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市場調查報告書

晶圓層級製造設備的全球市場:2016-2020年

Global Wafer-level Manufacturing Equipment Market 2016-2020

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 350056
出版日期 內容資訊 英文 81 Pages
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晶圓層級製造設備的全球市場:2016-2020年 Global Wafer-level Manufacturing Equipment Market 2016-2020
出版日期: 2016年01月13日 內容資訊: 英文 81 Pages
簡介

全球晶圓層級製造設備市場,預計從2016年到2020年以4.2%的年複合成長率成長。

本報告提供全球晶圓層級製造設備市場相關調查分析、市場規模與成長率的預測、市場成長的主要的推動因素與課題、主要的市場趨勢、主要供應商、市場機會及威脅,及競爭環境等系統性資訊。

第1章 摘要整理

第2章 調查範圍

  • 市場概要
  • 主要供應商的產品

第3章 市場調查手法

  • 調查手法
  • 經濟指標
  • PEST分析

第4章 簡介

第5章 技術形勢

  • 半導體IC製造工程
  • 晶圓層級製造設備的分類

第6章 市場環境

  • 客戶展望
  • 市場規模與預測
  • 波特的五力分析

第7章 市場區隔:各產品

  • 市場概要
  • 全球晶圓晶圓廠設備市場
  • 全球晶圓層次電子構裝、組裝零件設備市場

第8章 市場區隔:各產品

  • 市場概要
  • 市場規模、預測

第9章 地區區分

  • 市場概要
  • 市場規模、預測

第10章 市場成長的推動要素

  • 促進要素的影響力

第11章 市場課題

第12章 推動因素、課題的影響力

第13章 市場趨勢

第14章 業者情勢

  • 競爭情形
  • 主要供應商
  • 其他有潛力的供應商

第15章 主要供應商分析

Applied Materials ▼ASML ▼KLA-Tencor ▼Lam Research ▼Tokyo Electron

第16章 對供應商/投資者的主要建議

第17章 附錄

第18章 關於Technavio

圖表一覽

目錄
Product Code: IRTNTR7847

About Wafer-Level Manufacturing Equipment

The wafer-level manufacturing equipment is used for the production of semiconductor wafers, which includes processes such as lithography, etching and stripping, inspection, and packaging. The growing number of applications of semiconductor ICs across different segments has led to the increased demand for wafer-level manufacturing equipment.

Technavio's analysts forecast the global wafer-level manufacturing equipment market to grow at a CAGR of 4.2% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global wafer-level manufacturing equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of the wafer fab equipment and wafer-level packaging and assembly equipment to the following customer segments:

  • Foundries
  • Memory device manufacturers
  • Integrated device manufacturers (IDM)

Technavio's report, Global Wafer-Level Manufacturing Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Applied Materials
  • ASML
  • TEL
  • Lam Research
  • KLA-Tencor

Other Prominent Vendors

  • Dainippon
  • Advantest
  • Canon
  • Hitachi
  • JEOL.

Market driver

  • Growing applications of semiconductor ICs in IoT
  • For a full, detailed list, view our report

Market challenge

  • High initial capital investment
  • For a full, detailed list, view our report

Market trend

  • Increase in wafer size
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Top-vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators
  • PEST analysis

PART 04: Introduction

  • Key market highlights

PART 05: Technology landscape

  • Semiconductor IC manufacturing process
  • Wafer-level manufacturing equipment categories

PART 06: Market landscape

  • Customer perspective
  • Market size and forecast
  • Five forces analysis

PART 07: Market segmentation by product

  • Market overview
  • Global wafer fab equipment market
  • Global wafer-level packaging and assembly equipment market

PART 08: Market segmentation by users

  • Market overview
  • Market size and forecast

PART 09: Geographical segmentation

  • Market overview
  • Market size and forecast

PART 10: Market drivers

  • Impact of drivers

PART 11: Market challenges

PART 12: Impact of drivers and challenges

PART 13: Market trends

PART 14: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 15: Key vendor analysis

  • Applied Materials
  • ASML
  • KLA-Tencor
  • Lam Research
  • Tokyo Electron

PART 16: Key recommendations for vendors/investors

PART 17: Appendix

  • List of abbreviations

PART 18: Explore Technavio

List of Exhibits

  • Exhibit 01: Global wafer-level manufacturing equipment market segments: A snapshot
  • Exhibit 02: Product offerings
  • Exhibit 03: Front-end chip formation steps
  • Exhibit 04: Back-end chip formation steps
  • Exhibit 05: Wafer-level manufacturing equipment categories
  • Exhibit 06: Requirements of a manufacturing equipment
  • Exhibit 07: Global wafer-level manufacturing equipment market 2015-2020 ($ billions)
  • Exhibit 08: Five forces analysis
  • Exhibit 09: Global wafer-level manufacturing equipment market 2015
  • Exhibit 10: Global wafer fab equipment market 2015-2020 ($ billions)
  • Exhibit 11: Global wafer-level packaging and assembly equipment market 2015-2020 ($ billions)
  • Exhibit 12: Global wafer-level manufacturing equipment market by end-user 2015
  • Exhibit 13: Global wafer-level manufacturing equipment market by end-user 2015-2020
  • Exhibit 14: Global wafer-level manufacturing equipment market by end-user 2015-2020 ($ billions)
  • Exhibit 15: Global wafer-level manufacturing equipment market 2015
  • Exhibit 16: Global wafer-level manufacturing equipment market 2015-2020
  • Exhibit 17: Global wafer-level manufacturing equipment market 2015-2020 ($ billions)
  • Exhibit 18: Impact of drivers on key customer segments
  • Exhibit 19: Global MEMS market 2015-2020 ($ billions)
  • Exhibit 20: Global semiconductor market trend 1992-2014 ($ billions)
  • Exhibit 21: Impact of drivers and challenges
  • Exhibit 22: Timeline for semiconductor wafer size advancements
  • Exhibit 23: Cars shipment 2015-2020
  • Exhibit 24: Global wafer-level manufacturing equipment market by vendor 2014
  • Exhibit 25: ASML customers by end-user segment
  • Exhibit 26: Applied Materials: Business segmentation by revenue 2014
  • Exhibit 27: Applied Materials: Business segmentation by revenue 2013 and 2014 ($ billions)
  • Exhibit 28: Applied Materials: Geographical segmentation by revenue 2014
  • Exhibit 29: ASML: Product segmentation
  • Exhibit 30: ASML: Geographical segmentation by revenue 2014
  • Exhibit 31: KLA-Tencor: Business segmentation by revenue 2014
  • Exhibit 32: KLA-Tencor: Business segmentation by revenue 2013 and 2014 ($ billions)
  • Exhibit 33: KLA-Tencor: Geographical segmentation by revenue 2014
  • Exhibit 34: Lam Research: Geographical segmentation by revenue 2014
  • Exhibit 35: Lam research: Semiconductor production equipment market in South Korea and Taiwan 2013 and 2014 revenue comparison ($ billions)
  • Exhibit 36: Tokyo Electron: Business segmentation by revenue 2015
  • Exhibit 37: Tokyo Electron: Business segmentation by revenue 2014 and 2015 ($ billions)
  • Exhibit 38: Tokyo Electron: Geographical segmentation by revenue 2015
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