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市場調查報告書

抗輻射強化電子零件全球市場至2022年預測 - 電源管理、ASIC、邏輯、記憶體、FPGA

Radiation-Hardened Electronics Market by Component (Power Management, ASIC, Logic, Memory & FPGA), Manufacturing Technique (RHBD & RHBP), Application, and Geography - Global Forecast to 2022

出版商 MarketsandMarkets 商品編碼 321228
出版日期 內容資訊 英文 164 Pages
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抗輻射強化電子零件全球市場至2022年預測 - 電源管理、ASIC、邏輯、記憶體、FPGA Radiation-Hardened Electronics Market by Component (Power Management, ASIC, Logic, Memory & FPGA), Manufacturing Technique (RHBD & RHBP), Application, and Geography - Global Forecast to 2022
出版日期: 2016年10月18日 內容資訊: 英文 164 Pages
簡介

全球抗輻射強化電子設備市場規模2015年達9億3590萬美元。今後4.46%預計將以CAGR (年複合成長率) 擴大、2022年預計可達12億7740萬美元。航空、防衛產業FPGA、多核心處理器技術的進步與通訊衛星需求擴大、是主要的市場促進因素。高額開發、設計成本則阻礙市場成長。地區分類中現在以北美為最大市場、亞太地區各國需求預計將急速擴大。

本報告針對抗輻射強化電子零件全球市場、提供零件、製造手法、服務、用途、地區分類與其變化預測、市場現況、發展影響因素、競爭環境、有力企業最新調查、分析情報。

第1章 介紹

第2章 調查方法

第3章 摘要整理

第4章 特分類記載考察點

第5章 抗輻射強化電子零件全球市場:概要

  • 介紹
  • 市場發展:抗輻射強化電子零件
  • 市場分類
  • 市場動態
    • 促進因素
      • 全球規模ISR (情報、監視、偵察) 活動活化
      • 防衛、航空宇宙用途FPGA、多核心處理器技術進步
      • 通訊衛星部門的抗輻射強化電子零件需要
    • 阻礙因素
      • 現實試驗環境設定的困難性
      • 大量的開發、設計費用
    • 機會
      • 全球各地研究開發(R&D) 機會
      • 可再構成的抗輻射強化電子零件需求擴大
    • 課題
      • 尖端需求顧客的高度客製化要求

第6章 抗輻射強化電子零件全球市場:產業動向

  • 介紹
  • 價值鏈分析
  • Porter五力分析

第7章 抗輻射強化電子零件全球市場:零件分類

  • 介紹
    • 電源管理 (電力管理)
      • LDO (低壓差) 線性調節器
      • MOFSET二極管
    • ASIC (特定用途的集積回路)
    • 記憶體
      • DRAM
      • SRAM
      • NVM (非發揮性記憶體)
      • 其他
    • 邏輯
    • FPGA

第8章 抗輻射強化電子零件全球市場:製造方法分類

  • 介紹
  • RHBD (製造技術對策: Radiation Hardening by Design)
  • RHBP (設計技術對策: Radiation Hardening by Process)

第9章 抗輻射強化電子零件全球市場:用途分類

  • 介紹
  • 宇宙 (衛星)
    • 商業衛星
    • 軍事衛星
  • 航空宇宙、防衛
  • 核能發電廠

第10章 抗輻射強化電子零件材料選擇與組合種類

  • 介紹
    • 材料選定
    • 碳化矽 (SIC)
    • 氮化鎵 (GAN)
  • 組合種類
    • 覆晶技術
    • 陶瓷封裝

第11章 抗輻射強化電子零件全球市場:地區分析

  • 介紹
  • 北美
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 俄羅斯
    • 德國
    • 英國
    • 法國
    • 其他歐洲國家 (北歐、西班牙、義大利)
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 其他 (澳洲、斯里蘭卡、新加坡)
  • 其他國家 (RoW)
    • 中東、非洲
    • 拉丁美洲

第12章 競爭環境

  • 概要
  • 市場排名分析
  • 競爭狀況與動向
    • 新產品發售
    • 事業合作、協定、事業擴張
    • 企業合併、收購 (M&A)

