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市場調查報告書

矽 vs. WBG(寬能隙Wide Band-gap):闡明電動車市場上的GaN·SiC的活用預測的

Silicon vs. WBG: Demystifying Prospects of GaN and SiC in the Electrified Vehicle Market

出版商 Lux Research 商品編碼 309488
出版日期 內容資訊 英文
商品交期: 最快1-2個工作天內
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矽 vs. WBG(寬能隙Wide Band-gap):闡明電動車市場上的GaN·SiC的活用預測的 Silicon vs. WBG: Demystifying Prospects of GaN and SiC in the Electrified Vehicle Market
出版日期: 2014年07月13日 內容資訊: 英文
簡介

在矽半導體素材性能停止提升的同時,寬能隙(以下簡稱WGB)半導體素材,尤其是SiC(碳化矽)與GaN(氮化鎵)更是具有可配合電動車用電力電子技術性能上需求的功能。由於GaN和SiC在高溫下也能保有其性能,而廣泛影響了電動車熱管理上的要件及配線、構裝等各個領域。

本報告提供電動汽車GaN·SiC的引進·活用預測相關分析,提供引進時所需的電池之經濟·技術性必要條件,及電池價格下滑時的狀況變化、正式引進時期與決定性要素(技術的成熟化,供應商的成熟化,認證流程及其他)等相關之調查與考察。

摘要整理

市場環境

  • WBG材料對矽材料技術的停頓和電動車輸出功率的增加需求之適合性:GaN和SiC為PHEV(插電式混合動力車)·EV(電動車)帶來的優勢

市場分析

  • SiC二極體·電晶體價格高,但最適合車輛用大型電池,商業化的可能性也最高。GaN產品仍未有可能實現,供應商目前慢了一步。

未來展望

圖表一覽

  • 圖:PHEV市場的成長:主要6家製造商趨勢
  • 表格:WBG材料在美國市場的成長:由於美國能源局(DOE)的APEEM目標,電力電子技術對市場的影響
  • 圖:車內所需電量自1998年起倍增
  • 圖:變頻器·轉換器:汽車動力傳動的主要電力電子技術
  • 表格:與矽材料比較,SiC和GaN材料上的優秀特質
  • 圖:由於PHEV和EV強烈依賴電動馬達,跟GaN和SiC的適合性非常高
  • 圖:分析方法(流程圖)
  • 圖:節能性:大大影響電池的小型化·重量減輕
  • 圖:電池小型化的節能效果(換算汽油)PHEV最大
  • 表格:SiC活用型轉換器·變頻器,比GaN解決方案高價
  • 圖:電池費用為250美元/kWh還有2%的節能效果,都是引進SiC的經濟標準
  • 圖:矽/SiC的混合動力系統帶來5%的節能效果,對EV和PHEV都有效
  • 表格:TRL(技術成熟度)地圖:技術·企業成熟度的簡單評估
  • 圖:TRL藍圖:車輛搭載SiC二極體·實用化的可能性最高
  • 圖:SiC二極體預計在2020年之前結束商用化實驗,SiC MOSFET次之
  • 圖:SiC設備廠商主導市場,其次為GaN廠商
目錄

As silicon struggles to keep up with performance requirements, wide bandgap (WBG) materials like silicon carbide (SiC) and gallium nitride (GaN) are best positioned to address power electronics performance needs in electrified vehicles. GaN and SiC will allow for efficient high-temperature operation while also having a cascading impact on the thermal management requirements, wiring, and packaging within a vehicle, reducing the total overall costs of the vehicle. We examine what battery economics are needed to justify adoption of either GaN or SiC, while also highlighting the changing dynamics when battery costs fall. This report further predicts when these materials will be adopted in the auto industry factoring in technology maturity, supplier maturity, and qualification timelines in the auto industry.

Table of Contents

EXECUTIVE SUMMARY

LANDSCAPE

As silicon struggles, WBG materials are best positioned to address needs of increased rate of vehicle electrification; PHEVs and EVs will benefit the most from GaN and SiC.

ANALYSIS

SiC diodes and transistors are expensive and best suited to large battery vehicles today, and closest to commercial adoption; GaN products are unavailable and suppliers lag behind.

OUTLOOK

Table of Figures

  • Figure 1: Graphic Plug-in Vehicle Sales Have Been Growing, and Six Key OEMs Lead the Way thus Far
  • Figure 2: Table WBG Materials Get a Boost through the U.S. DOE's APEEM Targets for Power Electronics
  • Figure 3: Graphic Power Requirements Within a Vehicle Have More Than Doubled Since 1998
  • Figure 4: Graphic The Inverter and Converter are the Main Power Electronics in a Powertrain Within a Vehicle
  • Figure 5: Table SiC and GaN Have Superior Material Properties Compared to Silicon
  • Figure 6: Graphic Relying on the Electric Motor, PHEVs and EVs Are Best Suited to Adopt GaN and SiC
  • Figure 7: Graphic Methodology Flow Chart for Analysis
  • Figure 8: Graphic Power Savings Has a Greater Impact on Battery Size and Weight Reduction
  • Figure 9: Graphic Due to a Smaller Battery Size, the Gas Equivalent Fuel Savings Is Highest in PHEVs
  • Figure 10: Table SiC-based Converters and Inverters Are More Expensive than Comparable GaN Solutions
  • Figure 11: Graphic Below Battery Cost of $250/kWh, at 2% Power Savings, Economics Don't Justify Use of SiC
  • Figure 12: Graphic At 5% Power Savings, Hybrid Silicon/SiC Systems Are Attractive to Both EVs and PHEVs
  • Figure 13: Table TRL Map Allows an Easy Mapping of Technology and Company Maturity
  • Figure 14: Graphic TRL Roadmap Shows SiC Diodes Are Closest to Being Adopted in Vehicles
  • Figure 15: Graphic SiC Diodes Will Be Fully Commercially Tested by 2020 as SiC MOSFETs Follow
  • Figure 16: Graphic SiC Device Manufacturers Lead the Pack, While GaN Manufacturers Trail Behind
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