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市場調查報告書

全球的絕緣層上矽市場

Global Silicon-on-Insulator Market

出版商 Markets and Markets
出版日期 2010年09月 商品編碼 134075
內容資訊 英文 136 Pages
價格
US $ 4650 PDF by E-mail (Single User License)
US $ 5650 PDF by E-mail (Multi User License)
US $ 7150 PDF by E-mail (Corporate Use License)
US $ 9000 PDF by E-mail (Enterprise Site licence)


全球的絕緣層上矽市場 是由出版商Markets and Markets在2010年09月所出版的。 這份英文市場調查報告書包含136 Pages 價格從美金4650起跳。

簡介

絕緣層上矽(SOI)晶片由於低電力消費與貼合電容的優點,在半導體業界逐漸被廣泛使用。因此,SOI裝置、元件市場預期在今後5年將呈現兩位數成長。

本報告,以市場區塊別分析絕緣層上矽市場,並彙整業績動向、市場機會、參與的主要企業的競爭與檔案資料等,由下列摘要形式闡述。

報告摘要

第1章 簡介

第2章 摘要

第3章 市場概要

  • 簡介
  • 絕緣層上矽(SOI)的發展
  • 半導體技術藍圖
  • 市場動向
  • 專利分析

第4章 預測與動向

  • 收益預測
  • 區域別動向
  • 價格動向
  • 終端使用者動向

第5章 SOI技術概要

  • SOI晶片製造技術
  • 新技術開發

第6章 競爭環境

  • 新產品・服務上市
  • 協議與合作
  • 其他動向

第7章 主要企業檔案資料

  • AMERICAN SEMICONDUCTOR, INC
  • ARM
  • ATMEL
  • FREESCALE SEMICONDUCTOR INC
  • GLOBALFOUNDRIES
  • HONEYWELL
  • IBM
  • LETI
  • NXP SEMICONDUCTOR
  • OKMETIC
  • PEREGRINE SEMICONDUCTOR
  • SOITEC
  • TRONICS MICROSYSTEMS
  • 其他

附錄

圖表

目錄

Abstract

Report Description

SOI wafers are gaining high popularity in the semiconductor industry due to their benefits of low power consumption and junction capacitance. SOI wafers hold the potential to replace bulk silicon wafers in semiconductor applications. The market for SOI devices and components is thus expected to show double-digit growth in the next five years. Existing studies and third-party market reports do not provide a comprehensive understanding of the SOI market and there is a lack of focus on its various applications. In contrast, this report sizes and analyzes the global SOI market by applications and by geography, which no other third-party report has done so far. The report also identifies and analyzes the market trends and growth opportunities for industry stakeholders.

Market Estimates and Forecasts

The report analyzes the global SOI market by types into two major submarkets:

  • Thick-film SOI wafer market
  • Thin-film SOI wafer market

The market data consists of aggregate sales figures for both thick-film and thin-film SOI wafer markets. The report sources key market developments from the top companies that it profiles. The report also identifies and analyzes the market drivers, trends, and opportunities in the global SOI market, along with the market' s top-selling products, key players, and competitive outlook. In addition, the report also provides more than 20 company profiles for the market.

What makes our reports unique?

  • We provide the longest market segmentation chain in this industry- not many reports provide market breakdown up to level 5.
  • We provide 10% customization. Normally it is seen that clients do not find specific market intelligence that they are looking for. Our customization will ensure that you necessarily get the market intelligence you are looking for and we get a loyal customer.
  • We conduct detailed market positioning, product positioning and competitive positioning. Entry strategies, gaps and opportunities are identified for all the stakeholders.
  • Comprehensive market analysis for the following sectors:
  • Pharmaceuticals, Medical Devices, Biotechnology, Semiconductor and Electronics, Energy and Power Supplies, Food and Beverages, Chemicals, Advanced Materials, Industrial Automation, and Telecom and IT. We also analyze retailers and super-retailers, technology providers, and research and development (R&D) companies.

Key questions answered

  • Which are the high-growth segments and how is the market segmented in terms of types and applications?
  • What are market estimates and forecasts; which markets are doing well and which are not?
  • Where are the gaps and opportunities; what is driving the market?
  • Which are the key playing fields? Which are the winning edge imperatives?
  • How is the competitive outlook; who are the main players in each of the segments; what are their strategic directives, operational strengths and product pipelines? Who is doing what?

Powerful Research and analysis

The analysts working with MarketsandMarkets come from renowned publishers and market research firms, globally, adding their expertise and domain understanding. We get the facts from over 22,000 news and information sources, a huge database of key industry participants and draw on our relationships with more than 900 market research companies across the world. We, at MarketsandMarkets, are inspired to help our clients grow by providing qualitative business insights with our huge market intelligence repository.