第13章 企業檔案

  • 介紹
  • BAE SYSTEMS PLC
  • HONEYWELL AEROSPACE
  • MICROSEMI CORP.
  • ATMEL CORP.
  • XILINX, INC.
  • TEXAS INSTRUMENTS, INC.
  • ST MICROELECTRONICS NV
  • MAXWELL TECHNOLOGIES, INC.
  • INTERSIL CORPORATION
  • LINEAR TECHNOLOGY CORPORATION
  • 抗輻射強化電子零件市場主要技術開發企業

第14章 附錄

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目錄
Product Code: SE 2934

Advancements in FPGA & multicore processor technologies for defense and space applications is fueling the growth of the radiation-hardened electronics market

The global radiation-hardened electronics market was valued at USD 935.9 million in 2015 and is expected to reach USD 1,277.4 million by 2022, growing at a CAGR of 4.46% between 2016 and 2022. Advancements in FPGA & multicore processor technologies for defense and space applications is one of the major factors fueling the growth of this market. In addition, the demand from the communication satellite segment for rad-hard electronics is also expected to drive the growth of the radiation-hardened electronics market. The key restraining factor for the growth of the radiation-hardened electronics market is the high cost of development and design associated with the development of rad-hard components.

The radiation-hardened electronics market for space applications is expected to grow at a high rate during the forecast period.

Factors such as, increased demand from commercial and military satellite industry for radiation-hardened electronic components, has led to the growth of rad-hard market in these applications. On the other hand, the increased bandwidth requirements and the need for pointing of telecommunication satellites, and the demand for rad-hard components such as multiplexers, diodes, and detectors is also growing in these applications.

North Americas and APAC are the major markets for radiation-hardened electronics.

North America is expected to hold the largest share of the radiation-hardened electronics market during the forecast period, while the market in APAC is expected to grow at the highest rate during the same period. China, Japan, and India are some of the major countries driving the growth of the radiation-hardened electronics market in APAC. A significant number of prominent companies offering radiation-hardened electronic components are based out of North America and APAC. This is one of the major factors driving the growth of the radiation-hardened electronics market in North America and APAC.

In the process of determining and verifying the market size for several segments and subsegments gathered through secondary research, extensive primary interviews have been conducted with key people in the radiation-hardened electronics industry. The break-up of primary participants for the report has been shown below:

  • By Company Type: Tier 1 - 35 %, Tier 2 - 45%, and Tier 3 - 20%
  • By Designation: C-Level- 35%, Director Level - 25%, and Others - 40%
  • By Region: North America - 45%, Europe - 20%, APAC - 30%, and RoW - 5%

The report also profiles the key players in the radiation-hardened electronics market and analyzes their market ranking. The prominent players profiled in this report are BAE Systems (U.K.), Honeywell Aerospace (U.S.), Microsemi Corporation (U.S.), Atmel Corporation (U.S.) Xilinx, Inc. (U.S.), Intersil Corporation (U.S.), Texas Instruments, Inc. (U.S.), STMicroelectronics NV (Switzerland), Maxwell Technologies, Inc. (U.S.), and Linear Technology Corporation (U.S.), among others.

Research Coverage:

This research report categorizes the global radiation-hardened electronics market on the basis of component, manufacturing technique, application, and geography. The report also provides the Porter's five forces analysis, along with a description of each of its forces and their respective impact on the radiation-hardened electronics market; description of major drivers, restraints, challenges, and opportunities pertaining to the market; value chain analysis; and market ranking analysis.

Reasons to Buy the Report:

The report would help leaders/new entrants in this market in the following ways:

  • 1. This report segments the radiation-hardened electronics market comprehensively and provides the closest market size estimation for all subsegments across different regions.
  • 2. The report helps stakeholders understand the pulse of the market and provides them with the information on key drivers, restraints, challenges, and opportunities for market growth.
  • 3. This report would help stakeholders understand their competitors better and gain more insights to improve their position in the business. The competitive landscape section includes competitor ecosystem, new product developments, partnerships, and mergers & acquisitions.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. OBJECTIVES OF THE STUDY
  • 1.2. MARKET DEFINITION
  • 1.3. STUDY SCOPE
    • 1.3.1. MARKETS COVERED
    • 1.3.2. YEARS CONSIDERED FOR THE STUDY
  • 1.4. CURRENCY
  • 1.5. LIMITATIONS
  • 1.6. STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Key data from secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Key data from primary sources
      • 2.1.2.2. Key industry insights
      • 2.1.2.3. Breakdown of primaries
  • 2.2. MARKET SIZE ESTIMATION
  • 2.3. MARKET BREAKDOWN AND DATA TRIANGULATION
  • 2.4. ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHTS

