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市場調查報告書

軟性電子產品隔離層的技術,市場,預測:2017年∼2027年

Barrier Layers for Flexible Electronics 2017-2027: Technologies, Markets, Forecasts

出版商 IDTechEx Ltd. 商品編碼 312862
出版日期 內容資訊 英文 208 Slides
商品交期: 最快1-2個工作天內
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軟性電子產品隔離層的技術,市場,預測:2017年∼2027年 Barrier Layers for Flexible Electronics 2017-2027: Technologies, Markets, Forecasts
出版日期: 2017年06月22日 內容資訊: 英文 208 Slides
簡介

全球彈性阻隔薄膜市場,預計2026年超過8億7500萬美元的規模。

本報告提供對應軟性電子產品產品的隔離層技術的市場詳細分析,到2026年的預測,各種相關技術,主要企業簡介介紹。

第1章 調查範圍

第2章 正達到成熟階段的阻隔技術 - 商業化現況

  • 主要的顯示器製造商趨勢
    • Samsung
    • LG
    • 其他
  • TFE和阻隔貼合加工
  • 利用軟塑料和軟性玻璃的ML阻隔
  • 單層和多層
  • 軟式電路板的處理
  • 原子層成長法 (ALD)的現在及未來展望與市場佔有率

第3章 封裝相關簡介

第4章 表面平滑度 - 缺點

  • 表面平滑度相關重要課題
  • 微小缺點
    • 針孔 - 粒子
    • 平滑度/裂縫和傷
    • 奈米缺點

第5章 阻隔技術:到目前為止的進步

  • Vitex
  • GE

第6章 阻隔製造工程的進步

第7章 阻隔黏劑

  • DELO
  • tesa
  • 3M
  • Henkel

第8章 主要企業簡介

  • 高分子基板晶粒廣告和無機等級鍍氣的產品的廠商
    • 凸版印刷
    • Vitriflex
    • Holst Centre - TNO
    • 三菱
    • Toray Industries
    • 3M
    • Amcor
    • Tera-Barrier
    • Fujifilm
    • UDC
    • Konica Minolta
    • Samsung
    • Honeywell
    • LG Display
    • Applied Materials
    • Meyer Burger Group
  • 開發高分子薄膜的其他企業
    • Dow Chemical
    • Jindal
  • 軟性玻璃
    • Schott AG
    • Corning
    • Asahi Glass (AGC)
    • Nipon Electric Glass (NEG)
  • 彈性阻隔的ALD技術
    • Lotus
    • Beneq
    • Encapsulix
  • 其他的方法
    • CNM Technologies
    • 3M

第9章 阻隔薄膜技術的有效市場

  • OLED顯示器 - OLED照明
  • 有機薄膜電晶體 (OTFT)
  • 液晶顯示器 - 電泳顯示器
  • 有機太陽能電池 (OPV)
  • CIGS - 非晶硅

第10章 阻隔性能評估技術

  • 鈣測試
  • MOCON
  • Vinci Technologies
  • SEMPA
  • VG Scienta
  • 螢光描繪器
  • 黑點分析
  • 氚試驗
  • CEA
  • 3M
  • IMRE
  • 質譜分析法 - 氣體滲透 (WVTR和OTR評估技術的應用的可能性)
  • Kisco Uniglobe

第11章 軟性電子產品用阻隔薄膜的預測

  • 有機電子產品及印刷無機電子產品的潛在重要性
  • 阻隔薄膜市場規模
  • 塑膠基板上的軟性玻璃或無機層

第12章 結論

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目錄

Encapsulation films, in-line deposition, ALD and flexible glass

By 2027 flexible barrier manufacturing will be a market of more than $3.1 billion.

The first examples of flexible consumer electronic devices are now a reality, and a large opportunity lies in developing them further: devices in a flexible form factor that can operate without deterioration in performance, allowing them to be more robust, lightweight and versatile in their use and form factor is the end game . In order for products such as flexible displays and photovoltaics to be commercially successful, they must be robust enough to survive for the necessary time and conditions required of the device. This condition has been a limitation of many flexible, organic or printable electronics. This highlights the fact that beyond flexibility, printability and functionality, one of the most important requirements is robust encapsulation; this is a major challenge as many of the materials used in printed or organic electronic displays are chemically sensitive, and will react with many environmental components such as oxygen and moisture.

