ACROSS THE GLOBE FOR RESEARCH & DEVELOPMENT OF IOT PROVIDE A HUGE OPPORTUNITY FOR THE IOT CHIP MARKET
  • TABLE 5: PRIVACY & SECURITY OF DATA POSES THE MAJOR CHALLENGE FOR THE MARKET
  • TABLE 6: THE PORTER'S FIVE FORCES ANALYSIS: BARGAINING POWER OF BUYERS IS LIKELY TO HAVE THE MAXIMUM IMPACT ON THE OVERALL MARKET IN 2015
  • TABLE 7: IOT CHIP MARKET SIZE, BY APPLICATION VERTICAL, 2014-2022 (USD MILLION)
  • TABLE 8: WEARABLE DEVICES: IOT CHIP MARKET SIZE, 2014-2022 (MILLION UNITS)
  • TABLE 9: WEARABLE DEVICES: IOT CHIP MARKET SIZE, 2014-2022 (USD MILLION)
  • TABLE 10: WEARABLE DEVICES: CONNECTIVITY IC MARKET SIZE, BY CONNECTIVITY TECHNOLOGY, 2014-2022 (MILLION UNITS)
  • TABLE 11: WEARABLE DEVICES: CONNECTIVITY IC VALUE, BY CONNECTIVITY TECHNOLOGY, 2014-2022 (USD MILLION)
  • TABLE 12: WEARABLE DEVICES: IOT CHIP MARKET SIZE, BY REGION, 2014-2022 (USD MILLION)
  • TABLE 13: HEALTHCARE: IOT CHIP MARKET SIZE, 2014-2022 (MILLION UNITS)
  • TABLE 14: HEALTHCARE: IOT CHIP MARKET SIZE, 2014-2022 (USD MILLION)
  • TABLE 15: HEALTHCARE: CONNECTIVITY IC MARKET SIZE, BY CONNECTIVITY TECHNOLOGY, 2014-2022 (MILLION UNITS)
  • TABLE 16: HEALTHCARE: CONNECTIVITY IC VALUE, BY CONNECTIVITY TECHNOLOGY, 2014-2022 (USD MILLION)
  • TABLE 17: HEALTHCARE: IOT CHIP MARKET SIZE, BY REGION, 2014-2022 (USD MILLION)
  • TABLE 18: CONSUMER ELECTRONICS: IOT CHIP MARKET SIZE, 2014-2022 (MILLION UNITS)
  • TABLE 19: CONSUMER ELECTRONICS: IOT CHIP MARKET SIZE, 2014-2022 (USD MILLION)
  • TABLE 20: CONSUMER ELECTRONICS: IOT CHIP MARKET SIZE, BY REGION, 2014-2022 (USD MILLION)
  • TABLE 21: BUILDING AUTOMATION: IOT CHIP MARKET SIZE, 2014-2022 (MILLION UNITS)
  • TABLE 22: BUILDING AUTOMATION: IOT CHIP MARKET SIZE, 2014-2022 (USD MILLION)
  • TABLE 23: BUILDING AUTOMATION: CONNECTIVITY IC MARKET SIZE, BY CONNECTIVITY TECHNOLOGY, 2014-2022 (MILLION UNITS)
  • TABLE 24: BUILDING AUTOMATION: CONNECTIVITY IC MARKET SIZE, BY CONNECTIVITY TECHNOLOGY, 2014-2022 (USD MILLION)
  • TABLE 25: BUILDING AUTOMATION: IOT CHIP MARKET SIZE, BY REGION, 2014-2022 (USD MILLION)
  • TABLE 26: INDUSTRIAL: IOT CHIP MARKET SIZE, 2014-2022 (MILLION UNITS)
  • TABLE 27: INDUSTRIAL: IOT CHIP MARKET SIZE, 2014-2022 (USD MILLION)
  • TABLE 28: INDUSTRIAL: CONNECTIVITY IC MARKET SIZE, BY CONNECTIVITY TECHNOLOGY, 2014-2022 (MILLION UNITS)
  • TABLE 29: INDUSTRIAL: IOT CHIP MARKET SIZE, BY REGION, 2014-2022 (USD MILLION)
  • TABLE 30: AUTOMOTIVE & TRANSPORTATION: IOT CHIP MARKET SIZE, 2014-2022 (MILLION UNITS)
  • TABLE 31: AUTOMOTIVE & TRANSPORTATION: IOT CHIP MARKET SIZE, 2014-2022 (USD MILLION)
  • TABLE 32: AUTOMOTIVE & TRANSPORTATION: CONNECTIVITY IC MARKET SIZE, BY CONNECTIVITY TECHNOLOGY, 2014-2022 (MILLION UNITS)
  • TABLE 33: AUTOMOTIVE & TRANSPORTATION: IOT CHIP MARKET SIZE, BY REGION, 2014-2022 (USD MILLION)
  • TABLE 34: IOT CHIP: MARKET SIZE, BY GEOGRAPHY, 2014-2022 (USD MILLION)
  • TABLE 35: NORTH AMERICA: IOT CHIP MARKET SIZE, BY APPLICATION, 2014-2022 (USD MILLION)