  • 4.1. SIGNIFICANT MARKET OPPORTUNITIES IN THE RADIATION-HARDENED ELECTRONICS MARKET
  • 4.2. RADIATION-HARDENED ELECTRONICS MARKET ANALYSIS, BY COMPONENT
  • 4.3. RADIATION-HARDENED ELECTRONICS MARKET ANALYSIS, BY APPLICATION, 2015
  • 4.4. RADIATION-HARDENED ELECTRONICS MARKET ANALYSIS, BY MANUFACTURING TECHNIQUE, 2015
  • 4.5. RADIATION-HARDENED ELECTRONICS MARKET SHARE, BY REGION

5. MARKET OVERVIEW

  • 5.1. INTRODUCTION
  • 5.2. EVOLUTION: RADIATION-HARDENED ELECTRONICS MARKET
  • 5.3. MARKET SEGMENTATION
    • 5.3.1. BY COMPONENT
    • 5.3.2. BY MANUFACTURING TECHNIQUE
    • 5.3.3. BY APPLICATION
    • 5.3.4. BY REGION
  • 5.4. MARKET DYNAMICS
    • 5.4.1. DRIVERS
      • 5.4.1.1. Increased global intelligence, surveillance, & reconnaissance (ISR) operations
      • 5.4.1.2. Advancements in FPGA & multicore processor technologies for defense and space applications
      • 5.4.1.3. Demand from the communication satellite segment for rad-hard electronics
    • 5.4.2. RESTRAINTS
      • 5.4.2.1. Difficulties in creating actual testing environment
      • 5.4.2.2. High costs of development and design
    • 5.4.3. OPPORTUNITIES
      • 5.4.3.1. Research & development opportunities around the globe
      • 5.4.3.2. Growing requirements for reconfigurable rad-hard components
    • 5.4.4. CHALLENGES
      • 5.4.4.1. Highly customized requirements of high-end consumers

6. INDUSTRY TRENDS

  • 6.1. INTRODUCTION
  • 6.2. VALUE CHAIN ANALYSIS
  • 6.3. PORTER'S FIVE FORCES ANALYSIS
    • 6.3.1. THREAT OF NEW ENTRANTS
    • 6.3.2. THREAT OF SUBSTITUTES
    • 6.3.3. BARGAINING POWER OF SUPPLIERS
    • 6.3.4. BARGAINING POWER OF BUYERS
    • 6.3.5. INTENSITY OF COMPETITIVE RIVALRY

7. RADIATION-HARDENED (RAD-HARD) ELECTRONICS MARKET, BY COMPONENT

  • 7.1. INTRODUCTION
    • 7.1.1. POWER MANAGEMENT
      • 7.1.1.1. LDO linear regulators
      • 7.1.1.2. MOSFETs & diodes
    • 7.1.2. APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC)
    • 7.1.3. MEMORY
      • 7.1.3.1. Dynamic random-access memory (DRAM)
      • 7.1.3.2. Static random-access memory (SRAM)
      • 7.1.3.3. Non-volatile memories (NVMs)
      • 7.1.3.4. Others
    • 7.1.4. LOGIC
    • 7.1.5. FIELD-PROGRAMMABLE GATE ARRAY (FPGA)

8. RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE

  • 8.1. INTRODUCTION
  • 8.2. RADIATION HARDENING BY DESIGN (RHBD)
  • 8.3. RADIATION HARDENING BY PROCESS (RHBP)

9. RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION

  • 9.1. INTRODUCTION
  • 9.2. SPACE (SATELLITES)
    • 9.2.1. COMMERCIAL
    • 9.2.2. MILITARY
  • 9.3. AEROSPACE & DEFENSE
  • 9.4. NUCLEAR POWER PLANTS

10. MATERIAL SELECTION AND PACKAGING TYPES IN RADIATION-HARDENED ELECTRONICS MARKET

  • 10.1. INTRODUCTION
    • 10.1.1. MATERIAL SELECTION
    • 10.1.2. SILICON
    • 10.1.3. SILICON CARBIDE (SIC)
    • 10.1.4. GALLIUM NITRIDE (GAN)
  • 10.2. PACKAGING TYPES
    • 10.2.1. FLIP-CHIP
    • 10.2.2. CERAMIC PACKAGES

