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市場調查報告書

多核心處理器的指南

A Guide to Multicore Processors, Fourth Edition

出版商 Linley Group 商品編碼 302678
出版日期 內容資訊 英文
商品交期: 最快1-2個工作天內
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多核心處理器的指南 A Guide to Multicore Processors, Fourth Edition
出版日期: 2017年08月31日 內容資訊: 英文
簡介

多核心處理器,對於稱為線程,能分割成很多小任務的應用,提供最大限度的性能和彈性。內建系統中,多核心處理器的最常見用途是封包處理。封包處理發生在路由器、安全性、儲存、寬頻基礎設施,及行動電話基地台等,廣泛的網路、通訊設備。

本報告提供多核心處理器市場相關分析,概括處理器技術、多核心應用、各種指令套組及多核心處理器的特徵、技術趨勢及市場概要彙整、主要的供應商概要等,為您概述為以下內容。

第1章 處理器技術

  • 處理器的基礎
    • 中央處理器(CPU)
    • 快取
    • MMU、TLB
    • 匯流排頻寬
  • CPU微架構
    • RISC VS CISC
    • Endianness
    • 純量和超純量
    • 指令排序
    • 流水線和罰球
    • 分支預測
    • 多核心處理器
    • 多線
  • 主記憶體
    • DRAM的基本
    • DDR的版本
    • 記憶體子系統
  • I/O與網路介面
    • 乙太網路介面
    • PCI和PCI Express
    • RapidIO
    • USB
    • SAS和SATA

第2章 多核心應用

  • 網路、通訊設備
    • 控制平面 VS 資料平面
    • 控制平面處理
    • 資料平面應用
    • 服務車do
    • 網路儲存和RAID控制器
    • 安全性
    • 寬頻基礎設施
    • 行動電話基地台
  • 共同的尺寸規格

第3章 標準的指令套組

  • 架構比較
    • 技術
    • 市場上地位
  • x86指令套組
    • 概要
    • 初期指令套組
    • 目前擴展名
  • MIPS指令套組
    • 概要
    • 初期指令套組
    • 此後的擴展名
  • PowerPC指令套組
    • 概要
    • 指令套組
  • ARM指令套組
    • 概要
    • 初期指令套組
    • 此後的擴展名
    • ARMv4架構

第4章 多核心處理器

  • 內建多核心處理器是什麼?
    • 什麼不是內建多核心處理器?
  • 一般性特徵
    • 獨立的 VS 整合處理器
    • 多核心處理器
    • 加密引擎
    • RAID及其他儲存引擎
    • 封包處理加速器
  • 基準
    • CPU基準
    • 安全性性能

第5章 技術、市場趨勢

  • 技術趨勢
    • 架構
    • 整合趨勢
    • CPU複雜性的權衡
    • 記憶體存取
  • 市場概要
    • 市場規模,各供應商
    • 銷售額市場佔有率,各指令套組架構
    • 市場預測,各部門
    • 多核心市場預測

第6章 Broadcom

  • 公司介紹
  • 主要的特徵與性能
    • XLP及XLP II處理器
    • XLP I Family:XLP4xx及XLP8xx Series
    • XLP II Family:XLP532及XLP964
  • 內部架構
  • 系統設計
  • 開發工具
  • 產品藍圖
  • 整體概述

第7章 Cavium

  • 公司介紹
  • 主要的特徵與性能
    • Octeon II處理器
    • Octeon III處理器
  • 內部架構
    • Octeon II處理器
    • Octeon III處理器
  • 系統設計
  • 開發工具
  • 產品藍圖
  • 整體概述

第8章 Freescale

  • 公司介紹
  • 主要的特徵與業績
    • QorIQ P3-、P4-、T4-Series處理器
  • 內部架構
    • Power e500mc、Power e5500 CPU
    • Power e6500 CPU
    • 安全性引擎
    • QorIQ封包處理加速
  • 系統設計
    • 系統界面
    • 應用案例
  • 開發工具
  • 產品藍圖
  • 整體概述

第9章 Intel

  • 公司介紹
  • 主要的特徵與業績
  • 內部架構
    • Sandy Bridge CPU
    • 其他處理器技術
  • 系統設計
  • 開發工具
  • 產品藍圖
  • 整體概述

第10章 LSI

  • 公司介紹
  • 主要的特徵與業績
  • 內部架構
    • ARM Cortex-A15 CPU
    • PowerPC 476FP CPU
    • Axxia架構
  • 系統設計
  • 開發工具
  • 產品藍圖
  • 整體概述

