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市場調查報告書

晶片貼片機的全球市場 (2016∼2020年)

Global Chip Mounter Market 2016-2020

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 362066
出版日期 內容資訊 英文 58 Pages
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晶片貼片機的全球市場 (2016∼2020年) Global Chip Mounter Market 2016-2020
出版日期: 2016年06月28日 內容資訊: 英文 58 Pages
簡介

晶片密度上升和封裝系統的進步並進,晶片實行技術這20年間大幅度進化。最初從通孔實行技術 (THT)開始,其次是表面黏著技術 (SMT) 登場,現在轉向細間距技術 (FPT:覆晶技術)。全球晶片貼片機市場,預計2016∼2020年以8.05%的年複合成長率 (CAGR) 成長。

本報告提供全球晶片貼片機的市場相關分析,市場概要和結構,市場規模趨勢 (今後5年的預測值),各技術、各用途、各地區的詳細趨勢,推動、阻礙市場要素與其影響力,主要企業簡介,今後的市場機會等調查評估。

第1章 摘要整理

  • 分析結果的概要

第2章 分析範圍

  • 分析範圍
  • 基準年、預測期間
  • 分析對象地區
  • 匯率
  • 大供應商的主要產品

第3章 市場分析技術

  • 分析方法
  • 經濟指標

第4章 簡介

  • 市場趨勢的概要
  • 技術環境

第5章 產業概要

  • 半導體封裝產業概要
  • 全球半導體產業的價值鏈

第6章 市場環境

  • 市場概要
  • 市場規模與其預測
  • 波特的五力分析

第7章 各技術的市場區隔

  • 全球晶片貼片機市場:各技術
  • 表面黏著技術 (SMT)
  • 通孔實行技術 (THT)

第8章 各用途的市場區隔

  • 全球晶片貼片機市場:各用途
  • 各用途的市場趨勢

第9章 地區區分

  • 全球晶片貼片機市場:各地區
  • 亞太地區
  • 歐洲、中東、非洲各國 (EMEA)
  • 南北美洲

第10章 推動市場要素

  • 通訊相關的小工具的普及
  • 晶片密度的上升
  • 電子設備的小型化

第11章 推動因素的影響力

第12章 市場課題

  • 半導體產業的景氣循環結構
  • 全球經濟的不透明性

第13章 推動因素、課題的影響力

第14章 市場趨勢

  • IoT愈來愈受重視
  • 汽車的電子化的發展
  • 穿戴式技術的登場

第15章 供應商環境

  • 競爭方案
  • 其他卓越供應商

第16章 市場摘要

  • 圖表:市場摘要

第17章 附錄

  • 簡稱集

第18章 關於Technavio

圖表一覽

目錄
Product Code: IRTNTR9621

About the Chip Mounter Market

The chip mounting technology has progressed significantly over the last two decades in terms of a practical solution for achieving higher densities related to packaging systems. It started with the conventional through hole technology (THT), then resurfaced as surface mount technology (SMT) and fine pitch technology (FPT). Most manufacturers are using both SMT and THT to produce chips mounted on substrates. The dynamic semiconductor packaging technology has evolved with the help of THT (with component steers through 2.54 mm hole). Then comes SMT, which leads on 1.27 mm hole with minimal sized centers. The FPT leads on 0.63 mm as well as 0.50 mm centers. The component package mainly consists of a silicon-based die or integrated circuits chips, which got reduced to a large extent within the last two decades. Thus, the chip mounting technology has moved from a big diameter to a small diameter of space.

Technavio's analysts forecast the global chip mounter market to grow at a CAGR of 8.05% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global chip mounter market for 2016-2020. To calculate the market size, the report considers revenue from the sales of chip mounter equipment.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Chip Mounter Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Hitachi
  • Juki Corporation
  • Nitto Denko Corporation
  • Panasonic
  • Yamaha Corporation

Other Prominent Vendors

  • ASM Pacific Technology
  • Canon
  • Essemtec
  • Ohashi Engineering
  • Nordson
  • Samsung Techwin
  • Sony
  • Sun Electric Industries
  • TOA

Market driver

  • Growing adoption of communication-related consumer electronic gadgets
  • For a full, detailed list, view our report

