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市場調查報告書

接合線包裝材料的全球市場:2016∼2020年

Global Bonding Wire packaging material market 2016-2020

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 361545
出版日期 內容資訊 英文 58 Pages
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接合線包裝材料的全球市場:2016∼2020年 Global Bonding Wire packaging material market 2016-2020
出版日期: 2016年06月16日 內容資訊: 英文 58 Pages
簡介

接合線有金、銅、銀,以及鋁製的。線的直徑範圍,從15微米,到高功率用途的數100微米。但,產業正轉移利用銅以及其他的材料,2010年之後新加上銀。接合線使用的金量,2007年佔整體95%,不過,隨著黃金的價格上升,2015年下降到40%佔有率。2015年的差份,由銅及銀代替。全球接合線包裝材料市場,預計2020年產生290億美元的收入。

本報告提供全球接合線包裝材料的市場調查分析,市場概要,市場發展推動因素,市場上課題,和概括影響,各材料類型、各地區的市場現況與展望相關調查分析,主要的供應商簡介彙整。

第1章 摘要整理

第2章 調查範圍

  • 定義
  • 基準年與預測期間
  • 市場範圍
  • 市場規模檢測
  • 市場區隔
  • 區域範圍
  • 供應商的區分
  • 通用貨幣換算率
  • 主要的產品

第3章 市場調查手法

  • 調查手法
  • 經濟指標

第4章 簡介

  • 主要的市場特徵

第5章 市場形勢

  • 全球半導體市場概要
  • 晶圓層級生產設備的分類
  • 市場概要
  • 市場規模、預測
  • 波特的五力分析

第6章 市場區隔,各材料類型

  • 全球接合線包裝材料市場,各材料類型,2015年
  • 全球接合線包裝材料市場,各材料類型,2020年
  • 全球接合線包裝材料市場,黃金
  • 全球接合線包裝材料市場,PCC (鈀被覆銅)
  • 全球接合線包裝材料市場,銅
  • 全球接合線包裝材料市場,銀

第7章 各地區區分

  • 全球接合線包裝材料市場,各地區,2015年
  • 全球接合線包裝材料市場,各地區,2020年
  • APAC (亞太地區)
  • 北美
  • 歐洲各地區
  • ROW (其他地區)

第8章 主要國家

  • 全球接合線包裝材料市場上主要國家

第9章 主要指標的整體概述

第10章 市場發展推動因素

  • 銅製線的轉變發展
  • 小型半導體設備的必要性擴大

第11章 發展推動因素的影響

第12章 市場課題

  • 銅製線的規定
  • 轉移到覆晶構裝技術

第13章 發展推動因素與課題的影響

第14章 市場趨勢

  • 銀製接合線來的替代品
  • 轉移到更小直徑線

第15章 業者情勢

  • 競爭模式
  • 值得一提的其他供應商

第16章 附錄

  • 簡稱清單

第17章 關於Technavio

目錄
Product Code: IRTNTR9278

About the Bonding Wire Packaging Material Market

Bonding wires can be made up of gold, copper, silver, and aluminum. The diameter of the wire ranges from 15 micrometer to several hundred micro-meters for high-powered applications. Bonding wires made of gold dominated the bonding wire packaging material market for decades. However, the industry is shifting toward the use of copper and other materials, which include silver as the new addition since 2010. The market share of gold in terms of volume used for bonding wire was more than 95% in 2007 and dropped to 40% in 2015 due to rising prices of gold. The remaining volume was replaced by copper and silver in 2015.

Technavio's analysts forecast the global bonding wire packaging material market will generate revenues of USD 2.9 billion in 2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global bonding wire packaging material market for 2016-2020. To calculate the market size, the report considers revenue generated from the consumption of bonding wires for packaging materials.