11. GEOGRAPHIC ANALYSIS

  • 11.1. INTRODUCTION
  • 11.2. NORTH AMERICA
    • 11.2.1. U.S.
    • 11.2.2. CANADA
    • 11.2.3. MEXICO
  • 11.3. EUROPE
    • 11.3.1. RUSSIA
    • 11.3.2. GERMANY
    • 11.3.3. U.K.
    • 11.3.4. FRANCE
    • 11.3.5. REST OF EUROPE (SCANDINAVIA, SPAIN, ITALY)
  • 11.4. ASIA-PACIFIC
    • 11.4.1. CHINA
    • 11.4.2. INDIA
    • 11.4.3. JAPAN
    • 11.4.4. SOUTH KOREA
    • 11.4.5. REST OF APAC (AUSTRALIA, SRILANKA & SINGAPORE)
  • 11.5. REST OF THE WORLD (ROW)
    • 11.5.1. MIDDLE EAST & AFRICA
    • 11.5.2. LATIN AMERICA

12. COMPETITIVE LANDSCAPE

  • 12.1. OVERVIEW
  • 12.2. MARKET RANKING ANALYSIS
  • 12.3. COMPETITIVE SITUATION AND TRENDS
    • 12.3.1. NEW PRODUCT LAUNCHES
    • 12.3.2. COLLABORATION ,AGREEMENT, & EXPANSIONS, 2014-2016
    • 12.3.3. MERGERS & ACQUISITIONS, 2014-2016

13. COMPANY PROFILE (Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, Ratio Analysis, MnM View)*

  • 13.1. INTRODUCTION
  • 13.2. BAE SYSTEMS PLC
  • 13.3. HONEYWELL AEROSPACE
  • 13.4. MICROSEMI CORP.
  • 13.5. ATMEL CORP.
  • 13.6. XILINX, INC.
  • 13.7. TEXAS INSTRUMENTS, INC.
  • 13.8. ST MICROELECTRONICS NV
  • 13.9. MAXWELL TECHNOLOGIES, INC.
  • 13.10. INTERSIL CORPORATION
  • 13.11. LINEAR TECHNOLOGY CORPORATION
  • 13.12. KEY INNOVATORS IN THE RADIATION-HARDENED ELECTRONICS MARKET

*Details on Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, MnM View might not be captured in case of unlisted companies.

14. APPENDIX

  • 14.1. INSIGHTS OF INDUSTRY EXPERTS
  • 14.2. DISCUSSION GUIDE
  • 14.3. KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 14.4. INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE
  • 14.5. AVAILABLE CUSTOMIZATIONS
  • 14.6. RELATED REPORTS

