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市場調查報告書
居家網路系統IC的競爭分析：2008年版
A Competitive Analysis of System ICs in Home Networking - 2008 Edition
| 出版商 |
IMS Research |
| 出版日期 |
2008年05月 |
商品編碼 |
72266 |
| 內容資訊 |
英文 201 PAGES (including 68 tables) |
| 價格 |
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居家網路系統IC的競爭分析：2008年版 是由出版商IMS Research在2008年05月所出版的。
這份英文市場調查報告書包含201 PAGES (including 68 tables) 價格從美金7500起跳。
本報告書內容包括：居家網路系統IC調查、技術及半導體、促進市場發展動向、可實現技術、2012年之前網路情勢變化分析、連線機器（xDSL、寬頻電纜連線、FTTP等）、LAN機器（乙太網路、寬頻網路、Wi-Fi等）等IC分類別市場的收益、出貨量及ASP評估等。內容綱要摘記如下：
實施概要
第1章 介紹・調查範圍・調查方法
第2章 全球用戶居家機器(CPE)市場
- 介紹
- 摘要
- xDSL連線
- 寬頻電纜連線
- 寬頻衛星(雙向)連線
- FTTP連線
- 電力線寬頻連線
- 無線寬頻連線
- 專用線LAN寬頻
- 電話線LAN寬頻
- 電力線LAN寬頻
- 同軸LAN寬頻
- 無線LAN寬頻
第3章 居家網路系統IC
- 介紹
- 居家網路系統IC市場
- 連線機器
- 連線機器概要
- 全球xDSL連線機器IC出貨量
- 全球電纜連線機器IC出貨量
- 全球衛星(雙向)連線機器IC出貨量
- 全球FTTP機器IC出貨量
- 全球電力線寬頻機器IC出貨量
- 全球MAN機器IC出貨量
- LAN機器
- LAN機器概要
- 全球専用線LAN機器IC出貨量
- 全球電話線寬頻LAN機器IC出貨量
- 全球電力線寬頻LAN機器IC出貨量
- 全球同軸電纜LAN機器IC出貨量
- 全球Wi-Fi用LAN機器IC出貨量
附錄1 圖表一覽
附錄2 OEM/ODM、SoC解決方案提供企業、微處理元件供應商名錄
Abstract
Description
The home networking environment is in one of its largest evolutionary phases.
There are significant market drivers creating demand that the typical home
network is currently unable to supply. Some Access and LAN technologies are
at a pace to keep up with this demand; some are not. The success of IC and
SoC solutions will hinge on being aware of this changing environment.
This is a technologies and semiconductor focused study of the trends driving,
and the technologies enabling, this changing network landscape through 2012.
This report qualitatively and quantitatively presents equipment and ICs
categorized by the following technologies:
- Access equipment
- xDSL (ADSL(2)+, SDSL, VDSL(2))
- Broadband Cable Access
- Satellite, 2-Way
- Fibre-to-the-Premises (FTTP)
- Broadband Powerline Access
- Wi-MAX (802.16d & e)
- LAN equipment
- Dedicated Wiring (Ethernet)
- Broadband Phoneline
- Broadband Powerline
- Broadband Coaxial Cable
- Wi-Fi (802.11g & n)
The equipment types quantified by Revenues, Units and ASPs are Data Modems,
Data Gateways, Integrated Set-top Boxes, Integrated Access Devices,
Routers/Bridges, Adapters/NICS, Hubs and other LAN devices. Each technology
discussion includes an overview, a market analysis, forecast assumptions and a
standards assessment.
The focus penetrates deeper from equipment to ICs, where these technology
categories are again used to present the competitive analysis of system ICs in
home networking.
The ICs quantified by Revenues, Units and ASPs are:
- Microprocessors (4/8, 16, 32/64-bit MPUs)
- Microcontrollers (4/8, 16, 32/64-bit MCUs)
- DSP/DSC
- ASICs (Classic and 32-bit MPU Core-based)
- ASSPs (Classic and 32-bit MPU Core-based)
- FPGAs (Classic and 32-bit MPU Core-based)
- Memory (Volatile and Non-Volatile)
- Interconnect standards (as a % of inclusion)
This report also includes a list of over 100 OEM/ODMs, SoC solutions providers
and microprocessing component vendors in home networking with a key to which
technologies they are currently supporting.
Table of Contents
Executive Summary
Chapter 1: Introduction, Scope and Methodology
- 1.0 Introduction
- 1.1 Scope
- 1.2 Methodology
- 1.3 Exchange Rates
- 1.4 Definitions
Chapter 2: The Global Customer Premises Equipment Market
- 2.0 Introduction
- 2.1 The Global CPE Summary
- 2.2 xDSL Access
- 2.3 Broadband Cable Access
- 2.4 Broadband Satellite (2-Way) Access
- 2.5 Fibre-to-the-Premises Access
- 2.6 Broadband Powerline Access
- 2.7 Broadband Wireless Access
- 2.8 Broadband Dedicated Wiring LAN
- 2.9 Broadband Phoneline LAN
- 2.10 Broadband Powerline LAN
- 2.11 Broadband Coaxial LAN
- 2.12 Broadband Wireless LAN
Chapter 3: System ICs in Home Networking
- 3.0 Introduction
- 3.1 The Market for System ICs in Home Networking
- 3.2 Access Devices
- 3.2.1 Overview of Access Devices
- 3.2.2 Worldwide Shipments for ICs in xDSL Access Devices
- 3.2.3 Worldwide Shipments for ICs in Cable Access Devices
- 3.2.4 Worldwide Shipments for ICs in Satellite (2-way) Access Devices
- 3.2.5 Worldwide Shipments for ICs in FTTP Devices
- 3.2.6 Worldwide Shipments for ICs in Broadband Powerline Devices
- 3.2.7 Worldwide Shipments for ICs in MAN Devices
- 3.3 LAN Devices
- 3.3.1 Overview of LAN Device
- 3.3.2 Worldwide Shipments for Dedicated Wire ICs in LAN Devices
- 3.3.3 Worldwide Shipments for Broadband Phoneline ICs in LAN Devices
- 3.3.4 Worldwide Shipments for Broadband Powerline ICs in LAN Devices
- 3.3.5 Worldwide Shipments for Coaxial Cable ICs in LAN Devices
- 3.3.6 Worldwide Shipments for Wi-Fi ICs in LAN Devices
Appendix 1: List of Tables
Appendix 2: List of OEM/ODMs, SoC Solution Providers and Microprocessing Component Suppliers
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