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市場調查報告書

導電性黏劑的技術、市場、預測、市場機會:2016-2026年

Electrically Conductive Adhesives 2016-2026

出版商 IDTechEx Ltd. 商品編碼 352197
出版日期 內容資訊 英文 127 Slides
商品交期: 最快1-2個工作天內
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導電性黏劑的技術、市場、預測、市場機會:2016-2026年 Electrically Conductive Adhesives 2016-2026
出版日期: 2016年09月01日 內容資訊: 英文 127 Slides
簡介

本報告提供焊料的替代產品的導電性黏劑的技術與市場調查,等向性及異向性導電膠及薄膜的各種概要、特徵、功能,技術創新趨勢,各種用途與新的終端用戶產業,價值鏈,市場成長預測,以及主要企業的簡介等彙整。

第1章 摘要整理

第2章 簡介

  • 焊料的替換的必要性
  • 鉛自由焊料
  • 電子材料
  • 階層
  • 導電性黏劑 vs 焊料
  • 導電性黏劑市場穩定性

第3章 等向性 vs 異向性

  • 互連的略圖
  • 材料的選擇的因素

第4章 等向性電膠 (ICP)

  • 等向性電膠
  • 組成
  • 樹脂
  • 商用ICP的主參數
  • 商用ICP的其他特徵
  • 加工
  • 熱硬化
  • 印刷電子產品用ICP
  • 銀的遷移控制

第5章 ICP的革新

  • 導電性結構性黏著劑
  • 銀含有量的降低
  • 奈米技術
  • PV模組的背離切點用ICP

第6章 異向性導電性黏劑

  • 簡介
  • ACP vs ACF

第7章 異向性導電膠 (ACP)

  • 異向性導電膠
  • 市場需求
  • ACP的材料
  • 商用ACP的特性
  • ACP的奈米技術
  • MesoGlue

第8章 ACP的功能

  • 顯示器互相連接
  • COG(Chip-on-Glass)

第9章 異向性導電薄膜

  • 異向性導電薄膜
  • 關於ACF
  • ACF接合製程
  • 填充物粒子
  • 填充物粒子範例
  • 市售產品的厚度
  • 課題
  • 技術發展
  • 主要用途的市場機會

第10章 ACF的功能

  • 典型性的ACF的集合
  • 觸控面板
  • 感測器

第11章 ACF的革新

  • Dexerials:粒子排列型ACF
  • 日立化成
  • ACF的奈米技術
  • 透明ACF

第12章 各種用途

  • 相機
  • 顯示器
  • 太陽能光電發電
  • 太陽能光電發電用互相連接
  • 在PV領域的ECA利用的優點
  • 在PV領域的ECA的佔有率
  • LED、OLED
  • 光電
  • 智慧卡、RFID

第13章 新興市場

  • 汽車用電子產品
  • 軟性顯示器
  • 行動裝置部門的軟性顯示器的未來性
  • 汽車產業用顯示器
  • 套模電子產品
  • OLED照明
  • 薄膜PV
  • E紡織品

第14章 價值鏈

第15章 財務趨勢

  • 等向性電膠
  • ACF
  • ACF:Dexerials

第16章 預測

  • ICP預測
  • ACF預測:各功能
  • 收益預測:各類型

第17章 總論

第18章 製造商

  • 簡介

第19章 ICP製造企業

  • Chemtronics
  • Daejoo
  • DELO
  • EMS
  • Epotek
  • Ferro
  • Heraeus
  • Nepes

第20章 ACP製造企業

  • DELO
  • Henkel
  • Panacol
  • Panacol Products
  • Sun Ray Scientific
  • Tatsuta電線
  • Three Bond

第21章 ACF製造企業

  • 3M
  • Btech
  • 日立化成
  • 京瓷
  • Tatsuta電線

第22章 企業簡介

  • Creative Materials Inc.
  • Daejoo Electronic Materials Co., Ltd
  • 大日本印刷
  • Dexerials America Corporation
  • 藤倉化成
  • Henkel
  • Mosaic Solutions AS
  • Nagase America Corporation
  • Seashell Technology
  • 昭和電工
  • TactoTek

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目錄

Materials are needed to replace the estimated 50,000 metric tons of tin-lead solder currently used each year, because of toxicity concerns, but there are no "drop-in" replacements for eutectic tin-lead solder. Electrically Conductive Adhesives (ECAs), which are also known as conductive epoxies, are becoming increasingly common to replace solders in a variety of functions, applications and industries. This report covers the three main categories of conductive adhesives available as safe and environmentally-sound solder alternatives.

