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市場調查報告書

從2D到3D印刷電子產品 2015-2025年

3D Printed Electronics and Circuit Prototyping 2015-2025

出版商 IDTechEx Ltd. 商品編碼 335243
出版日期 內容資訊 英文 103 Slides
商品交期: 最快1-2個工作天內
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從2D到3D印刷電子產品 2015-2025年 3D Printed Electronics and Circuit Prototyping 2015-2025
出版日期: 2015年12月01日 內容資訊: 英文 103 Slides
簡介

本報告提供從2D到3D印刷電子產品擴展的現有技術與新興技術,主要應用類型,提供該市場產品的企業相關調查,尤其是噴墨導電油墨、絕緣墨水,導電膠、絕緣體的押出及氣霧劑噴射技術關注分析。

第1章 摘要整理

第2章 簡介

  • 印刷電子產品
  • 印刷電子產品:商業性失敗
  • 印刷電子產品:商業性成功
  • 3D列印
  • 3D列印:商業用途
  • 3D列印:混合機器
  • 教訓

第3章 傳統PCB

  • 歷史
  • 實行零組件
  • 層級
  • 複雜性
  • 地區
  • 原型製作
  • 機械學
  • SWOT分析

第4章 材料

  • 功能性材料
  • 金屬
  • 導電性熱塑性燈絲
  • 導電油墨
  • 導電膠
  • 導電性光聚合物

第5章 用途

  • 互相連接
  • 天線
  • 微電池
  • 少量生產
  • 電磁石
  • 陶瓷電容
  • 有機太陽能光電發電
  • 超材料
  • 彈道整流器
  • 壓電裝置

第6章 技術

  • 押出溶融焊料
  • 押出溶融焊料:SWOT
  • 押出導電性燈絲
  • 押出導電性燈絲:SWOT
  • 噴墨
  • 噴墨:SWOT
  • 氣霧劑
  • 氣霧劑:SWOT
  • 粘貼押出
  • 粘貼押出:SWOT

第7章 競爭技術

  • 3D印表機及導電油墨/粘貼/黏劑
  • CNC銑床
  • LDS (雷射直接成型)

第8章 企業

  • AgIC
  • AgIC: SWOT
  • Voltera
  • Voltera: SWOT
  • Cartesian Co.
  • Cartesian Co: SWOT
  • BotFactory
  • BotFactory: SWOT
  • NanoDimension
  • NanoDimension: SWOT
  • Ceradrop
  • Ceradrop: SWOT
  • Optomec
  • Optomec: SWOT
  • Neotech AMT
  • Neotech AMT: comparison
  • Neotech AMT: SWOT
  • Voxel8
  • Voxel8: conductivity
  • Voxel8: SWOT
  • Novacentrix and nScrypt
  • Pulse Electronics

第9章 研究機關

  • University of Texas at El Paso (UTEP)
  • Cornell University

第10章 市場、預測

  • 終端用戶
  • 企業的分類
  • 技術的優勢、弱點
  • 機會
  • Kickstarter
  • 消費者市場
  • 教育市場
  • 專門PCB原型製作市場
  • 產業市場
  • 整體市場預測
  • 預測的限制事項
  • 結論

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目錄

The market for 3D printed electronics will exceed $1 billion by 2025.

This is the only market research report covering the evolution of 3D printed electronics

The 3D printing industry created a tsunami of hype in 2012 with the advent of the world's first consumer-level 3D printers. This hype around consumer-level technologies made 3D printing a household name. Surprisingly, this culminated in rapid growth across the entire industry including established players offering high-end industrial equipment. The same pattern will repeat in 2016 with the advent of a new breed of printers capable of depositing electrically conductive and insulating materials: the first step towards 3D printed electronics.

Customers funding first generation machines have already spent over $800k on Kickstarter alone. These consumer-level machines will drive the hype but next generation machines aimed at professional use will become the largest commercial markets over the next decade by servicing professional prototyping and manufacturing end users. In addition we have the first truly 3D electronics printer coming to market in 2015 and the impact it will have is unknown.

This report relates the emerging market for 3D printed electronics to the existing markets for printed electronics and 3D printing that IDTechEx has been researching for years. We explain why some candidate applications will not succeed commercially and identify two main applications that will create a total market worth over $1bn by 2025 thanks to core advantages over competing technologies and huge addressable markets. In addition we explore many potential applications for fully 3D printed electronics.

This report discusses all existing and emerging technologies that span 2D and 3D printed electronics, all major applications, all players bringing products to market in this space. Specifically, the inkjetting of conductive and insulating inks, extrusion of conductive pastes and insulators and the Aerosol Jet technology.

The following technologies are covered in detail including lists of all major vendors for each technology type and SWOT analyses quantifying characteristics such as equipment and material prices, conductivities and precision:

  • Inkjetting conductive and insulating inks.
  • Extrusion of conductive metals and insulating thermoplastics.
  • Extrusion of conductive pastes and insulating thermoplastics.
  • Aerosol Jet.