LIST OF TABLES

  • TABLE 1: PORTER'S FIVE FORCES ANALYSIS: THREAT OF SUBSTITUTES LIKELY TO HAVE THE HIGHEST IMPACT ON THE OVERALL MARKET IN 2015
  • TABLE 2: RADIATION-HARDENED ELECTRONICS, BY COMPONENT, 2013-2022 (USD MILLION)
  • TABLE 3: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2013-2022 (THOUSAND UNITS)
  • TABLE 4: RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS, BY TYPE, 2013-2022 (USD MILLION)
  • TABLE 5: RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS, BY TYPE, 2013-2022 (THOUSAND UNITS)
  • TABLE 6: RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 7: RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS, BY REGION, 2013-2022 (THOUSAND UNITS)
  • TABLE 8: RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 9: RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS IN NORTH AMERICA, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 10: RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 11: RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS IN EUROPE, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 12: RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 13: RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS IN APAC, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 14: RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 15: RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS, BY REGION, 2013-2022 (THOUSAND UNITS)
  • TABLE 16: RADIATION-HARDENED ELECTRONICS MARKET FOR ASICS, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 17: RADIATION-HARDENED ELECTRONICS MARKET FOR ASICS, BY REGION, 2013-2022 (THOUSAND UNITS)
  • TABLE 18: RADIATION-HARDENED ELECTRONICS MARKET FOR ASICS IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 19: RADIATION-HARDENED ELECTRONICS MARKET FOR ASICS IN NORTH AMERICA, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 20: RADIATION-HARDENED ELECTRONICS MARKET FOR ASICS IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 21: RADIATION-HARDENED ELECTRONICS MARKET FOR ASICS IN EUROPE, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 22: RADIATION-HARDENED ELECTRONICS MARKET FOR ASICS IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 23: RADIATION-HARDENED ELECTRONICS MARKET FOR ASICS IN APAC, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 24: RADIATION-HARDENED ELECTRONICS MARKET FOR ASICS IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 25: RADIATION-HARDENED ELECTRONICS MARKET FOR ASICS IN ROW, BY REGION, 2013-2022 (THOUSAND UNITS)
  • TABLE 26: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY COMPONENT, 2013-2022 (USD MILLION)
  • TABLE 27: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY COMPONENT, 2013-2022 (THOUSAND UNITS)
  • TABLE 28: RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENTS, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 29: RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENTS, BY REGION, 2013-2022 (THOUSAND UNITS)
  • TABLE 30: RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENTS IN NORTH AMERICA, BY COUNTRY, 2014-2022 (USD MILLION)
  • TABLE 31: RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENTS IN NORTH AMERICA, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 32: RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENTS IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 33: RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENTS IN EUROPE, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 34: RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENTS IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 35: RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENTS IN APAC, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 36: RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENTS IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 37: RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENTS IN ROW, BY REGION, 2013-2022 (THOUSAND UNITS)