Plastic substrates and transparent flexible encapsulation barriers can be used, but these offer little protection to oxygen and water, resulting in the devices rapidly degrading. In order to achieve device lifetimes of tens of thousands of hours, water vapor transmission rates (WVTR) must be 10-6 g/m2/day, and oxygen transmission rates (OTR) must be < 10-3 cm3/m2/day. For Organic Photovoltaics, the required WVTR is not as stringent as OLEDs require but is still very high at a level of 10-5 g/m2/day. These transmission rates are several orders of magnitude smaller than what is possible using any conventional plastic substrate, and they can also be several orders of magnitude smaller than what can be measured using common equipment designed for this purpose.

Table 1: Water vapor and oxygen transmission rates of various materials

Source: Source IDTechEx

For these (and other) reasons, there has been intense interest in developing transparent barrier materials with much lower permeabilities, a market that will reach over $3,1bn by 2027.

Figure 1: Barrier layer market forecasts in US$ million*

*For the full forecast data please purchase this report
Source: IDTechEx

This report from IDTechEx gives an in-depth review of the needs, emerging solutions and key players. It addresses specific topics such as:

  • The choice device developers have to make is whether to follow the route of direct deposition of thin film encapsulation (TFE) or that of encapsulation with a pre-made barrier film, supplied by film producers. Each approach has its merits and drawbacks which are discussed in the report, along with which application spaces follow which approach and why.
  • Companies which are active in the development of high barrier films and their achievements on the field to date. The report covers a range of approaches in encapsulation, such as dyads, deposition of inorganic layers on plastic substrates and flexible glass.
  • Depending on the deposition process utilized, different qualities of barrier are produced: PE CVD has been a proven technology that has been most commonly used to date, but an interest in ALD has been precipitating with many active projects looking into its incorporation in encapsulation solutions. Benefits and drawbacks are discussed in detail.
  • Surface smoothness and defects (such as cracks and pinholes) and the effect that these would have on the barrier behavior of the materials studied.
  • Traditional methods of measurement of permeability are reaching the end of their abilities. The MOCON WVTR measurement device, which has been an industry standard, cannot give adequate measurements at the low levels of permeability required for technologies such as organic photovoltaics and OLEDs. Other methods of measurement and equipment developed are being discussed.
  • Forecasts for displays, lighting and thin film photovoltaics (in terms of market value as well as area of barrier film sold into different verticals), in order to understand the influence that the development of flexible barriers would have at the mass deployment and adoption of these technologies.
  • Detailed profiles and benchmarking of key technology developers, based in almost 10 years of IDTechEx research in the space for barrier layers.

For those developing flexible electronics, seeking materials needs and opportunities, this is a must-read report.

Analyst access from IDTechEx

All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.

Table of Contents

1. INTRODUCTION

  • 1.1. Introduction to flexible encapsulation & barrier layers
  • 1.2. The need for flexible encapsulation & barrier layers
  • 1.3. Comparison of performance metrics for different encapsulation solutions
  • 1.4. Comparison of performance metrics for different encapsulation solutions

2. BARRIER TECHNOLOGY - COMMERCIALIZATION STATUS

  • 2.1. Technology trends from major adopters - Samsung
  • 2.2. Technology trends from major adopters - LG & others
  • 2.3. Technology trends:TFE vs. barrier lamination
  • 2.4. Technology trends: Single or multilayer - Substrate handling
  • 2.5. Technology trends: The future of ALD in encapsulation
  • 2.6. Technology trends: The future of ALD in encapsulation
  • 2.7. Technology trends: plastics vs. flexible glass
  • 2.8. Technology trends: plastics vs. flexible glass (2)

3. ENCAPSULATION- BASIC PRINCIPLES

  • 3.1. Barrier technology principles
  • 3.2. Barrier key requirements
  • 3.3. Barrier key requirements
  • 3.4. Encapsulation: Dyads

