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市場調查報告書

FEOL (基板工程) 用半導體製造設備的全球市場:2016∼2020年

Global Front End of the Line Semiconductor Equipment Market 2016-2020

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 368213
出版日期 內容資訊 英文 63 Pages
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FEOL (基板工程) 用半導體製造設備的全球市場:2016∼2020年 Global Front End of the Line Semiconductor Equipment Market 2016-2020
出版日期: 2016年08月23日 內容資訊: 英文 63 Pages
簡介

半導體製造設備佔半導體整體市場中重要的位置,半導體晶片廠商以銷售額的20%用作製造設備的購買。半導體製造設備的市場分成前工程與後工程兩種,不過,前工程投資額很大,佔整體60%。前工程還分為FEOL (基板工程)、BEOL (線路工程)兩種 。全球FEOL用半導體製造設備市場,預計2016∼2020年以1.78%的年複合成長率成長。

本報告提供全球FEOL (Front End of Line) 用半導體製造設備的市場相關分析,市場概要和結構,市場規模趨勢 (今後5年的預測值),各產品、各終端用戶、各地區的詳細趨勢,推動、阻礙市場要素與其影響力,主要企業簡介,今後的市場機會等調查評估。

第1章 摘要整理

  • 分析結果的概要

第2章 分析範圍

  • 分析概要
  • 定義
  • 基準年、預測期間
  • 產品的分類
  • 終端用戶的分類
  • 地區區分
  • 匯率
  • 大供應商的主要產品

第3章 市場分析技術

  • 分析方法
  • 經濟指標

第4章 簡介

  • 市場趨勢的概要

第5章 FEOL用半導體製造設備:技術環境

  • 晶圓製造工程的技術環境
  • 晶圓層級的製造設備的類別
  • 主要客戶

第6章 FEOL用半導體製造設備的全球市場:市場環境

  • 市場概要
  • 市場規模與其預測
  • 波特的五力分析

第7章 FEOL用半導體製造設備的全球市場:各產品的市場區隔

  • 市場概要
  • 市場規模與其預測

第8章 FEOL用半導體製造設備的全球市場:各終端用戶的市場區隔

  • 市場概要
  • 市場規模與其預測
  • 晶圓代工廠
  • 記憶體
  • 垂直整合型設備廠商 (IDM)

第9章 FEOL用半導體製造設備的全球市場:地區區分

  • 全球FEOL用半導體製造設備的市場:各地區
  • 市場規模與其預測
  • 亞太地區
  • 南北美洲 Americas
  • 歐洲、中東、非洲各國 (EMEA)

第10章 FEOL用半導體製造設備的主要國家市場

  • 台灣
  • 韓國
  • 日本

第11章 FEOL用半導體製造設備的全球市場:推動因素

  • 全球各地的半導體製造地的增加
  • 高性能家電市場成長
  • 電子設備的小型化
  • 3維IC的登場

第12章 推動因素的影響力

第13章 FEOL用半導體製造設備的全球市場:課題

  • 設備價格高
  • 回收期間的長度
  • 半導體產業的興衰

第14章 推動因素、課題的影響力

第15章 FEOL用半導體製造設備的全球市場:趨勢

  • 汽車用電子元件的劇增
  • 經由IoT (物聯網) 的連網型設備的增加,和其他新市場
  • 記憶體生產設備的投資增額
  • 智慧裝置的更新周期的縮短
  • FinFET架構的引進

第16章 附錄

  • 簡稱集

第17章 關於Technavio

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目錄
Product Code: IRTNTR10319

About Semiconductor Equipment Industry and Front-End Process

The semiconductor equipment industry is an important part of the overall semiconductor market, with semiconductor chipmakers investing 20% of their sales in obtaining manufacturing equipment. The equipment manufacturing companies are leading the development of most core process technologies in the semiconductor market. The semiconductor production equipment industry is divided into front-end and back-end process equipment. The front-end process includes advanced technology and integration. Investment in front-end equipment is more than back-end equipment, with 60% of the total investment made for front-end equipment. The front-end process is subdivided into front-end-of-the-line (FEOL) and back-end-of-the-line (BEOL).