  • TABLE 38: RADIATION-HARDENED ELECTRONICS MARKET, BY LOGIC COMPONENT, 2013-2022 (USD MILLION)
  • TABLE 39: RADIATION-HARDENED ELECTRONICS MARKET FOR PROCESSORS & CONTROLLERS, BY TYPE, 2013-2022 (USD MILLION)
  • TABLE 40: RADIATION-HARDENED ELECTRONICS MARKET, BY LOGIC COMPONENT, 2013-2022 (THOUSAND UNITS)
  • TABLE 41: RADIATION-HARDENED ELECTRONICS MARKET FOR LOGIC COMPONENTS, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 42: RADIATION-HARDENED ELECTRONICS MARKET FOR LOGIC COMPONENTS, BY REGION, 2013-2022 (THOUSAND UNITS)
  • TABLE 43: RADIATION-HARDENED ELECTRONICS MARKET FOR LOGIC COMPONENTS IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 44: RADIATION-HARDENED ELECTRONICS MARKET FOR LOGIC COMPONENTS IN NORTH AMERICA, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 45: RADIATION-HARDENED ELECTRONICS MARKET FOR LOGIC COMPONENTS IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 46: RADIATION-HARDENED ELECTRONICS MARKET FOR LOGIC COMPONENTS IN EUROPE, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 47: RADIATION-HARDENED ELECTRONICS MARKET FOR LOGIC COMPONENTS, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 48: RADIATION-HARDENED ELECTRONICS MARKET FOR LOGIC COMPONENTS IN APAC, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 49: RADIATION-HARDENED ELECTRONICS MARKET FOR LOGIC COMPONENTS IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 50: RADIATION-HARDENED ELECTRONICS MARKET FOR LOGIC COMPONENTS IN ROW, BY REGION, 2013-2022 (THOUSAND UNITS)
  • TABLE 51: RADIATION-HARDENED ELECTRONICS MARKET FOR FPGA, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 52: RADIATION-HARDENED ELECTRONICS MARKET FOR FPGA, BY REGION, 2013-2022 (THOUSAND UNITS)
  • TABLE 53: RADIATION-HARDENED ELECTRONICS MARKET FOR FPGA COMPONENTS IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 54: RADIATION-HARDENED ELECTRONICS MARKET FOR FPGA COMPONENTS IN NORTH AMERICA, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 55: RADIATION-HARDENED ELECTRONICS MARKET FOR FPGA COMPONENTS IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 56: RADIATION-HARDENED ELECTRONICS MARKET FOR FPGA COMPONENTS IN EUROPE, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 57: RADIATION-HARDENED ELECTRONICS MARKET FOR FPGA COMPONENT IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 58: RADIATION-HARDENED ELECTRONICS MARKET FOR FPGA COMPONENTS IN APAC, BY COUNTRY, 2013-2022 (THOUSAND UNITS)
  • TABLE 59: RADIATION-HARDENED ELECTRONICS MARKET FOR FPGA COMPONENTS, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 60: RADIATION-HARDENED ELECTRONICS MARKET FOR FPGA COMPONENTS IN ROW, BY REGION, 2013-2022 (THOUSAND UNITS)
  • TABLE 61: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE), 2013-2022 (USD MILLION)
  • TABLE 62: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2013-2022 (USD MILLION)
  • TABLE 63: RADIATION-HARDENED ELECTRONICS MARKET FOR SPACE APPLICATION, BY TYPE, 2013-2022 (USD MILLION)
  • TABLE 64: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 65: RADIATION-HARDENED ELECTRONICS MARKET IN NORTH AMERICA, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 66: RADIATION-HARDENED ELECTRONICS MARKET IN NORTH AMERICA, BY COMPONENT, 2013-2022 (USD MILLION)
  • TABLE 67: RADIATION-HARDENED ELECTRONICS MARKET IN EUROPE, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 68: RADIATION-HARDENED ELECTRONICS MARKET IN EUROPE, BY COMPONENT, 2013-2022 (USD MILLION)
  • TABLE 69: RADIATION-HARDENED ELECTRONICS MARKET IN APAC, BY COUNTRY, 2013-2022 (USD MILLION)
  • TABLE 70: RADIATION-HARDENED ELECTRONICS MARKET IN APAC, BY COMPONENT, 2013-2022 (USD MILLION)
  • TABLE 71: RADIATION-HARDENED ELECTRONICS MARKET IN ROW, BY REGION, 2013-2022 (USD MILLION)
  • TABLE 72: RADIATION-HARDENED ELECTRONICS MARKET IN ROW, BY COMPONENT, 2013-2022 (USD MILLION)
  • TABLE 73: NEW PRODUCT LAUNCHES, 2016
  • TABLE 74: COLLABORATIONS, PARTNERSHIPS, & CONTRACTS, 2014-2016
  • TABLE 75: MERGERS/ACQUISITIONS, 2014-2016

