多重無線功能IC市場

多重無線功能IC市場 是由出版商IMS Research在2009年04月所出版的。 這份英文市場調查報告書包含150 PAGES (including 41 tables and 33 figures) 價格從美金6120起跳。

簡介

本報告書內容包括：多重無線功能IC（合併IC）市場之IC市場區分別調查分析、技術概要、出貨量•收益預測（至2013年）、主要企業與競爭環境、終端元件別的市場預測等，內容綱要摘記如下：

第1章 介紹•調查範圍•調查方法

第2章 技術檢視

• Bluetooth技術
  • 技術規格
  • 規格的發展
  • 目標市場
• 高速Bluetooth
  • 規格•規格的發展
  • 對象市場
• 省消耗電力Bluetooth
  • 規格
  • 規格的發展
  • 目標市場
• WLAN
  • 規格•規格的發展
  • 目標市場
• UWB
  • 技術規格
  • 規格的發展
  • 目標市場
• GPS
  • 技術規格
  • 規格的發展
  • 目標市場
• NFC
  • 技術規格
  • 規格的發展
  • 目標市場
• 合併IC
  • 合併IC的優點
  • 合併IC的缺點

第3章 競爭環境與供應商產業

第4章 市場預測•分析

• 合併IC預測
  • Bluetooth的出貨量
  • 合併IC：出貨量•收益
• 合併IC預測：應用別
  • 手機終端
    • 手機終端用無線技術
    • 手機終端用合併IC：成長牽動因素•障礙
    • 市場預測•前提因素
  • 數位相機
  • 筆記型電腦
  • 個人媒體播放器（PMP）
  • 個人導航元件（PND）
  • 外接卡•適配器
  • 電玩遊戲機

IC市場區分

• Bluetooth / FM
• Bluetooth / GPS
• Bluetooth / FM / GPS
• Bluetooth / WLAN
• Bluetooth / FM / WLAN
• Bluetooth / FM / WLAN / GPS
• Bluetooth / WLAN / GPS
• Bluetooth / FM / GPS / NFC
• Bluetooth / FM / WLAN / NFC

目錄

Description

ICs with multiple wireless functionality (combination ICs) are increasingly seen as a means of enabling end-equipment manufacturers to include additional functionality within their devices, with reduced cost, silicon size and power requirements, and without the coexistence issues commonly associated with the use of multiple standalone wireless ICs. This is the second edition of the report ‘ICs with Multiple Wireless Functionality - World Market' . This report includes over 60 tables and figures, with market estimates and forecasts for 9 key combination ICs from 2008-2013 (including ASPs and revenues), along with forecasts for the size of eight key markets for combination ICs.

Combination ICs forecast within this report include:

• Bluetooth/FM
• Bluetooth/GPS
• Bluetooth/FM/GPS
• Bluetooth/WLAN
• Bluetooth/FM/WLAN
• Bluetooth/FM/WLAN/GPS
• Bluetooth/WLAN/GPS
• Bluetooth/FM/GPS/NFC
• Bluetooth/FM/WLAN/NFC

The report also provides forecasts for Bluetooth low energy, Bluetooth high speed over 802.11 and Bluetooth high speed over UWB in combination ICs. Forecasts of the key combination ICs (along with the Bluetooth breakdowns) are provided for the following end-device markets:

• Smartphones
• Feature Rich Handsets
• Basic Feature Handsets
• Laptop PCs
• Digital Cameras
• Personal Navigation Devices
• Personal Media Players
• Portable Gaming Devices
• Fixed Gaming Devices
• Add-in Cards & Dongles

