Global Hot Melt Adhesives Market 2016-2020
|出版商||TechNavio (Infiniti Research Ltd.)||商品編碼||361474|
|出版日期||內容資訊||英文 85 Pages
|熱熔膠黏劑的全球市場:2016年∼2020年 Global Hot Melt Adhesives Market 2016-2020|
|出版日期: 2016年06月10日||內容資訊: 英文 85 Pages||
全球熱熔膠黏劑市場預測在2016年∼2020年將以年複合成長率 (CAGR) 5.89％的速度成長。
Hot melt adhesives are solvent-free thermoplastic materials. They are molten at temperatures ranging from 248°F to 356°F and used as an adhesive. Unlike solvent-based or water-based adhesives, these adhesives do not require curing or drying. They solidify in a short time span and form a strong bond with an extensive range of substrates.
Technavio's analysts forecast the global hot melt adhesives market to grow at a CAGR of 5.89% during the period 2016-2020.
The report covers the present scenario and the growth prospects of the global hot melt adhesives market for 2016-2020.
The market is divided into the following segments based on geography:
Technavio's report, Global Hot Melt Adhesives Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
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