  • TABLE 36: EUROPE: IOT CHIP MARKET SIZE, BY APPLICATION, 2014-2022 (USD MILLION)
  • TABLE 37: APAC: IOT CHIP MARKET SIZE, BY APPLICATION, 2014-2022 (USD MILLION)
  • TABLE 38: ROW: IOT CHIP MARKET SIZE, BY APPLICATION, 2014-2022 (USD MILLION)
  • TABLE 39: NEW PRODUCT LAUNCHES, 2012 - 2015
  • TABLE 40: AGREEMENTS, PARTNERSHIPS, COLLABORATIONS & JOINT VENTURES, 2012 - 2015
  • TABLE 41: MERGER & ACQUISITIONS, 2012 - 2015

LIST OF FIGURES

  • FIGURE 1: RESEARCH DESIGN
  • FIGURE 2: INTERNET OF THINGS (IOT): NUMBER OF CONNECTED DEVICES WORLDWIDE BETWEEN 2012 AND 2017 (IN BILLIONS)
  • FIGURE 3: MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
  • FIGURE 4: MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
  • FIGURE 5: DATA TRIANGULATION
  • FIGURE 6: AUTOMOTIVE & TRANSPORTATION HELD THE LARGEST SHARE OF THE IOT CHIP MARKET IN 2015
  • FIGURE 7: CONNECTIVITY IC EXPECTED TO DOMINATE THE AUTOMOTIVE & TRANSPORTATION SEGMENT FOR IOT CHIP
  • FIGURE 8: ASIA-PACIFIC EXPECTED TO HOLD THE LARGEST MARKET SHARE IN THE WEARABLE DEVICE SEGMENT FOR IOT CHIP
  • FIGURE 9: GLOBAL IOT CHIP MARKET, BY GEOGRAPHY, 2015
  • FIGURE 10: CONNECTIVITY CAPABILITIES INTEGRATED IN LARGE NUMBER OF DEVICES AND APPLICATIONS PROPEL THE GROWTH OF THE MARKET
  • FIGURE 11: APAC EXPECTED TO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD
  • FIGURE 12: WEARABLE DEVICES SEGMENT CAPTURED THE LARGEST SHARE OF THE ASIA-PACIFIC MARKET
  • FIGURE 13: CONNECTIVITY IC (WI-FI + ETHERNET) EXPECTED TO DOMINATE THE CONSUMER ELECTRONICS MARKET DURING THE FORECAST PERIOD
  • FIGURE 14: IOT CHIP MARKET IS CURRENTLY IN THE GROWTH STAGE IN APAC, EUROPE, AND NORTH AMERICA
  • FIGURE 15: MARKET: BY GEOGRAPHY
  • FIGURE 16: EVOLUTION OF THE INTERNET OF THINGS MARKET
  • FIGURE 17: INTEGRATION OF CONNECTIVITY CAPABILITIES IN A LARGE NUMBER OF DEVICES AND APPLICATIONS ACTS AS THE MAJOR DRIVING FACTOR FOR THE MARKET
  • FIGURE 18: GLOBAL SMARTPHONE SHIPMENTS, 2012-2017 (MILLION UNITS)
  • FIGURE 19: VALUE CHAIN ANALYSIS (2015): IOT CHIP MARKET
  • FIGURE 20: PORTER'S FIVE FORCES ANALYSIS (2015)
  • FIGURE 21: IOT CHIP MARKET: PORTER'S FIVE FORCES ANALYSIS, 2015
  • FIGURE 22: INTENSITY OF COMPETITIVE RIVALRY: HIGH DUE TO THE HEAVY COMPETITION AMONG EXISTING PLAYERS
  • FIGURE 23: THREAT OF SUBSTITUTES TO BE LOW AS NO MAJOR SUBSTITUTE IS AVAILABLE FOR IOT CHIP
  • FIGURE 24: BARGAINING POWER OF BUYERS WOULD BE HIGH AS THE SWITCHING COST IS LOW
  • FIGURE 25: BARGAINING POWER OF SUPPLIERS: PRODUCT DIFFERENTIATION IN IOT CHIP MARKET WOULD DRIVE THE MARKET FOR SUPPLIERS DURING THE FORECAST PERIOD
  • FIGURE 26: THREAT OF NEW ENTRANTS: LOW AS THE ESTABLISHED PLAYERS HAVE A STRONG PRESENCE IN THE MARKET
  • FIGURE 27: IOT CHIP MARKET, BY APPLICATION VERTICAL
  • FIGURE 28: APPLICATION PROCESSOR EXPECTED TO DOMINATE THE WEARABLE DEVICE APPLICATION MARKET FOR IOT CHIP
  • FIGURE 29: APAC MARKET FOR IOT CHIP IN WEARABLE DEVICES EXPECTED TO GROW AT THE HIGHEST RATE
