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市場調查報告書

光纖熔接器的全球市場 - 2016∼2020年

Global Fusion Splicer Market 2016-2020

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 361504
出版日期 內容資訊 英文 62 Pages
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光纖熔接器的全球市場 - 2016∼2020年 Global Fusion Splicer Market 2016-2020
出版日期: 2016年06月14日 內容資訊: 英文 62 Pages
簡介

光纖熔接器的全球市場預測從2016年到2020年這段期間將以8.93%的年複合成長率 (CAGR)持續成長。

本報告涵括光纖熔接器的全球市場,透過推動市場成長要素和市場課題,市場趨勢,以及市場競爭情形的詳細調查,來進行市場現狀分析以及2016年到2020年的未來預測。

第1章 摘要整理

第2章 本報告涵蓋範圍

  • 定義
  • 基準年及市場預測期間
  • 市場報告
  • 市場規模估計
  • 市場分類
  • 地區涵蓋範圍
  • 供應商分類
  • 通用貨幣的匯率
  • 主要供應商產品

第3章 市場調查手法

  • 調查手法
  • 經濟指標

第4章 序論

  • 市場相關重要事項
  • 光纖電纜對銅電纜的優點

第5章 技術情形

  • 熔接流程

第6章 市場概況

  • 半導體全球市場概要
  • 晶圓層級的製造設備類別
  • 市場概要
  • 市場規模及未來預測
  • 波特的五力分析

第7章 各適用產業市場分類

  • 市場概要
  • 通訊產業領域的光纖熔接器全球市場
  • 企業領域的光纖熔接器全球市場
  • 有線電視領域的光纖熔接器全球市場
  • 航太及國防產業領域的光纖熔接器全球市場
  • 其他產業領域的光纖熔接器全球市場

第8章 各地區市場分類

  • 從各地區來看光纖熔接器全球市場 - 2015年
  • 從各地區來看光纖熔接器全球市場 - 2020年
  • 亞太地區的光纖熔接器市場
  • 北美的光纖熔接器市場
  • 歐洲的光纖熔接器市場
  • 其他地區的光纖熔接器市場

第9章 重要數據資料彙整

第10章 推動市場成長要素

  • 低插入損耗
  • 網路寬頻化的必要性
  • 資料中心數的增加

第11章 推動市場成長要素帶來的影響

第12章 市場課題

  • 熔接器的成本高
  • 配置相關的課題

第13章 推動市場成長要素和市場課題帶來的影響

第14章 市場趨勢

  • FTTH的引進擴大
  • 熔斷器式連接器的出現
  • IoT的演進

第15章 業者情勢

  • 市場競爭方案
  • Fujikura Ltd.
  • 古河電氣工業
  • INNO Instrument
  • 住友電氣工業
  • 其他的有力供應商

第16章 通訊事業領域的光纖市場概要

第17章 附錄

第18章 關於Technavio

目錄
Product Code: IRTNTR9301

About the Fusion Splicer Market

The fiber-optic technology uses thin strands of glass or plastic called optical fibers. Optical fibers use light to transmit information between two places. An optical fiber is a thin cylinder of dielectric material, which is capable of transmitting messages modulated onto light waves. Fusion splicers are used to join two optical fibers using heat. They offer high-strength, permanent, and low-loss joint, and plays an important role in the optical network.

Technavio's analysts forecast the global fusion splicer market to grow at a CAGR of 8.93% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global fusion splicer market for 2016-2020. To calculate the market size, Technavio considers the sale of fusion splicers to the telecommunications, enterprise, cable TV, aerospace and defense, and other upcoming application segments.

The market is divided into the following segments based on geography:

  • APAC
  • Europe
  • North America
  • ROW

Technavio's report, Global Fusion Splicer Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Fujikura
  • Furukawa Electric
  • INNO Instrument
  • Sumitomo Electric Industries

Other Prominent Vendors

  • 2 SAE Technologies
  • AFL Global
  • Aurora Optics
  • Corning
  • Ericsson
  • Fiber Cable Solution Technology
  • Jilong Optical Communication
  • MaxTelCom
  • Signal Fire Technology
  • Vytran

Market driver

  • Need for increased network bandwidth
  • For a full, detailed list, view our report