第11章 Tilera

  • 公司介紹
  • 主要的特徵與業績
  • 內部架構
  • 系統設計
  • 開發工具
  • 產品藍圖
  • 整體概述

第12章 處理器比較

  • 不滿30W的處理器
  • 30∼50W的處理器
  • 超過50W的處理器

第13章 整體概述

  • 市場及技術趨勢
    • 無線基礎設施
    • 企業和資訊中心網路
    • 網路控制平面
  • 供應商的展望
    • Intel
    • Broadcom
    • Cavium
    • Freescale
    • 其他的多核心處理器供應商
  • 結論

本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

目錄

"A Guide to Multicore Processors" (4th Edition) provides an in-depth look at 32- and 64-bit high-speed embedded processors with four or more CPU cores. This completely revised report from The Linley Group contains 190+ pages of information on high-end processors from AMD, Baikal, Broadcom, Cavium, Intel, Kalray, Macom (AppliedMicro), Mellanox (Tilera/EZchip), and NXP.

The report focuses on general-purpose RISC and x86 processors that have four or more CPU cores running at 1.0GHz or more, excluding specialized architectures (e.g. DSPs, NPUs). This report covers processors for embedded applications, focusing on networking, communications, storage, and security; it excludes multicore products designed for servers or for mobile devices. (We cover these processors, as well as embedded processors with four or fewer CPU cores, in other reports.)

"A Guide to Multicore Processors" has detailed coverage of AMD's Opteron family; Broadcom's XLP II and Stingray family; Cavium's Octeon TX and Octeon III families; Intel's embedded Xeon and Xeon-D lines; Kalray's Bostan and Coolidge processor, Macom's Helix family; Mellanox's BlueField family; and NXP's QorIQ LS1 series, LS2 series, and T4 series.

This handy guide, packed with valuable information, brings you up-to-date on the newest developments in this important market and gives you the analysis you need to help choose a supplier or partner. The report also provides market-share and market-size data for the embedded and multicore markets.

"A Guide to Multicore Processors" begins with tutorials on the key technologies implemented by these products, background on the embedded market, and a discussion of the newest technology and market trends. Following these introductory chapters, the report delivers thorough coverage of all announced products in this area. For each major vendor, the report examines the performance, features, and architecture of each product, highlighting strengths and weaknesses in a consistent, easy-to-compare fashion. The report concludes with our own comparisons of these products and conclusions about which will fare best.

What's New in This Edition:

Since publishing the previous edition of this report in 2016, we have updated the coverage to include many new announcements, including:

  • Broadcom's Stingray Products
  • Cavium's ARMv8-compatible Octeon TX processors
  • NXP's newest ARM-based LS1- and LS2-series processors
  • Intel's new Xeon (Skylake) processors and Xeon D processors
  • Mellanox's new ARM-based BlueField processors
  • Final 2016 market size and vendor share
  • Embedded-processor forecasts to 2021

Table of Contents

List of Figures:

List of Tables:

About the Authors:

About the Publisher:

Preface:

Executive Summary:

1. Processor Technology

  • Processor Basics
    • Central Processing Unit (CPU)
    • Caches
    • MMUs and TLBs
    • Bus Bandwidth
  • CPU Microarchitecture
    • RISC vs. CISC
    • Endianness
    • Scalar and Superscalar
    • Instruction Reordering
    • Pipelining and Penalties
    • Branch Prediction
    • Multicore Processors
    • Multithreading
  • Main Memory
    • DRAM Basics
    • DDR Versions
    • Memory Subsystems
  • I/O and Network Interfaces
    • Ethernet Interfaces
    • PCI and PCI Express
    • RapidIO
    • USB
    • SAS and SATA

2. Multicore Applications

  • Networking and Communications Equipment
    • Control Plane vs. Data Plane
    • Control-Plane Processing
    • Data-Plane Applications
    • Services Cards
    • Networked Storage and RAID Controllers
    • Security
    • Broadband Infrastructure
    • Cellular Base Stations
  • Common Form Factors

3. Standard Instruction Sets

  • Architecture Comparison
    • Technology
    • Market Positions
  • x86 Instruction Set
    • Background
    • Initial Instruction Set
    • Modern Extensions
  • ARM Instruction Set
    • Background
    • Initial Instruction Set
    • Later Extensions
    • ARMv8 Architecture
    • ARMv8-M
    • Scalable Vector Extensions
    • ARM Cortex-A57
    • ARM Cortex-A53
    • ARM Cortex-A72
  • MIPS Instruction Set
    • Background
    • Initial Instruction Set
    • Later Extensions
  • PowerPC Instruction Set
    • Background
    • Instruction Set

4. Multicore Processors

  • What Is an Embedded Multicore Processor?
    • What Is Not an Embedded Multicore Processor
  • Common Characteristics
    • Standalone vs. Integrated Processors
    • Multicore Processors
    • Encryption Engines
    • RAID and Other Storage Engines
    • Packet-Processing Accelerators
  • Acceleration Software
    • Data-Plane Development Kit (DPDK)
    • OpenDataPlane (ODP)
  • Benchmark Software
    • CPU Benchmarks
    • Security Performance