4. SURFACE SMOOTHNESS - DEFECTS

  • 4.1. Surface smoothness considerations
  • 4.2. Porosity pinholes and cracks
  • 4.3. Barrier properties as a function of the thickness of the deposited film
  • 4.4. Micro defects
  • 4.5. Pinholes
  • 4.6. Particles
  • 4.7. Eliminating scratches and cracks
  • 4.8. Resistance to scratching/cracking
  • 4.9. Nano-defects

5. BARRIER TECHNOLOGIES - PAST DEVELOPMENTS

  • 5.1. Vitex - The PML process
  • 5.2. Vitex - Multilayers and dyads
  • 5.3. The multilayer barrier and the Vitex flexible glass.
  • 5.4. Vitex - Multilayers and dyads
  • 5.5. Vitex - hybrid encapsulation and Samsung acquisition
  • 5.6. GE - graded barrier
  • 5.7. GE - graded barrier - Sabic acquisition
  • 5.8. POLO - Fraunhofer

6. ADVANCES IN ENCAPSULATION MANUFACTURING PROCESSES

  • 6.1. Advances in encapsulation manufacturing processes - ALD
  • 6.2. R2R ALD
  • 6.3. PECVD will compete head to head with ALD

7. BARRIER ADHESIVES

  • 7.1. Barrier adhesives
  • 7.2. Barrier adhesives: 3M
  • 7.3. Barrier adhesives: DELO - Henkel
  • 7.4. Barrier adhesives: tesa

8. ADDRESSABLE MARKET SEGMENTS FOR ENCAPSULATION TECHNOLOGIES

  • 8.1. Addressable markets - Flexible OLED displays & lighting
  • 8.2. Addressable markets - plastic rigid precede fully flexible OLED displays
  • 8.3. Addressable markets: Quantum dot (QD) LCDs
  • 8.4. Addressable markets: Integration approaches for QD LCDs
  • 8.5. Addressable markets: quantum dot enhancement film
  • 8.6. Addressable markets: OTFTs, LCDs and electrophoretic displays
  • 8.7. Addressable markets: flexible photovoltaics

9. MARKET FORECASTS

  • 9.1. The potential significance of organic and printed inorganic electronics: flexibility, robustness & lower cost
  • 9.2. Challenges with non rigid substrates
  • 9.3. Inkjet printing for organic material deposition
  • 9.4. ALD entering maturity in encapsulation applications
  • 9.5. Application driven choice between in-line TFE and barrier film: Flexible PV and Quantum Dots
  • 9.6. Barrier material forecasts 2017-2027 (sq. m)
  • 9.7. Barrier revenues forecasts 2017-2027 ($ million)

10. COMPANY PROFILES

  • 10.1.1. Toppan Printing
  • 10.1.2. Vitriflex
  • 10.1.3. TNO Holst Centre
  • 10.1.4. Mitsubishi
  • 10.1.5. 3M
  • 10.1.6. Amcor
  • 10.1.7. Tera-Barrier Films
  • 10.1.8. Fujifilm
  • 10.1.9. UDC
  • 10.1.10. Konica Minolta
  • 10.1.11. Samsung
  • 10.1.12. LG Display
  • 10.1.13. Applied Materials
  • 10.1.14. Meyer Burger Group
  • 10.2. Flexible glass
    • 10.2.1. Schott AG
    • 10.2.2. Corning
    • 10.2.3. Asahi Glass Company (AGC)
    • 10.2.4. Nippon Electric Glass (NEG)
  • 10.3. ALD deposition for flexible barriers
    • 10.3.1. ALD deposition for flexible barriers
    • 10.3.2. Lotus
    • 10.3.3. Beneq
    • 10.3.4. Encapsulix

11. BARRIER MEASUREMENTS

  • 11.1. The Calcium Test
  • 11.2. MOCON
  • 11.3. Vinci Technologies
  • 11.4. SEMPA
  • 11.5. VG Scienta
  • 11.6. Fluorescent Tracers
  • 11.7. Black Spot Analysis
  • 11.8. Tritium Test
  • 11.9. CEA
  • 11.10. 3M
  • 11.11. IMRE
  • 11.12. Mass Spectroscopy - gas permeation (WVTR & OTR potential applications)
  • 11.13. Kisco Uniglobe
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