LIST OF FIGURES

  • FIGURE 1: RESEARCH DESIGN
  • FIGURE 2: RESEARCH FLOW
  • FIGURE 3: BOTTOM-UP APPROACH
  • FIGURE 4: TOP-DOWN APPROACH
  • FIGURE 5: DATA TRIANGULATION
  • FIGURE 6: RADIATION-HARDENED ELECTRONICS MARKET SIZE: VALUE VS. VOLUME, 2013-2022
  • FIGURE 7: MARKET SHARE OF RADIATION-HARDENED ELECTRONICS COMPONENTS, 2013-2022
  • FIGURE 8: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2015
  • FIGURE 9: RADIATION-HARDENED ELECTRONICS MARKET, INDUSTRY RANKING ANALYSIS, 2015
  • FIGURE 10: NORTH AMERICA HELD THE LARGEST SHARE OF THE RADIATION-HARDENED ELECTRONICS MARKET IN 2015
  • FIGURE 11: RADIATION-HARDENED ELECTRONICS MARKET EXPECTED TO HAVE ATTRACTIVE GROWTH OPPORTUNITIES BETWEEN 2016 AND 2022
  • FIGURE 12: POWER MANAGEMENT COMPONENT TO HOLD THE LEADING POSITION BETWEEN 2016 AND 2022
  • FIGURE 13: SPACE APPLICATION TO CONTINUE TO LEAD THE RADIATION-HARDENED ELECTRONICS MARKET BETWEEN 2016 AND 2022
  • FIGURE 14: RADIATION HARDENING BY DESIGN HELD THE LARGEST MARKET SHARE IN THE RAD-HARD MARKET, 2015
  • FIGURE 15: THE U.S. HELD THE LARGEST MARKET SHARE IN 2015
  • FIGURE 16: EVOLUTION OF RADIATION-HARDENED ELECTRONICS TECHNOLOGY
  • FIGURE 17: COMMUNICATIONS SATELLITE SEGMENT TO PROPEL THE DEMAND FOR THE RADIATION-HARDENED ELECTRONICS MARKET
  • FIGURE 18: VALUE CHAIN ANALYSIS: MAJOR VALUE IS ADDED DURING THE MATERIAL SELECTION, FABRICATION, &PACKAGING AND INTERFACING & SOFTWARE DEVELOPMENT STAGES, 2015
  • FIGURE 19: RADIATION-HARDENED ELECTRONICS: PORTER'S FIVE FORCES ANALYSIS, 2015
  • FIGURE 20: PORTERS FIVE FORCE ANALYSIS OF THE RADIATION-HARDENED ELECTRONICS MARKET
  • FIGURE 21: LOW IMPACT OF THREAT OF NEW ENTRANTS DUE TO HIGH CAPITAL REQUIRED
  • FIGURE 22: HIGH IMPACT OF THREAT OF NEW SUBSTITUTES BECAUSE OF THE HIGH CONSUMER SWITCHING COSTS
  • FIGURE 23: HIGH IMPACT OF BARGAINING POWER OF SUPPLIERS DUE TO THE BRAND EQUITY OF SUPPLIERS
  • FIGURE 24: LOW IMPACT OF BARGAINING POWER OF BUYERS DUE TO LOW BUYER TO SUPPLIER RATIO IN THE MARKET
  • FIGURE 25: INTENSITY OF COMPETITIVE RIVALRY IS MEDIUM IN THE MARKET DUE TO A NUMBER OF LARGE INDUSTRY PLAYERS
  • FIGURE 26: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT
  • FIGURE 27: POWER MANAGEMENT EXPECTED TO LEAD THE RADIATION-HARDENED ELECTRONICS MARKET DURING THE FORECAST PERIOD
  • FIGURE 28: RADIATION-HARDENED ELECTRONICS MARKET, IN TERMS OF VOLUME, BY COMPONENT, 2015 (THOUSAND UNITS)
  • FIGURE 29: LDO REGULATORS HELD THE LARGEST SIZE OF THE RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS IN 2015
  • FIGURE 30: NORTH AMERICA HELD THE LARGEST SIZE OF THE RADIATION-HARDENED ELECTRONICS MARKET FOR POWER MANAGEMENT COMPONENTS IN 2015
  • FIGURE 31: NORTH AMERICA HELD THE LARGEST SIZE OF THE RAD-HARD MARKET, IN TERMS OF VOLUME, FOR POWER MANAGEMENT COMPONENTS DURING THE FORECAST PERIOD
  • FIGURE 32: NORTH AMERICA HELD THE LARGEST SIZE OF THE RAD-HARD MARKET FOR ASICS IN 2015
  • FIGURE 33: NORTH AMERICA HELD THE LARGEST SIZE OF THE RAD-HARD MARKET, IN TERMS OF VOLUME, FOR ASICS IN 2015
  • FIGURE 34: U.S. EXPECTED TO LEAD THE NORTH AMERICAN MARKET FOR ASICS DURING THE FORECAST PERIOD
  • FIGURE 35: RUSSIA HELD THE LARGEST SHARE OF THE EUROPEAN RAD-HARD MARKET FOR ASICS IN 2015
  • FIGURE 36: RADIATION-HARDENED ELECTRONICS MARKET FOR ASICS IN APAC, IN TERMS OF VALUE & VOLUME, 2015
  • FIGURE 37: DRAM HELD THE LARGEST SIZE OF THE RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENTS IN 2015
  • FIGURE 38: NORTH AMERICA EXPECTED TO HOLD THE LARGEST SIZE OF THE RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENTS DURING THE FORECAST PERIOD