Market challenge

  • Deployment issues
  • For a full, detailed list, view our report

Market trend

  • Emergence of fuse-on connectors
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Definition
  • Source year and forecast period
  • Market reportage
  • Market size computation
  • Market segmentation
  • Geographical coverage
  • Vendor segmentation
  • Common currency conversion rates
  • Top vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights
  • Advantages of fiber-optic cables over copper cables

PART 05: Technology landscape

  • Fusion splicing process

PART 06: Market landscape

  • Global semiconductor market overview
  • Wafer-level manufacturing equipment categories
  • Market overview
  • Market size and forecast
  • Five force analysis

PART 07: Market segmentation by application

  • Market overview
  • Global fusion splicer market by telecommunications
  • Global fusion splicer market by enterprise
  • Global fusion splicer market by cable TV
  • Global fusion splicer market by aerospace and defense
  • Global fusion splicer market by others

PART 08: Geographical segmentation

  • Global fusion splicer market by geography 2015
  • Global fusion splicer market by geography 2020
  • Fusion splicer market in APAC
  • Fusion splicer market in North America
  • Fusion splicer market in Europe
  • Fusion splicer market in ROW

PART 09: Summary of key figures

PART 10: Market drivers

  • Low insertion loss
  • Need for increased network bandwidth
  • Growing number of data centers

PART 11: Impact of drivers

PART 12: Market challenges

  • High cost of fusion splicers
  • Deployment issues

PART 13: Impact of drivers and challenges

PART 14: Market trends

  • Rising implementation of FTTH
  • Emergence of fuse-on connectors
  • Evolution of IoT
  • PART 15: Vendor landscape
  • Competitive scenario
  • Fujikura
  • Furukawa Electric
  • INNO Instrument
  • Sumitomo Electric Industries
  • Other prominent vendors

PART 16: Key snapshots of fiber-optics market in telecommunications

PART 17: Appendix

  • List of abbreviations

PART 18: Explore Technavio

List of Exhibits

  • Exhibit 01: Segmentation of global fusion splicer market
  • Exhibit 02: Key regions
  • Exhibit 03: Common currency conversion rates
  • Exhibit 04: Product offerings
  • Exhibit 05: Fusion splicing process
  • Exhibit 06: Top ten semiconductor vendors 2015
  • Exhibit 07: Global semiconductor market structure 2015
  • Exhibit 08: Global semiconductor market structure 2015
  • Exhibit 09: Global semiconductor market trend 1990-2015 ($ billions)
  • Exhibit 10: Semiconductor IC manufacturing process
  • Exhibit 11: Front-end chip formation steps
  • Exhibit 12: Back-end chip formation steps
  • Exhibit 13: Wafer-level manufacturing equipment categories
  • Exhibit 14: Requirements of manufacturing equipment
  • Exhibit 15: Semiconductor industry value chain
  • Exhibit 16: Global fusion splicer market 2015-2020 ($ millions)
  • Exhibit 17: Five force analysis
  • Exhibit 18: Global fusion splicer market by application 2015-2020 (% share)
  • Exhibit 19: Global fusion splicer market by telecommunications ($ millions)
  • Exhibit 20: Global fusion splicer market by enterprise ($ millions)
  • Exhibit 21: Global fusion splicer market by cable TV ($ millions)
  • Exhibit 22: Global fusion splicer market by aerospace and defense ($ millions)
  • Exhibit 23: Global fusion splicer market by others ($ millions)
  • Exhibit 24: Global fusion splicer market by geography 2015
  • Exhibit 25: Global fusion splicer market by geography 2020
  • Exhibit 26: Fusion splicer market in APAC 2015-2020 ($ millions)
  • Exhibit 27: Fusion splicer market in North America 2015-2020 ($ millions)
  • Exhibit 28: Fusion splicer market in Europe 2015-2020 ($ millions)
  • Exhibit 29: Fusion splicer market in ROW 2015-2020 ($ millions)
  • Exhibit 30: Application segments: Year-over-year revenue comparison ($ millions)
  • Exhibit 31: Geographical segments: Year-over-year revenue comparison ($ millions)
  • Exhibit 32: Bandwidth comparison of technologies 1G to 5G
  • Exhibit 33: Impact of drivers
  • Exhibit 34: Impact of drivers and challenges
  • Exhibit 35: Top five states with highest connection speed in US
  • Exhibit 36: Other prominent vendors
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