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市場調查報告書

半導體包裝設備的全球市場:2016年∼2020年

Global Semiconductor Packaging Equipment Market 2016-2020

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 368226
出版日期 內容資訊 英文 67 Pages
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半導體包裝設備的全球市場:2016年∼2020年 Global Semiconductor Packaging Equipment Market 2016-2020
出版日期: 2016年08月24日 內容資訊: 英文 67 Pages
簡介

全球半導體包裝設備市場預測在2016年∼2020年間將以年複合成長率 (CAGR) 8.04%的速度成長。

本報告提供全球半導體包裝設備市場相關調查分析,市場規模與成長率,市場趨勢,市場的推動要素與課題,市場機會驗證,再加上主要供應商等相關的系統性資訊。

第1章 摘要整理

  • 焦點

第2章 調查範圍

第3章 市場調查手法

  • 調查手法
  • 經濟指標

第4章 簡介

  • 主要市場焦點

第5章 技術形勢

  • 晶圓構裝 vs. 晶粒級構裝·組裝
  • 半導體包裝產業發展藍圖
  • 半導體IC封裝產業的生態系統

第6章 半導體包裝設備的全球市場:形勢

  • 客戶預測
  • 市場規模與預測
  • 波特的五力分析

第7章 半導體包裝設備的全球市場:各類型

  • 各類型
  • 晶粒級包裝設備
  • 晶圓級構裝設備

第8章 半導體包裝設備的全球市場:各終端用戶

  • 各終端用戶
  • OSAT
  • IDM

第9章 半導體包裝設備的全球市場:各地區

  • 各地區
  • 亞太地區
  • 北美
  • 歐洲

第10章 半導體包裝設備的全球市場:推動因素

第11章 推動因素的影響

第12章 半導體包裝設備的全球市場:課題

第13章 推動因素與課題的影響

第14章 半導體包裝設備的全球市場:趨勢

第15章 業者情勢

  • 競爭模式
  • 主要供應商
  • 其他卓越供應商

第16章 附錄

  • 簡稱清單

第17章 關於Technavio

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目錄
Product Code: IRTNTR10101

About Semiconductor Packaging

Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components.

Semiconductor packaging offers the following benefits to wafers:

  • Prevents corrosion
  • Offers protection in case of impact
  • Dissipates heat produced in the device

Secures the contact leads or pins used to plug in the device to its external circuits

Technavio's analysts forecast the global semiconductor packaging equipment market to grow at a CAGR of 8.04% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor packaging equipment market for 2016-2020. To calculate the market size, the report considers the sale of semiconductor packaging equipment to the end-users - OSATs and IDMs.

The market is divided into the following segments based on geography:

  • APAC
  • Europe
  • North America

Technavio's report, Global Semiconductor Packaging Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Applied Materials
  • ASM Pacific Technology
  • Kulicke and Soffa Industries
  • Tokyo Electron Limited
  • Tokyo Seimitsu

Other Prominent Vendors

  • ChipMos
  • Greatek
  • Hua Hong
  • Jiangsu Changjiang Electronics Technology
  • Lingsen Precision
  • Nepes
  • Tianshui Huatian
  • Unisem
  • Ultratech

Market driver

  • High demand for polymer adhesive wafer bonding equipment
  • For a full, detailed list, view our report

Market challenge

  • Fluctuation of foreign exchange rates
  • For a full, detailed list, view our report

Market trend

  • Growing number of mergers and acquisitions
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Definition
  • Source year and forecast period
  • Market reportage
  • Market size computation
  • Market segmentation
  • Geographical coverage
  • Vendor segmentation
  • Common currency conversion rates
  • Top-vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Technology landscape

  • Wafer-level versus die-level packaging and assembly
  • Roadmap of semiconductor packaging industry
  • Ecosystem of semiconductor IC packaging industry

PART 06: Market landscape

  • Customer perspective
  • Market size and forecast
  • Five forces analysis

PART 07: Market segmentation by type

  • Types of packaging equipment
  • Die-level packaging equipment
  • Wafer-level packaging equipment

PART 08: Market segmentation by end-user

  • Global semiconductor packaging equipment market by end-user
  • OSATs
  • IDMs

PART 09: Geographical segmentation

  • Global semiconductor packaging equipment market by region
  • APAC
  • North America
  • Europe