The following materials are covered:

  • Metals.
  • Conductive thermoplastics.
  • Conductive inks.
  • Conductive pastes.
  • Conductive photopolymers.

Eighteen potential commercial applications of 3D printed electronics are considered, most of which have already been demonstrated in the lab.

All major players are covered including SWOT analyses comparing their commercial products and technologies.

This report gives forecasts to 2025 broken down into the following market sectors:

  • 1. Consumer.
  • 2. Education.
  • 3. Professional PCB prototyping.
  • 4. Antenna manufacture

Restraints that are inhibiting the uptake of 3D printed electronics are covered as well as drivers.

Analyst access from IDTechEx

All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.

Table of Contents

1. EXECUTIVE SUMMARY

  • 1.1. Drivers and restraints
  • 1.2. Market forecast
  • 1.3. Technologies

2. INTRODUCTION

  • 2.1. Printed Electronics
  • 2.2. Printed Electronics: commercial failures
  • 2.3. Printed Electronics: commercial successes
  • 2.4. 3D Printing
  • 2.5. 3D Printing: commercial applications
  • 2.6. 3D Printing: hybrid machines
  • 2.7. Lessons learned

3. TRADITIONAL PCBS

  • 3.1. Traditional PCBs: history
  • 3.2. Traditional PCBs: mounting components
  • 3.3. Traditional PCBs: layers
  • 3.4. Traditional PCBs: complexity
  • 3.5. Traditional PCBs: geography
  • 3.6. Traditional PCBs: prototyping
  • 3.7. Traditional PCBs: mechanics
  • 3.8. Traditional PCBs: heat
  • 3.9. Traditional PCB: SWOT analysis

4. MATERIALS

  • 4.1. Functional materials
  • 4.2. Metals
  • 4.3. Conductive thermoplastic filaments
  • 4.4. Conductive inks
  • 4.5. Conductive pastes
  • 4.6. Conductive photopolymers

5. APPLICATIONS

  • 5.1. Interconnects
  • 5.2. Antennas
  • 5.3. Microbatteries
  • 5.4. Low volume manufacturing
  • 5.5. Electromagnets
  • 5.6. Ceramic capacitor
  • 5.7. Organic Photovoltaic
  • 5.8. Metamaterials
  • 5.9. Ballistic rectifier
  • 5.10. Piezoelectric device

6. TECHNOLOGIES

  • 6.1. Extrude molten solder
  • 6.2. Extrude molten solder: SWOT
  • 6.3. Extrude conductive filament
  • 6.4. Extrude conductive filament: SWOT
  • 6.5. Inkjet
  • 6.6. Inkjet: SWOT
  • 6.7. Aerosol Jet
  • 6.8. Aerosol Jet: SWOT
  • 6.9. Paste extrusion
  • 6.10. Paste extrusion

7. COMPETING TECHNOLOGIES

  • 7.1. 3D Printer and conductive ink/paste/glue
  • 7.2. CNC Milling
  • 7.3. Laser Direct Structuring (LDS)

8. PLAYERS

  • 8.1. AgIC
  • 8.2. AgIC: SWOT
  • 8.3. Voltera
  • 8.4. Voltera: SWOT
  • 8.5. Cartesian Co.
  • 8.6. Cartesian Co: SWOT
  • 8.7. BotFactory
  • 8.8. BotFactory: SWOT
  • 8.9. NanoDimension
  • 8.10. NanoDimension: SWOT
  • 8.11. Ceradrop
  • 8.12. Ceradrop: SWOT
  • 8.13. Optomec
  • 8.14. Optomec: SWOT
  • 8.15. Neotech AMT
  • 8.16. Neotech AMT: comparison
  • 8.17. Neotech AMT: SWOT
  • 8.18. Voxel8
  • 8.19. Voxel8: conductivity
  • 8.20. Voxel8: SWOT
  • 8.21. Novacentrix and nScrypt
  • 8.22. Pulse Electronics

9. RESEARCH INSTITUTES

  • 9.1. University of Texas at El Paso (UTEP)
  • 9.2. Cornell University

10. MARKETS AND FORECASTS

  • 10.1. End users
  • 10.2. Player classification
  • 10.3. Technology strengths and weaknesses
  • 10.4. Opportunities
  • 10.5. Kickstarter funding
  • 10.6. Consumer market
  • 10.7. Educational market
  • 10.8. Professional PCB prototyping market
  • 10.9. Industrial market
  • 10.10. Total market forecast
  • 10.11. Limitations of the forecast
  • 10.12. Conclusions

11. COMPANY PROFILES

  • 11.1. AgIC
  • 11.2. BotFactory
  • 11.3. Cartesian Co
  • 11.4. CERADROP
  • 11.5. Chemcubed
  • 11.6. Nano Dimension
  • 11.7. Nascent Objects, Inc
  • 11.8. Novacentrix
  • 11.9. nScrypt Inc
  • 11.10. Optomec
  • 11.11. Pulse Electronics
  • 11.12. Voxel8
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