  • FIGURE 30: BLOOD GLUCOSE SENSOR MARKET IN HEALTHCARE APPLICATION EXPECTED TO GROW AT THE HIGHEST CAGR
  • FIGURE 31: NORTH AMERICA EXPECTED TO DOMINATE THE IOT CHIP MARKET IN HEALTHCARE APPLICATIONS IN 2016
  • FIGURE 32: CONNECTIVITY IC (WI-FI + NFC) EXPECTED TO GROW AT THE HIGHEST RATE IN THE CONSUMER ELECTRONICS APPLICATION DURING THE FORECAST PERIOD
  • FIGURE 33: APAC MARKET FOR IOT CHIP FOR CONSUMER ELECTRONICS APPLICATION EXPECTED TO GROW AT THE HIGHEST RATE
  • FIGURE 34: CONNECTIVITY IC DOMINATED THE BUILDING AUTOMATION APPLICATION SEGMENT OF THE IOT CHIP MARKET
  • FIGURE 35: APAC EXPECTED TO GROW AT THE HIGHEST RATE FOR THE IOT CHIP MARKET IN THE BUILDING AUTOMATION APPLICATION
  • FIGURE 36: CONNECTIVITY IC MARKET EXPECTED TO DOMINATE THE INDUSTRIAL APPLICATION SEGMENT DURING THE FORECAST PERIOD
  • FIGURE 37: APAC REGION TO GROW AT THE HIGHEST RATE FOR THE INDUSTRIAL APPLICATION FOR IOT CHIP MARKET
  • FIGURE 38: CONNECTIVITY IC EXPECTED TO DOMINATE THE AUTOMOTIVE & TRANSPORTATION SEGMENT FOR IOT CHIP MARKET
  • FIGURE 39: APAC TO GROW FASTEST IN THE AUTOMOTIVE & TRANSPORTATION APPLICATION FOR IOT CHIP MARKET
  • FIGURE 40: IOT CHIP MARKET, BY GEOGRAPHY
  • FIGURE 41: THE APAC MARKET IS ESTIMATED TO GROW AT THE HIGHEST RATE BETWEEN 2016 AND 2022
  • FIGURE 42: NORTH AMERICA MARKET SNAPSHOT: MARKET IS EXPECTED TO BE DRIVEN BY INCREASED R&D IN IOT
  • FIGURE 43: EUROPE MARKET SNAPSHOT: MARKET EXPECTED TO BE DRIVEN BY THE INITIATIVES TAKEN BY GOVERNMENTS OF VARIOUS COUNTRIES FOR DEVELOPMENT IN IOT
  • FIGURE 44: ASIA-PACIFIC MARKET SNAPSHOT: MARKET EXPECTED TO BE DRIVEN BY THE INCREASING NUMBER OF CONNECTED DEVICES
  • FIGURE 45: ROW MARKET SNAPSHOT: MARKET EXPECTED TO BE DRIVEN BY THE INCREASING DEVELOPMENT OF INTERNET OF THINGS
  • FIGURE 46: KEY GROWTH STRATEGIES ADOPTED BY TOP COMPANIES BETWEEN 2012 AND 2015
  • FIGURE 47: MARKET EVALUATION FRAMEWORK: NEW PRODUCT LAUNCHES FUELED GROWTH AND INNOVATION IN 2013 AND 2014
  • FIGURE 48: BATTLE FOR MARKET SHARE: NEW PRODUCT LAUNCHES WAS THE KEY STRATEGY
  • FIGURE 49: INTEL CORPORATION: COMPANY SNAPSHOT
  • FIGURE 50: INTEL CORPORATION: SWOT ANALYSIS
  • FIGURE 51: QUALCOMM INC.: COMPANY SNAPSHOT
  • FIGURE 52: QUALCOMM INC.: SWOT ANALYSIS
  • FIGURE 53: FREESCALE SEMICONDUCTOR: COMPANY SNAPSHOT
  • FIGURE 54: FREESCALE SEMICONDUCTOR: SWOT ANALYSIS
  • FIGURE 55: TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT
  • FIGURE 56: TEXAS INSTRUMENTS INCORPORATED: SWOT ANALYSIS
  • FIGURE 57: NXP SEMICONDUCTORS: COMPANY SNAPSHOT
  • FIGURE 58: NXP SEMICONDUCTORS: SWOT ANALYSIS
  • FIGURE 59: ARM HOLDINGS PLC.: COMPANY SNAPSHOT
  • FIGURE 60: ATMEL CORPORATION: COMPANY SNAPSHOT
  • FIGURE 61: MEDIATEK INC.: COMPANY SNAPSHOT
  • FIGURE 62: MICROCHIP TECHNOLOGY INC.: COMPANY SNAPSHOT
  • FIGURE 63: RENESAS ELECTRONIC CORPORATION: COMPANY SNAPSHOT
  • FIGURE 64: STMICROELECTRONICS N.V.: COMPANY SNAPSHOT
Back to Top