Technavio's analysts forecast the global front-end-of-the-line (FEOL) semiconductor equipment market to grow at a CAGR of 1.78% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global front-end-of-the-line (FEOL) semiconductor equipment market for 2016-2020. To calculate the market size, the report considers revenue generated from the sales of FEOL semiconductor equipment.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Front-End-Of-The-Line (FEOL) Semiconductor Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Applied Materials
  • ASML
  • KLA-Tencor
  • Lam Research
  • Tokyo Electron

Other Prominent Vendors

  • Dainippon Screen Manufacturing
  • Hitachi High-Technologies
  • Nikon
  • Hitachi Kokusai Electric

Market driver

  • Increase in number of fabs worldwide
  • For a full, detailed list, view our report

Market challenge

  • High cost of equipment
  • For a full, detailed list, view our report

Market trend

  • Proliferation of automotive electronics
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Definition
  • Source year and forecast period
  • Product segmentation
  • End-user segmentation
  • Geographical segmentation
  • Common currency conversion rates
  • Top-vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Technology landscape

  • Technology landscape of wafer fab equipment
  • Wafer-level manufacturing equipment categories
  • Key customers

PART 06: Market landscape

  • Market overview
  • Market size and forecast
  • Five forces analysis

PART 07: Market segmentation by product

  • Market overview
  • Market size and forecast

PART 08: Market segmentation by end-user

  • Market overview
  • Market size and forecast
  • Foundry
  • Memory
  • IDM

PART 09: Geographical segmentation

  • Global FEOL semiconductor equipment market by geography
  • Market size and forecast
  • APAC
  • Americas
  • EMEA

PART 10: Key leading countries

  • Taiwan
  • South Korea
  • Japan

PART 11: Market drivers

  • Increase in number of fabs worldwide
  • Growth of advanced consumer electronics market
  • Miniaturization of electronic devices
  • Advent of 3D ICs

PART 12: Impact of drivers

PART 13: Market challenges

  • High cost of equipment
  • Long payback period
  • Fluctuations in the semiconductor industry

PART 14: Impact of drivers and challenges

PART 15: Market trends

  • Proliferation of automotive electronics
  • Growing number of connected devices through IoT and other emerging markets
  • Increasing investment in memory capacity
  • Shorter replacement cycle of smart devices
  • Adoption of FinFET architecture

PART 16: Vendor landscape

  • Competitive scenario
  • Other prominent vendors

PART 17: Explore Technavio

List of Exhibits

  • Exhibit 01: List of major countries considered
  • Exhibit 02: Product offerings
  • Exhibit 03: Semiconductor production equipment
  • Exhibit 04: Semiconductor IC manufacturing process
  • Exhibit 05: Front-end chip formation steps
  • Exhibit 06: Back-end chip formation steps
  • Exhibit 07: Wafer-level manufacturing equipment categories
  • Exhibit 08: Requirements of a manufacturing equipment
  • Exhibit 09: Global FEOL semiconductor equipment market 2015-2020 ($ billions)
  • Exhibit 10: Five forces analysis
  • Exhibit 11: Global FEOL semiconductor equipment market by product 2015-2020 (% share)
  • Exhibit 12: Global FEOL semiconductor equipment market by product 2015-2020 ($ billions)
  • Exhibit 13: Global FEOL semiconductor equipment market by end-user 2015-2020 (% share)
  • Exhibit 14: Global FEOL semiconductor equipment market by end-user 2015-2020 ($ billions)
  • Exhibit 15: Global FEOL semiconductor equipment market by foundry segment 2015-2020 ($ billions)
  • Exhibit 16: Global FEOL semiconductor equipment market by memory segment 2015-2020 ($ billions)
  • Exhibit 17: Global FEOL semiconductor equipment market by IDM segment 2015-2020 ($ billions)
  • Exhibit 18: Global FEOL semiconductor equipment market by geography 2015-2020 (% share)
  • Exhibit 19: Global FEOL semiconductor equipment market by geography 2015-2020 ($ billions)
  • Exhibit 20: FEOL semiconductor equipment market in APAC 2015-2020 ($ billions)
  • Exhibit 21: Global wearables market 2015-2020 ($ billions)
  • Exhibit 22: FEOL semiconductor equipment market in Americas 2015-2020 ($ billions)
  • Exhibit 23: FEOL semiconductor equipment market in EMEA 2015-2020 ($ billions)
  • Exhibit 24: Global NAND flash market 2015-2020 (% share)
  • Exhibit 25: Consumer electronics market 2015-2020 (unit shipment in millions)
  • Exhibit 26: Global MEMS market 2015-2020
  • Exhibit 27: Impact of drivers
  • Exhibit 28: Global semiconductor market trend 1990-2015 ($ billions)
  • Exhibit 29: Impact of drivers and challenges
  • Exhibit 30: Cars shipment growth forecast 2015-2020 (% growth)
  • Exhibit 31: IoT spending and device penetration 2014, 2015, and 2020
  • Exhibit 32: CAGR of 3D NAND and DRAM 2015-2020
  • Exhibit 33: Key vendors
  • Exhibit 34: ASML customers by end-user segment
  • Exhibit 35: Other prominent vendors
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