PART 10: Market drivers

  • Growing number of fabs
  • High demand for polymer adhesive wafer bonding equipment
  • Complex semiconductor IC designs
  • Explosive growth of wireless computing devices along with advent of IoT
  • Growing demand for compact electronic devices
  • High need for SoC technology

PART 11: Impact of drivers

PART 12: Market challenges

  • High inventory levels in supply chain
  • Dependency on few key suppliers
  • Fluctuation of foreign exchange rates
  • High investment market

PART 13: Impact of drivers and challenges

PART 14: Market trends

  • Development of 3D chip packaging
  • Increase in number of OSAT vendors
  • Growing number of mergers and acquisitions
  • FOWLP technology
  • High need for semiconductor memory devices
  • Growing acceptance of wearable devices
  • Automation in automobiles

PART 15: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 16: Appendix

  • List of abbreviations

PART 17: Explore Technavio

List of Exhibits

  • Exhibit 01: Segmentation of global semiconductor packaging equipment market
  • Exhibit 02: List of countries in key regions
  • Exhibit 03: Market vendors
  • Exhibit 04: Currency conversions
  • Exhibit 05: Product offerings
  • Exhibit 06: Steps involved in back-end chip formation
  • Exhibit 07:.5D IC block diagram
  • Exhibit 08:D IC block diagram
  • Exhibit 09: Supply chain in traditional semiconductor IC packaging industry
  • Exhibit 10: Supply chain in new semiconductor IC packaging industry
  • Exhibit 11: Global semiconductor packaging equipment market 2015-2020 ($ billions)
  • Exhibit 12: Five forces analysis
  • Exhibit 13: Global semiconductor packaging equipment market by type 2015 (% share)
  • Exhibit 14: Global semiconductor packaging equipment market by type 2020 (% share)
  • Exhibit 15: Global semiconductor packaging equipment market by die-level packaging equipment 2015-2020 ($ millions)
  • Exhibit 16: Global semiconductor packaging equipment market by wafer-level packaging equipment 2015-2020 ($ millions)
  • Exhibit 17: Global semiconductor packaging equipment market by end-user 2015 (% share)
  • Exhibit 18: Global semiconductor packaging equipment market by end-user 2020 (% share)
  • Exhibit 19: Global semiconductor packaging equipment market by OSAT 2015-2020 ($ millions)
  • Exhibit 20: Global semiconductor packaging equipment market by IDM 2015-2020 ($ millions)
  • Exhibit 21: Global semiconductor packaging equipment market by region 2015 (% share)
  • Exhibit 22: Global semiconductor packaging equipment market by region 2020 (% share)
  • Exhibit 23: Semiconductor packaging equipment market in APAC 2015-2020 ($ millions)
  • Exhibit 24: Semiconductor packaging equipment market in North America 2015-2020 ($ millions)
  • Exhibit 25: Semiconductor packaging equipment market in Europe 2015-2020 ($ millions)
  • Exhibit 26: Global semiconductor packaging equipment market 2015-2020 (% share)
  • Exhibit 27: CAGR of LED chip and sensor market 2015-2020
  • Exhibit 28: Impact of drivers
  • Exhibit 29: Impact of drivers (continued)
  • Exhibit 30: Global semiconductor market trend 1992-2015 ($ billions)
  • Exhibit 31: Impact of drivers and challenges
  • Exhibit 32: CAGR of 3D NAND and DRAM 2015-2020
  • Exhibit 33: Cars shipment growth forecast 2015-2020 (% growth)
  • Exhibit 34: Applied Materials: Segment-wise revenue contribution 2015 (% share)
  • Exhibit 35: Applied Materials: Segment-wise revenue break-up 2015 ($ billions)
  • Exhibit 36: Applied Materials: Silicon system segment performance 2014-2015 ($ billions)
  • Exhibit 37: Applied Materials: R&D expenses 2011-2015 ($ billions)
  • Exhibit 38: TEL: Sector performance by revenue 2012-2015
  • Exhibit 39: Tokyo Seimitsu: Business segmentation by revenue 2013-2015 ($ millions)
  • Exhibit 40: Other vendors in global semiconductor packaging equipment market
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