The key applications include:

  • Photovoltaic modules - Traditional ECAs have suffered from poor stability when applied to copper and tin metals, but improved ECAs for PV applications have been available since 2010. Lower temperature interconnections can allow thinner wafers, and reduce warpage and breakage of solar cells. ECAs are expected to be used for interconnection in 20% of solar cells by 2025.
  • LCD and OLED displays - ACFs have found a particular niche market in packaging flat panel displays.
  • Touch panels - The damage to the substrates can be reduced by lowering the bonding temperature during assembly. ECAs can allow lower temperature bonding.
  • LEDs - It is quick and cheap to mount LEDs using conductive adhesives and the thermal penalty is tolerable if the adhesive layer is kept thin.
  • RFID chips - Conductive adhesives are used for mounting temperature-sensitive chips on smart cards, because of low curing temperatures.

There are increasing opportunities for these materials as these industries move towards curved screens, flexible displays, in-mould electronics, displays designed for automotive, and e-textiles, all of which have stringent requirements for conductive adhesives.

Isotropic Conductive Adhesives have a high loading of metallic fillers (often silver) and must be carefully screen-printed or dispensed into discrete dots. They are reliable and compatible with reel-to-reel processing. There is research towards using nano-sized fillers to enable ink-jetting for higher precision, and ensuring the ICP also works as a structural adhesive.

Anisotropic Conductive Pastes are simple and cost-effective because of the low-loading of filler particles and ease of processing. The minimum pitch width is poor, and so application is limited.

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Currently, 74% of Anisotropic Conductive Film (ACF) is used in the manufacture of LCD or OLED displays. Displays are becoming more widely used in consumer electronics, aerospace, defence, automotive, and infrastructure sectors. UV-thermal cure mechanisms must be developed to lower cure temperature to allow plastic substrates for flexible displays. However, this market is still set to diversify with the market for ACF in non-display applications reaching over $1 billion by 2026, due to the reliable properties, thinness and ease of processing. Metallic coatings on polymeric particles will allow lower cost fillers.

This report offers worldwide coverage of the Electrically Conductive Adhesives, most of which are manufactured in Asia-Pacific but start-ups and innovation exists in Europe and North America. The report is based on extensive research, includes twelve primary interviews with the market leading manufacturers. It includes forecasts by revenue, split by technology and function, until 2026.

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Table of Contents

1. EXECUTIVE SUMMARY

  • 1.1. Hierarchy
  • 1.2. Comparison of solders to ECAs
  • 1.3. Top three technical requirements
  • 1.4. Forecasts
  • 1.5. Conclusions

2. INTRODUCTION

  • 2.1. The need to replace solder
  • 2.2. Lead-free solders
  • 2.3. Electronic Materials
  • 2.4. Hierarchy
  • 2.5. Conductive Adhesives vs Solders
  • 2.6. Stability in Conductive Adhesive Market

3. ISOTROPIC VS ANISOTROPIC

  • 3.1. Schematic of Interconnects
  • 3.2. Factors which influence the choice of material

4. ISOTROPIC CONDUCTIVE PASTE (ICP)

  • 4.1. Isotropic Conductive Paste
  • 4.2. Composition
  • 4.3. Resins
  • 4.4. Key Parameters of Commercial ICP
  • 4.5. Other Characteristics of Commercial ICP
  • 4.6. Processing
  • 4.7. Thermal Curing
  • 4.8. ICP for printed electronics
  • 4.9. Silver migration control

5. INNOVATIONS IN ICP

  • 5.1. Conductive, structural adhesives
  • 5.2. Reduced silver content
  • 5.3. Nanotechnology
  • 5.4. ICP for back-contact PV modules