The market is divided into the following segments based on geography:

  • APAC
  • Europe
  • North America
  • ROW

Technavio's report, Global Bonding Wire Packaging Material Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • TANAKA Precious Metals
  • Heraeus Deutschland
  • California Fine Wire
  • MK Electron

Other Prominent Vendors

  • AMETEK
  • EMMTECH
  • Inseto
  • Palomar Technologies
  • RED Micro Wire
  • SHINKAWA
  • Sumitomo Metal Mining
  • Tatsuta Electric Wire & Cable

Market driver

  • Rising need for miniaturization
  • For a full, detailed list, view our report

Market challenge

  • Migration to flip chip packaging technology
  • For a full, detailed list, view our report

Market trend

  • Migration to smaller diameter wires
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Definition
  • Source year and forecast period
  • Market coverage
  • Market size computation
  • Market segmentation
  • Geographical coverage
  • Vendor segmentation
  • Common currency conversion rates
  • Top vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Market landscape

  • Global semiconductor market overview
  • Wafer-level manufacturing equipment categories
  • Market overview
  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by material type

  • Global bonding wire packaging material market by material type 2015
  • Global bonding wire packaging material market by material type 2020
  • Global bonding wire packaging material market by gold
  • Global bonding wire packaging material market by PCC
  • Global bonding wire packaging material market by copper
  • Global bonding wire packaging material market by silver

PART 07: Geographical segmentation

  • Global bonding wire packaging material market by geography 2015
  • Global bonding wire packaging material market by geography 2020
  • APAC
  • North America
  • Europe
  • ROW

PART 08: Key leading countries

  • Key leading countries in global bonding wire packaging material market

PART 09: Summary of key figures

PART 10: Market drivers

  • Growing transition to copper wire
  • Rising need for miniaturized semiconductor devices

PART 11: Impact of drivers

PART 12: Market challenges

  • Limitations of copper wire
  • Migration to flip chip packaging technology

PART 13: Impact of drivers and challenges

PART 14: Market trends

  • Silver bonding wire as upcoming alternative
  • Migration to smaller diameter wires

PART 15: Vendor landscape

  • Competitive scenario
  • Other prominent vendors

PART 16: Appendix

  • List of abbreviations

PART 17: Explore Technavio

List of Exhibits

  • Exhibit 01: Segmentation of global bonding wire packaging material market
  • Exhibit 02: Key regions
  • Exhibit 03: Common currency conversion rates
  • Exhibit 04: Product offerings
  • Exhibit 05: Chemical composition of semiconductor materials
  • Exhibit 06: Top ten semiconductor vendors 2015
  • Exhibit 07: Global semiconductor market structure 2015
  • Exhibit 08: Global semiconductor market structure 2015
  • Exhibit 09: Global semiconductor market trend 1990-2015 ($ billions)
  • Exhibit 10: Semiconductor IC manufacturing process
  • Exhibit 11: Front-end chip formation steps
  • Exhibit 12: Back-end chip formation steps
  • Exhibit 13: Wafer-level manufacturing equipment categories
  • Exhibit 14: Requirements of manufacturing equipment
  • Exhibit 15: Semiconductor industry value chain
  • Exhibit 16: Global bonding wire packaging material market 2015-2020 ($ billions)
  • Exhibit 17: Five forces analysis
  • Exhibit 18: Global bonding wire packaging material market by material type 2015
  • Exhibit 19: Global bonding wire packaging material market by material type in 2020
  • Exhibit 20: Global bonding wire packaging material market by gold ($ millions)
  • Exhibit 21: Global bonding wire packaging material market by PCC ($ billions)
  • Exhibit 22: Global bonding wire packaging material market by copper ($ millions)
  • Exhibit 23: Global bonding wire packaging material market by silver ($ millions)
  • Exhibit 24: Segmentation of silver wire application
  • Exhibit 25: Global bonding wire packaging material market by geography 2015
  • Exhibit 26: Global bonding wire packaging material market by geography 2020
  • Exhibit 27: Bonding wire packaging material market in APAC 2015-2020 ($ billions)
  • Exhibit 28: Bonding wire packaging material market in North America 2015-2020 ($ millions)
  • Exhibit 29: Bonding wire packaging material market in Europe 2015-2020 ($ millions)
  • Exhibit 30: Bonding wire packaging material market in ROW 2015-2020 ($ millions)
  • Exhibit 31: Key leading countries in global bonding wire packaging material market 2015
  • Exhibit 32: Key leading countries in global bonding wire packaging material market 2020
  • Exhibit 33: Material-type segments: Year-over-year revenue comparison ($ millions)
  • Exhibit 34: Geographical segments: Year-over-year revenue comparison ($ millions)
  • Exhibit 35: Impact of drivers
  • Exhibit 36: Impact of drivers and challenges
  • Exhibit 37: Other prominent vendors
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