• Pages: 150
• Tables: 41
• Figures: 33

Chapter 1 - Introduction, Scope and Methodology

Chapter 2 - Technology Review

• 2.0 Introduction
  • 2.1 Bluetooth Technology
    • 2.1.1 Introduction
    • 2.1.2 Technical Specification
    • 2.1.3 Standards Evolution
    • 2.1.4 Markets served with Classic Bluetooth
  • 2.2 Bluetooth high speed
    • 2.2.1 Introduction
    • 2.2.2 Specification and Standards Evolution
    • 2.2.3 Markets served by Bluetooth hs
  • 2.3 Bluetooth low energy
    • 2.3.1 Introduction
    • 2.3.2 Bluetooth low energy Specification
    • 2.3.3 Standards Evolution
    • 2.3.4 Markets served by Bluetooth LE
  • 2.4 WLAN
    • 2.4.1 Introduction
    • 2.4.2 Specification and Standards Evolution
    • 2.4.3 Markets served with WLAN
  • 2.5 UWB
    • 2.5.1 Introduction
    • 2.5.2 Technical Specification
    • 2.5.3 Standards Evolution
    • 2.5.4 Markets Served with UWB
  • 2.6 GPS
    • 2.6.1 Introduction
    • 2.6.2 Technical Specification
    • 2.6.3 Standards Evolution
    • 2.6.4 Markets served with GPS
  • 2.7 NFC
    • 2.7.1 Introduction
    • 2.7.2 Technical Specification
    • 2.7.3 Standards Evolution
    • 2.7.4 Markets served with NFC
  • 2.8 Combination ICs
    • 2.8.1 Advantages of Combination ICs
    • 2.8.2 Disadvantages of Combination ICs

Chapter 3 - Competitive Environment and Supplier Industry

• 3.0 Introduction
  • 3.1 Competitive Environment
    • 3.1.1 Introduction
    • 3.1.2 Impact of Current Global Economic Situation
    • 3.1.3 Converged Future - Competitive Environment
  • 3.2 Summary of Technologies Addressed
  • 3.3 Summary of Standards/Industry Body Involvement
  • 3.4 Alereon
  • 3.5 Atheros
  • 3.6 AzureWave Technologies
  • 3.7 Broadcom
  • 3.8 CSR
  • 3.9 GCT Semiconductor
  • 3.10 Infineon
  • 3.11 Intel Corporation
  • 3.12 Laird Technologies
  • 3.13 Marvell
  • 3.14 Qualcomm
  • 3.15 Renesas Technology Corporation
  • 3.16 SiGe Semiconductor, Inc.
  • 3.17 SiRF Technology, Inc.
  • 3.18 ST-Ericsson
  • 3.19 Staccato
  • 3.20 Stonestreet One
  • 3.21 TDK Electronics
  • 3.22 Texas Instruments
  • 3.23 U-Blox
  • 3.24 Wipro
  • 3.25 Wisair

Chapter 4 - Market Forecasts and Analysis

• 4.0 Introduction
  • 4.1 Combination IC Forecasts
    • 4.1.1 Introduction
    • 4.1.2 Bluetooth Shipment Volumes
    • 4.1.3 Combination IC Shipment Volumes and Revenues
  • 4.2 Combination IC Forecasts by Application
    • 4.2.1 Cellular Handsets
      • 4.2.1.1 Wireless Technologies in Cellular Handsets
      • 4.2.1.2 Key Drivers/Barriers for Combination ICs in Cellular Handsets
      • 4.2.1.3 Market Forecasts and Assumptions
    • 4.2.2 Digital Cameras
      • 4.2.2.1 Wireless Technologies in Digital Cameras
      • 4.2.2.2 Key Drivers/Barriers for Combination ICs in Digital Cameras
      • 4.2.2.3 Market Forecasts and Assumptions
    • 4.2.3 Laptop PCs
      • 4.2.3.1 Wireless Technologies in Laptop PCs
      • 4.2.3.2 Key Drivers/Barriers for Combination ICs in Laptop PCs
      • 4.2.3.3 Market Forecasts and Assumptions
    • 4.2.4 Personal Media Players (PMPs)
      • 4.2.4.1 Wireless Technologies in PMPs
      • 4.2.4.2 Key Drivers/Barriers for Combination ICs in PMPs
      • 4.2.4.3 Market Forecasts and Assumptions
    • 4.2.5 Personal Navigation Devices (PNDs)
      • 4.2.5.1 Wireless Technologies in PNDs
      • 4.2.5.2 Key Drivers/Barriers for Combination ICs in PNDs
      • 4.2.5.3 Market Forecasts and Assumptions
    • 4.2.6 Add-in Cards and Dongles
      • 4.2.6.1 Wireless Technologies in Add-in Cards and Dongles
      • 4.2.6.2 Key Drivers/Barriers for Combination ICs in Add-in Cards and Dongles
      • 4.2.6.3 Market Forecasts and Assumptions
    • 4.2.7 Gaming Devices
    • 4.2.7.1 Wireless Technology in Gaming
    • 4.2.7.2 Key Drivers/Barriers for Combination ICs in Gaming
    • 4.2.7.3 Market Forecasts and Assumptions

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