Table of Contents

EXECUTIVE SUMMARY

  • KEY FINDINGS
  • THICK-FILM SOI WAFER MARKET
  • THIN-FILM SOI WAFER MARKET
  • GEOGRAPHIC ANALYSIS
  • COMPETITIVE LANDSCAPE

1. INTRODUCTION

  • 1.1 KEY TAKE-AWAYS
  • 1.2 REPORT DESCRIPTION
  • 1.3 MARKETS COVERED
  • 1.4 RESEARCH METHODOLOGY
  • 1.5 STAKEHOLDERS

2. SUMMARY

3. MARKET OVERVIEW

  • 3.1 INTRODUCTION
    • 3.1.1 MARKET DEFINITION
    • 3.1.2 BENEFITS OF SOI
  • 3.2 EVOLUTION OF SOI
  • 3.3 SEMICONDUCTOR TECHNOLOGY NODE ROADMAP
  • 3.4 MARKET DYNAMICS
    • 3.4.1 DRIVERS
      • 3.4.1.1 Growth in application markets
      • 3.4.1.2 Increasing investments
      • 3.4.1.3 R&D initiatives
      • 3.4.1.4 Energy conservation
      • 3.4.1.5 Performance benefits of SOI
    • 3.4.2 RESTRAINTS
      • 3.4.2.1 High cost of SOI
      • 3.4.2.2 Lack of design knowledge and awareness
    • 3.4.3 OPPORTUNITIES
      • 3.4.3.1 SOI Industry Consortium initiatives
      • 3.4.3.2 SOI Design Hub
  • 3.5 PATENT ANALYSIS

4. FORECASTS AND TRENDS

  • 4.1 REVENUE FORECASTS
    • 4.1.1 GLOBAL SOI WAFER MARKET FORECASTS
    • 4.1.2 THIN-FILM SOI WAFER MARKET
    • 4.1.3 THICK-FILM SOI WAFER MARKET
  • 4.2 GEOGRAPHIC TRENDS
    • 4.2.1 NORTH AMERICA
    • 4.2.2 EUROPE
    • 4.2.3 ASIA PACIFIC
    • 4.2.4 REST OF WORLD (ROW)
  • 4.3 PRICING TRENDS
  • 4.4 END-USER TRENDS
    • 4.4.1 COMPUTING
    • 4.4.2 CONSUMER ELECTRONICS
    • 4.4.3 GAMING
    • 4.4.4 AUTOMOTIVE
    • 4.4.5 MEDICAL DEVICES
    • 4.4.6 SILICON PHOTONICS

5. SOI TECHNOLOGY OVERVIEW

  • 5.1 SOI WAFER FABRICATION TECHNIQUES
    • 5.1.1 SIMOX (SEPARATION BY IMPLANTATION OF OXYGEN)
    • 5.1.2 SMART CUT
    • 5.1.3 NANOCLEAVE
    • 5.1.4 ELTRAN (EPITAXIAL LAYER TRANSFER)
    • 5.1.5 BESOI
  • 5.2 NEW TECHNOLOGY DEVELOPMENTS
    • 5.2.1 PARTIALLY DEPLETED SOI
    • 5.2.2 FULLY-DEPLETED SOI

6. COMPETITIVE LANDSCAPE

  • 6.1 NEW PRODUCTS/SERVICES LAUNCH
  • 6.2 AGREEMENTS AND COLLABORATIONS
  • 6.3 OTHER DEVELOPMENTS

7. COMPANY PROFILES

  • 7.1 AMERICAN SEMICONDUCTOR, INC
    • 7.1.1 OVERVIEW
    • 7.1.2 PRODUCTS & SERVICES
    • 7.1.3 ANALYSIS
    • 7.1.4 DEVELOPMENTS
  • 7.2 ARM
    • 7.2.1 OVERVIEW
    • 7.2.2 PRODUCTS & SERVICES
    • 7.2.3 ANALYSIS
    • 7.2.4 DEVELOPMENTS
  • 7.3 ATMEL
    • 7.3.1 OVERVIEW
    • 7.3.2 PRODUCTS & SERVICES
    • 7.3.3 ANALYSIS
    • 7.3.4 DEVELOPMENTS
  • 7.4 FREESCALE SEMICONDUCTOR INC
    • 7.4.1 OVERVIEW
    • 7.4.2 PRODUCTS & SERVICES
    • 7.4.3 ANALYSIS
    • 7.4.4 DEVELOPMENTS
  • 7.5 GLOBALFOUNDRIES
    • 7.5.1 OVERVIEW
    • 7.5.2 PRODUCTS & SERVICES
    • 7.5.3 ANALYSIS
    • 7.5.4 DEVELOPMENTS
  • 7.6 HONEYWELL
    • 7.6.1 OVERVIEW
    • 7.6.2 PRODUCTS & SERVICES
    • 7.6.3 ANALYSIS
    • 7.6.4 DEVELOPMENTS
  • 7.7 IBM
    • 7.7.1 OVERVIEW
    • 7.7.2 PRODUCTS & SERVICES
    • 7.7.3 ANALYSIS
    • 7.7.4 DEVELOPMENTS
  • 7.8 LETI
    • 7.8.1 OVERVIEW
    • 7.8.2 PRODUCTS & SERVICES
    • 7.8.3 ANALYSIS
    • 7.8.4 DEVELOPMENTS
  • 7.9 NXP SEMICONDUCTOR
    • 7.9.1 OVERVIEW
    • 7.9.2 PRODUCTS & SERVICES
    • 7.9.3 ANALYSIS
    • 7.9.4 DEVELOPMENTS
  • 7.10 OKMETIC
    • 7.10.1 OVERVIEW
    • 7.10.2 PRODUCTS & SERVICES
    • 7.10.3 ANALYSIS
    • 7.10.4 DEVELOPMENTS
  • 7.11 PEREGRINE SEMICONDUCTOR
    • 7.11.1 OVERVIEW
    • 7.11.2 PRODUCTS & SERVICES
    • 7.11.3 ANALYSIS
    • 7.11.4 DEVELOPMENTS
  • 7.12 SOITEC
    • 7.12.1 OVERVIEW
    • 7.12.2 PRODUCTS & SERVICES
    • 7.12.3 ANALYSIS
    • 7.12.4 DEVELOPMENTS
  • 7.13 TRONICS MICROSYSTEMS
    • 7.13.1 OVERVIEW
    • 7.13.2 PRODUCTS & SERVICES
    • 7.13.3 ANALYSIS
    • 7.13.4 DEVELOPMENTS
  • 7.14 OTHERS
    • 7.14.1 ICEMOS TECHNOLOGY
    • 7.14.2 INNOVATIVE SILICON
    • 7.14.3 MEMC ELECTRONIC MATERIALS INC
    • 7.14.4 MEMS ENGINEERING AND MATERIALS INC
    • 7.14.5 SHANGHAI SIMGUI TECHNOLOGY CO LTD.
    • 7.14.6 SHIN-ETSU HANDOTAI AMERICA, INC.
    • 7.14.7 SIEGERT CONSULTING
    • 7.14.8 SILICON GENESIS CORPORATION (SIGEN)
    • 7.14.9 SUMCO
    • 7.14.10 ULTRASIL CORPORATION
    • 7.14.11 VIRGINIA SEMICONDUCTOR, INC