Market challenge

  • Uncertain global economic conditions
  • For a full, detailed list, view our report

Market trend

  • Emergence of wearable technology
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Report coverage
  • Base year and forecast period
  • Geographical segmentation
  • Common currency conversion rates
  • Vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights
  • Technology landscape

PART 05: Industry overview

  • Overview of semiconductor packaging industry
  • Global semiconductor industry value chain

PART 06: Market landscape

  • Market overview
  • Market size and forecast
  • Five forces analysis

PART 07: Market segmentation by technology

  • Global chip mounter market by technology
  • SMT segment
  • THT segment

PART 08: Market segmentation by application

  • Global chip mounter market by application
  • Application segmentation

PART 09: Geographical segmentation

  • Global chip mounter market by region
  • APAC
  • EMEA
  • Americas

PART 10: Market drivers

  • Growing adoption of communication-related electronic gadgets
  • Increase in chip density
  • Miniaturization of electronics

PART 11: Impact of drivers

PART 12: Market challenges

  • Cyclical nature of semiconductor industry
  • Uncertain global economic conditions

PART 13: Impact of drivers and challenges

PART 14: Market trends

  • Growing focus on IoT
  • Increasing automation in automobiles
  • Emergence of wearable technology

PART 15: Vendor landscape

  • Competitive scenario
  • Other prominent vendors

PART 16: Market summary

  • Market figure snapshot

PART 17: Appendix

  • List of abbreviations

PART 18: Explore Technavio

List of Exhibits

  • Exhibit 01: Global chip mounter market segmentation
  • Exhibit 02: Major countries covered
  • Exhibit 03: Currency conversion rates
  • Exhibit 04: Product offerings
  • Exhibit 05: Changes in semiconductor packaging size and component density
  • Exhibit 06: Evolution of semiconductor IC packaging
  • Exhibit 07:.5D IC packaging technology using TSVs and silicon interposers
  • Exhibit 08:D semiconductor packaging technology using TSVs
  • Exhibit 09: Semiconductor value chain
  • Exhibit 10: Front-end processes
  • Exhibit 11: Back-end processes
  • Exhibit 12: Global chip mounter market forecast 2015-2020 ($ billions)
  • Exhibit 13: Five forces analysis
  • Exhibit 14: Global chip mounter market by technology 2015
  • Exhibit 15: Global chip mounter market by technology 2020
  • Exhibit 16: SMT segment forecast of global chip mounter market 2015-2020 ($ billions)
  • Exhibit 17: THT segment forecast of global chip mounter market 2015-2020 ($ millions)
  • Exhibit 18: Global chip mounter market by application 2015-2020 (% share)
  • Exhibit 19: Global chip mounter market by application 2015-2020 ($ billions)
  • Exhibit 20: Global chip mounter market by communication segment 2015-2020 ($ billions)
  • Exhibit 21: Global chip mounter market by computer segment 2015-2020 ($ billions)
  • Exhibit 22: Global chip mounter market by consumer electronics segment 2015-2020 ($ millions)
  • Exhibit 23: Global chip mounter market by automotive segment 2015-2020 ($ millions)
  • Exhibit 24: Global chip mounter market by region 2015
  • Exhibit 25: Global chip mounter market by region 2020
  • Exhibit 26: Chip mounter market in APAC 2015-2020 ($ billions)
  • Exhibit 27: Chip mounter market in EMEA 2015-2020 ($ billions)
  • Exhibit 28: Chip mounter market in Americas 2015-2020 ($ billions)
  • Exhibit 29: Global smartphone shipment forecast 2015-2020 (millions of units)
  • Exhibit 30: Global tablet shipments forecast 2015-2020 (millions of units)
  • Exhibit 31: Impact of drivers
  • Exhibit 32: Impact of drivers and challenges
  • Exhibit 33: Other prominent vendors
  • Exhibit 34: Key inferences
  • Exhibit 35: Market summary of global chip mounter market 2015-2020
  • Exhibit 36: Technology segments: Year-over-year revenue comparison ($ billions)
  • Exhibit 37: Geographical segments: Year-over-year revenue comparison ($ billions)
  • Exhibit 38: Geographical segments: Year-over-year revenue comparison ($ billions)
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