  • FIGURE 39: U.S. HELD THE LARGEST SIZE OF THE NORTH AMERICAN RADIATION-HARDENED ELECTRONICS MARKET FOR MEMORY COMPONENTS IN 2015
  • FIGURE 40: LATIN AMERICA TO SURPASS THE MIDDLE EAST MARKET IN THE ROW REGION DURING THE FORECAST PERIOD
  • FIGURE 41: PROCESSORS & CONTROLLERS EXPECTED TO DOMINATE THE RADIATION-HARDENED ELECTRONICS MARKET FOR LOGIC COMPONENTS DURING THE FORECAST PERIOD
  • FIGURE 42: NORTH AMERICA EXPECTED TO LEAD THE RAD-HARD MARKET FOR LOGIC COMPONENTS BETWEEN 2016 AND 2022
  • FIGURE 43: THE RAD-HARD MARKET IN NORTH AMERICA FOR LOGIC COMPONENTS, IN TERMS OF VALUE AND VOLUME, 2015
  • FIGURE 44: LOGIC COMPONENT MARKET IN ROW, VOLUME VS. VALUE, 2015
  • FIGURE 45: NORTH AMERICA EXPECTED TO LEAD THE RAD-HARD FPGA MARKET BETWEEN 2016 AND 2022
  • FIGURE 46: U.S. LED THE NORTH AMERICAN RAD-HARD MARKET FOR FPGA COMPONENTS IN 2015
  • FIGURE 47: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE
  • FIGURE 48: RHBD MANUFACTURING TECHNIQUE TO LEAD THE RAD-HARD MARKET THROUGHOUT THE FORECAST PERIOD
  • FIGURE 49: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION
  • FIGURE 50: KEY PLAYERS OF RAD-HARD MARKET SERVING IN MAJOR APPLICATION AREAS
  • FIGURE 51: SPACE APPLICATION TO WITNESS THE HIGHEST GROWTH RATE IN THE RAD-HARD MARKET BETWEEN 2016 AND 2022
  • FIGURE 52: COMMERCIAL SEGMENT HELD THE LARGEST SHARE OF THE RAD-HARD SPACE APPLICATION MARKET IN 2015
  • FIGURE 53: RADIATION-HARDENED ELECTRONICS: MATERIAL TYPES
  • FIGURE 54: RADIATION-HARDENED ELECTRONICS MARKET, BY GEOGRAPHY
  • FIGURE 55: GROWTH LIFECYCLE OF THE RADIATION-HARDENED ELECTRONICS MARKET IN MAJOR GEOGRAPHIES, 2015
  • FIGURE 56: NORTH AMERICA EXPECTED TO LEAD THE RADIATION-HARDENED ELECTRONICS MARKET DURING THE FORECAST PERIOD
  • FIGURE 57: NORTH AMERICA: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT (2015)
  • FIGURE 58: THE U.S. HELD THE LARGEST SHARE OF THE NORTH AMERICAN RADIATION-HARDENED ELECTRONICS MARKET IN 2015
  • FIGURE 59: EUROPE: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT (2015)
  • FIGURE 60: RUSSIA LED THE RADIATION-HARDENED ELECTRONICS MARKET IN EUROPE IN 2015
  • FIGURE 61: ASIA-PACIFIC: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT (2015)
  • FIGURE 62: CHINA TO BE THE LEADING MARKET FOR RADIATION-HARDENED ELECTRONICS IN ASIA-PACIFIC TILL 2022
  • FIGURE 63: POWER MANAGEMENT COMPONENT HELD THE LARGEST SHARE OF THE ROW MARKET IN 2015
  • FIGURE 64: COMPANIES ADOPTED NEW PRODUCT LAUNCH AS THE KEY GROWTH STRATEGY BETWEEN 2014 AND 2016
  • FIGURE 65: MARKET RANKING ANALYSIS IN THE RADIATION-HARDENED ELECTRONICS MARKET, 2015
  • FIGURE 66: MARKET EVOLUTION FRAMEWORK - NEW PRODUCT LAUNCHES FUELED GROWTH AND INNOVATION IN THE RADIATION-HARDENED ELECTRONICS MARKET BETWEEN 2014 AND 2016
  • FIGURE 67: BATTLE FOR MARKET SHARE: NEW PRODUCT LAUNCHES WAS THE KEY GROWTH STRATEGY, 2014-2016
  • FIGURE 68: REGIONAL REVENUE MIX OF MAJOR PLAYERS
  • FIGURE 69: BAE SYSTEMS PLC: COMPANY SNAPSHOT
  • FIGURE 70: BAE SYSTEMS: SWOT ANALYSIS
  • FIGURE 71: HONEYWELL AEROSPACE: COMPANY SNAPSHOT
  • FIGURE 72: HONEYWELL AEROSPACE: SWOT ANALYSIS
  • FIGURE 73: MICROSEMI CORP.: COMPANY SNAPSHOT
  • FIGURE 74: MICROSEMI CORP.: SWOT ANALYSIS
  • FIGURE 75: ATMEL CORP.: COMPANY SNAPSHOT
  • FIGURE 76: ATMEL CORP.: SWOT ANALYSIS
  • FIGURE 77: XILINX, INC.: COMPANY SNAPSHOT
  • FIGURE 78: XILINX INC.: SWOT ANALYSIS
  • FIGURE 79: TEXAS INSTRUMENTS, INC.: COMPANY SNAPSHOT
  • FIGURE 80: ST MICROELECTRONICS NV: COMPANY SNAPSHOT
  • FIGURE 81: MAXWELL TECHNOLOGIES INC.: COMPANY SNAPSHOT
  • FIGURE 82: INTERSIL CORPORATION: COMPANY SNAPSHOT
  • FIGURE 83: LINEAR TECHNOLOGY CORPORATION: COMPANY SNAPSHOT
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