APPENDIX

  • U.S. PATENTS
  • EUROPE PATENTS
  • JAPAN PATENTS

LIST OF TABLES

  • TABLE 1. SOI WAFER MARKET, BY REVENUES 2008-2015 ($MILLION)
  • TABLE 2. R&D INITIATIVES
  • TABLE 3. SOI WAFER VOLUME BY DIAMETER (MSI*) 2008 - 2015
  • TABLE 4. THIN-FILM SOI WAFER MARKET, BY APPLICATIONS 2008 - 2015 ($MILLION)
  • TABLE 5. THICK-FILM SOI WAFER MARKET, BY PRODUCTS 2008 - 2015 ($MILLION)
  • TABLE 6. COMPANIES USING SOI WAFERS IN COMPUTING APPLICATIONS
  • TABLE 7. COMPANIES USING SOI WAFERS IN GAMING APPLICATIONS
  • TABLE 8. COMPANIES USING SOI WAFERS IN AUTOMOTIVE APPLICATIONS
  • TABLE 9. CLASSIFICATION OF APPLICATIONS BASED ON BURIED OXIDE (BOX) LAYER THICKNESS
  • TABLE 10. NEW PRODUCTS LAUNCH AND EXPANSION 2008 - 2010
  • TABLE 11. AGREEMENTS AND COLLABORATIONS 2008 - 2010
  • TABLE 12. OTHER DEVELOPMENTS 2008 - 2010

LIST OF FIGURES

  • FIGURE 1. SOI WAFER STRUCTURE
  • FIGURE 2. ADVANTAGES OF SOI WAFERS
  • FIGURE 3. EVOLUTION OF SOI WAFERS
  • FIGURE 4. PRODUCT LIFECYCLE OF SOI WAFERS
  • FIGURE 5. ROADMAP OF TECHNOLOGY NODES
  • FIGURE 6. IMPACT ANALYSIS OF THE DRIVERS FOR SOI WAFER MARKET
  • FIGURE 7. RESTRAINTS FACED BY SOI WAFER MARKET AND STRATEGIES TO OVERCOME THEM
  • FIGURE 8. PATENT REGISTRATIONS IN DIFFERENT REGIONS (2004 - 2010)
  • FIGURE 9. SOI WAFER REVENUE, BY TYPE 2010 - 2015 ($MILLION)
  • FIGURE 10. SOI WAFER REVENUES, BY DIAMETER
  • FIGURE 11. NUMBER OF WAFERS SHIPPED (2008 - 2015)
  • FIGURE 12. NORTH AMERICA - SOI WAFER MARKET
  • FIGURE 13. EUROPE - SOI WAFER MARKET
  • FIGURE 14. ASIA PACIFIC - SOI WAFER MARKET
  • FIGURE 15. ROW - SOI WAFER MARKET
  • FIGURE 16. PRICING TRENDS FOR SOI WAFERS 2008 - 2015 ($/WAFER)
  • FIGURE 17. PERCENTAGE SPLIT THE BASIS OF APPLICATION (2010)
  • FIGURE 18. CLASSIFICATION OF APPLICATIONS BASED ON THE SOI WAFER THICKNESS
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