6. ANISOTROPIC CONDUCTIVE ADHESIVES

  • 6.1. Introduction
  • 6.2. ACP vs ACF

7. ANISOTROPIC CONDUCTIVE PASTE

  • 7.1. Anisotropic Conductive Pastes
  • 7.2. Market Demands
  • 7.3. Materials for ACPs
  • 7.4. Properties of Commercial ACP
  • 7.5. Nanotechnology in ACP
  • 7.6. MesoGlue

8. FUNCTIONS OF ACPS

  • 8.1. Display Interconnection
  • 8.2. Chip-on-Glass

9. ANISOTROPIC CONDUCTIVE FILM

  • 9.1. Anisotropic Conductive Film
  • 9.2. ACF Introduction
  • 9.3. ACF Bonding Process
  • 9.4. Filler Particles
  • 9.5. Filler Particle Examples
  • 9.6. Thickness of commercially available products
  • 9.7. Issues
  • 9.8. Technical Developments
  • 9.9. Key Application Opportunities

10. FUNCTIONS OF ACFS

  • 10.1. Typical ACF Assemblies
  • 10.2. Touch Panels
  • 10.3. Sensors

11. INNOVATIONS IN ACF

  • 11.1. Dexerials - Particle-Arrayed ACF
  • 11.2. Hitachi Chemical
  • 11.3. Nanotechnology in ACF
  • 11.4. Transparent ACF

12. APPLICATIONS

  • 12.1. Cameras
  • 12.2. Displays
  • 12.3. Photovoltaics
  • 12.4. Interconnections for Photovoltaics
  • 12.5. Advantages of using ECAs in PV applications
  • 12.6. Market Share of ECAs in PV applications
  • 12.7. LEDs and OLEDs
  • 12.8. Optoelectronics
  • 12.9. Smart Cards and RFID

13. EMERGING MARKETS

  • 13.1. Automotive Electronics
  • 13.2. Flexible Displays
  • 13.3. Future of Flexible Displays in Portable Devices
  • 13.4. Displays for automotive industry
  • 13.5. In-mould electronics
  • 13.6. OLED lighting
  • 13.7. Thin Film Photovoltaics
  • 13.8. Thin Film Photovoltaics
  • 13.9. E-textiles

14. VALUE CHAIN

  • 14.1. Value Chain

15. FINANCIALS

  • 15.1. Isotropic Conductive Paste
  • 15.2. ACF
  • 15.3. ACF - Dexerials

16. FORECASTS

  • 16.1. Forecast: ICP
  • 16.2. Forecast: ACF by Function
  • 16.3. Forecast: Revenue by Type

17. CONCLUSIONS

  • 17.1. Conclusions
  • 17.2. On-going research

18. MANUFACTURERS

  • 18.1. IDTechEx Portal Profiles

19. COMPANIES PRODUCING ICP

  • 19.1. Chemtronics
  • 19.2. Daejoo
  • 19.3. DELO
  • 19.4. EMS
  • 19.5. Epotek
  • 19.6. Ferro
  • 19.7. Heraeus
  • 19.8. Nepes

20. COMPANIES PRODUCING ACP

  • 20.1. DELO
  • 20.2. Henkel
  • 20.3. Panacol
  • 20.4. Panacol Products
  • 20.5. Sun Ray Scientific
  • 20.6. Tatsuta
  • 20.7. Three Bond

21. COMPANIES PRODUCING ACF

  • 21.1. 3M
  • 21.2. Btech
  • 21.3. Hitachi Chemical
  • 21.4. Kyocera
  • 21.5. Tatsuta

22. COMPANY PROFILES

  • 22.1. Creative Materials Inc.
  • 22.2. Daejoo Electronic Materials Co., Ltd
  • 22.3. Dai Nippon Printing
  • 22.4. Dexerials America Corporation
  • 22.5. Fujikura Kasei Co Ltd
  • 22.6. Henkel
  • 22.7. Mosaic Solutions AS
  • 22.8. Nagase America Corporation
  • 22.9. Seashell Technology
  • 22.10. Showa Denko
  • 22.11. TactoTek
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