5. Technology and Market Trends

  • Technology Trends
    • Architecture
    • Integration Trends
    • Software-Defined Functions
    • CPU Complexity Tradeoffs
    • Memory Access
    • Managing Power
    • Completeness
  • Market Overview
    • Market Size by Vendor
    • Market Share by Application
    • Revenue Market Share by Instruction-Set Architecture
    • Market Forecast

6. Broadcom

  • Company Background
  • Key Features and Performance
  • Internal Architecture
  • System Design
  • Development Tools
  • Product Roadmap
  • Conclusions

7. Cavium

  • Company Background
  • Key Features and Performance
    • Octeon III CN78xx- and CN77xx-Series
    • Octeon III CN73xx- and 72xx-Series
    • Octeon TX Processors
  • Internal Architecture
    • Octeon III CPU
    • Custom MIPS64 Extensions
    • Octeon III Caches
    • Octeon III Accelerators
    • Octeon TX Architecture
  • System Design
  • Development Tools
  • Product Roadmap
  • Conclusions

8. Intel

  • Company Background
  • Product Overview
  • Key Features and Performance
    • Xeon Scalable Processors
    • Xeon Platinum and Gold Processors
    • Xeon Silver Processors
    • Skylake-SP vs. Broadwell-EP
    • Xeon D Processors
  • Internal Architecture
    • Broadwell Microarchitecture
    • Skylake Microarchitecture
    • Skylake-SP Microarchitecture
  • System Design
    • Xeon Scalable Processors
    • Xeon E5v4 Processors
    • Xeon D Processors
  • Development Tools
  • Product Roadmap
  • Conclusions

9. Kalray

  • Company Background
  • Key Features and Performance
    • Bostan-1 and Bostan-2 (MPPA2 and MPPA2.2)
    • Coolidge (MPPA3)
  • Internal Architecture
    • Andey and Bostan (MPPA-256 v1, v2, and v2.2)
    • Coolidge (MPPA v3)
  • Development Tools
  • Product Roadmap
  • Conclusions

10. Macom (AppliedMicro)

  • Company Background
  • Key Features and Performance
  • Internal Architecture
  • System Design
  • Product Roadmap
  • Conclusions

11. Mellanox

  • Company Background
  • Key Features and Performance
  • Internal Architecture
  • System Design
  • Development Tools
  • Product Roadmap
  • Conclusions

12. NXP

  • Company Background
  • Key Features and Performance
    • QorIQ LS1-Series Processors
    • QorIQ LS2-Series Processors
    • QorIQ T4-Series Processors
  • Internal Architecture
    • ARM CPUs
    • Power e6500 CPU
    • Acceleration Engines
    • Quicc Engine
    • QorIQ Packet-Processing Acceleration (DPAA)
    • DPAA2 Packet Acceleration
    • QorIQ Layerscape Secure Platform
  • System Design
    • System Interfaces
    • Application Examples
  • Development Tools
  • Product Roadmap
  • Conclusions

13. Other Vendors

  • AMD
    • Company Background
    • Key Features and Performance
    • Product Roadmap
    • Conclusions

14. Comparisons

  • Sub-30W Processors
  • 30-50W Processors
  • 50-100W Processors
  • Processors Consuming More Than 100W

15. Conclusions

  • Market and Technology Trends
  • Vendor Outlook
    • Intel
    • NXP
    • Broadcom
    • Cavium
    • Other Multicore-Processor Vendors

Appendix: Further Reading:

Index:

List of Figures:

  • Figure 1-1. Basic processor design.
  • Figure 1-2. Simple superscalar processor design.
  • Figure 1-3. CPU pipelining examples.
  • Figure 1-4. Generic multicore processor.
  • Figure 1-5. Interleaved tasks on a multithreaded CPU.
  • Figure 1-6. DRAM evolution.
  • Figure 2-1. The control plane and the data plane.
  • Figure 4-1. Standalone and integrated general-purpose processors.
  • Figure 4-2. Networking-software interfaces.
  • Figure 4-3. Typical curve of IPSec performance versus packet size.
  • Figure 5-1. Worldwide revenue market share of embedded microprocessors, 2015-2016.
  • Figure 5-2. Worldwide revenue market share of the top vendors of embedded processors for communications.
  • Figure 5-3. Worldwide revenue market share of the top vendors of embedded processors for storage.
  • Figure 5-4. Worldwide revenue market share of the top vendors of embedded processors for other applications.
  • Figure 5-5. Worldwide revenue market share of embedded processors by CPU architecture.
  • Figure 5-6. Worldwide revenue of embedded processors by application, 2016-2021.
  • Figure 5-7. Worldwide revenue of embedded processors by communications segment, 2016-2021.
  • Figure 6-1. Block diagram of Broadcom BCM58808H.
  • Figure 6-2. Block diagram of the BCM58808H in a storage appliance.
  • Figure 7-1. Cavium Octeon III and Octeon TX families.
  • Figure 7-2. Block diagram of Cavium Octeon III CN7890.
  • Figure 7-3. Block diagram of Cavium Octeon TX CN8370.
  • Figure 7-4. Block diagram of ParPro card using the Octeon III CN7890.
  • Figure 7-5. Octeon TX CN8370 in a storage array.
  • Figure 8-1. Intel's nomenclature for Xeon Scalable processors.
  • Figure 8-2. Block diagram of Intel Broadwell embedded Xeon E5-2650v4.
  • Figure 8-3. Block diagram of Skylake microarchitecture.
  • Figure 8-4. Comparison of Intel cache hierarchies.
  • Figure 8-5. Block diagram of Intel's Purley platform.
  • Figure 8-6. Dual-socket system design based on Intel Xeon E5v4.
  • Figure 8-7. Block diagram of Intel Xeon D.
  • Figure 9-1. Block diagram of the MPPA-256 VLIW CPU.
  • Figure 10-1. Block diagram of Macom Potenza CPU.
  • Figure 10-2. Block diagram of Macom Helix 1 processor.
  • Figure 10-3. Block diagram of a gateway based on Macom Helix 1.
  • Figure 11-1. Block diagram of Mellanox BlueField processor.
  • Figure 11-2. Block diagram of Mellanox ConnectX-5 subsystem.
  • Figure 11-3. Block diagram of BlueField flash-array controller.
  • Figure 12-1. NXP QorIQ T- and LS-series processors.
  • Figure 12-2. Block diagram of NXP QorIQ LS1088A..
  • Figure 12-3. Second-generation Data Path Acceleration Architecture.
  • Figure 12-4. QorIQ Layerscape Secure Platform.
  • Figure 12-5. NXP VortiQa Network Security Suite.

List of Tables:

  • Table 2-1. Some common single-board-computer standards.
  • Table 5-1. Worldwide revenue of the top vendors of embedded processors.
  • Table 5-2. Worldwide revenue of the top vendors of embedded processors for communications.
  • Table 5-3. Worldwide revenue of the top vendors of embedded processors for storage.
  • Table 5-4. Worldwide revenue of the top vendors of embedded processors for other applications.
  • Table 5-5. Worldwide revenue of embedded processors by application, 2016-2021.
  • Table 5-6. Worldwide revenue of embedded processors by communications segment, 2016-2021.
  • Table 6-1. Key parameters for Broadcom BCM588xx processors.
  • Table 7-1. Key parameters for Cavium Octeon III CN78xx processors.
  • Table 7-2. Key parameters for Cavium Octeon III CN77xx processors.
  • Table 7-3. Key parameters for Cavium Octeon III CN73xx and CN72xx.
  • Table 7-4. Selected Cavium Octeon TX embedded processors.
  • Table 8-1. Intel code-names and product numbers.
  • Table 8-2. Intel Xeon embedded multicore processors.
  • Table 8-3. Key parameters for Intel Xeon Platinum and Gold processors.
  • Table 8-4. Key parameters for Intel Xeon Silver embedded processors.
  • Table 8-5. Xeon Scalable (Skylake-SP) versus Xeon E5v4 (Broadwell-EP).
  • Table 8-6. Intel Xeon D embedded processors.
  • Table 8-7. Key parameters for selected Intel Xeon D embedded processors.
  • Table 8-8. Key parameters for Intel C62x (Lewisburg) south-bridge chips.
  • Table 8-9. Key parameters for Intel DH89xx Coleto Creek chips.
  • Table 9-1. Key parameters for Kalray MPPA processors.
  • Table 10-1. Key parameters for Macom Helix 1 processors.
  • Table 11-1. Key parameters for Mellanox BlueField processors.
  • Table 12-1. Key parameters for NXP QorIQ LS1 quad- and octa-core chips.
  • Table 12-2. Key parameters for NXP QorIQ LS2 processors with Cortex-A57.
  • Table 12-3. Key parameters for NXP QorIQ LS2 processors with Cortex-A72.
  • Table 12-4. Key parameters for NXP QorIQ T4 processors.
  • Table 12-5. Performance of SEC 5.3 security engine.
  • Table 13-1. Key parameters for AMD Opteron A1100 SoCs.
  • Table 14-1. Comparison of sub-30W multicore processors.
  • Table 14-2. Comparison of 30-50W multicore processors.
  • Table 14-3. Comparison of 50-100W multicore processors.
  • Table 14-4. Comparison of multicore processors using more than 100W.
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