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市場調查報告書

晶圓廠設備的全球市場 (2016∼2020年)

Global Wafer Fab Equipment Market 2016-2020

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 350055
出版日期 內容資訊 英文 68 Pages
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晶圓廠設備的全球市場 (2016∼2020年) Global Wafer Fab Equipment Market 2016-2020
出版日期: 2016年01月13日 內容資訊: 英文 68 Pages
簡介

晶圓廠設備市場中,節點尺寸為32納米 (nm) 的IC製造所使用的東西達到整體32.18%。在各終端用戶中,晶圓代工廠導向為62.98%成為最大的收益來源。各地區中,亞太地區為最大的市場,2015年達到了235億2000萬美元的規模。全球晶圓廠設備的市場預計2016∼2020年以4.02%的年複合成長率(CAGR) 成長。

本報告提供全球晶圓廠設備的市場相關分析、市場概要和結構、市場規模趨勢 (今後5年的預測值)、各節點尺寸/各終端用戶/各地區的詳細趨勢、推動&阻礙市場要素與其影響力、主要企業簡介、今後的市場機會等調查評估。

第1章 摘要整理

  • 分析結果的概要

第2章 分析範圍

  • 分析概要
  • 大供應商的主要產品

第3章 市場分析技術

  • 分析方法
  • 經濟指標

第4章 簡介

  • 市場趨勢的概要

第5章 市場環境

  • 技術環境
  • 晶圓層級的製造設備的類別
  • 需求分析
  • 市場規模與其預測
  • 波特的五力分析

第6章 各節點尺寸的市場區隔

  • 市場概要
  • 市場規模與其預測

第7章 各終端用戶的市場區隔

  • 市場概要
  • 市場規模與其預測

第8章 地區區分

  • 市場概要
  • 市場規模與其預測

第9章 推動市場要素

  • 推動因素的影響力

第10章 市場課題

第11章 推動因素、課題的影響力

第12章 市場趨勢

第13章 供應商環境

  • 競爭方案
  • 主要供應商
  • 其他卓越供應商

第14章 主要供應商分析

  • Applied Materials
  • ASML
  • KLA-Tencor
  • Lam Research
  • TEL

第15章 對供應商/投資者的主要建議

第16章 附錄

  • 簡稱集

第17章 關於Technavio

圖表一覽

目錄
Product Code: IRTNTR8000

About Wafer Fab Equipment

The wafer fab equipment used in the manufacturing of 32 nanometer (nm) node integrated circuits (ICs) contributed 32.18% of the total market in 2015. The foundry segment is the largest revenue contributor, and accounted for a revenue share of 62.98% in 2015

APAC has been the major revenue generator to the market, and contributed a total amount of $23.52 billion in 2015

Technavio's analysts forecast the global wafer fab equipment market to grow at a CAGR of 4.02% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global wafer fab equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of the wafer fab equipment to the following customer segments:

  • Foundries
  • Memory
  • Integrated device manufacturers (IDM)

Technavio's report, Global Wafer Fab Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Applied Materials
  • ASML
  • KLA-Tencor
  • Lam Research
  • TEL

Other Prominent Vendors

  • Dainippon Screen Manufacturing
  • Hitachi High Technologies
  • Nikon
  • Hitachi Kokusai Electric.

Market driver

  • Increase in number of fabs worldwide
  • For a full, detailed list, view our report

Market challenge

  • Long payback period
  • For a full, detailed list, view our report

Market trend

  • Increase in wafer size
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Top-vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Market landscape

  • Technology landscape
  • Wafer-level manufacturing equipment categories
  • Demand analysis
  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by node size

  • Market overview
  • Market size and forecast

PART 07: Market segmentation by end user

  • Market overview
  • Market size and forecast

PART 08: Geographical segmentation

  • Market overview
  • Market size and forecast

PART 09: Market drivers

  • Impact of drivers

PART 10: Market challenges

PART 11: Impact of drivers and challenges

PART 12: Market trends

PART 13: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 14: Key vendor analysis

  • Applied Materials
  • ASML
  • KLA-Tencor
  • Lam Research
  • TEL

PART 15: Key recommendations for vendors/investors

  • PART 16: Appendix
  • List of abbreviations

PART 17: Explore Technavio

List of Exhibits

  • Exhibit 01: Global wafer fab equipment market segments: A snapshot
  • Exhibit 02: Product offerings
  • Exhibit 03: Front-end chip formation steps
  • Exhibit 04: Back-end chip formation step
  • Exhibit 05: Wafer-level manufacturing equipment categories
  • Exhibit 06: Manufacturing equipment requirements
  • Exhibit 07: Global wafer fab equipment market 2016-2020 ($ billions)
  • Exhibit 08: Five forces analysis
  • Exhibit 09: Global wafer fab equipment market by node size 2015
  • Exhibit 10: Global wafer fab equipment market by node size 2015-2020
  • Exhibit 11: Global wafer fab equipment market by node size 2015-2020 ($ billions)
  • Exhibit 12: Global wafer fab equipment market by end-user 2015
  • Exhibit 13: Global wafer fab equipment market by end-user 2015-2020
  • Exhibit 14: Global wafer fab equipment market by end-user 2015-2020 ($ billions)
  • Exhibit 15: Global wafer fab equipment market by geography 2015
  • Exhibit 16: Global wafer fab equipment market by geography 2015-2020
  • Exhibit 17: Global wafer fab equipment market by geography 2015-2020 ($ billions)
  • Exhibit 18: Impact of drivers on key customer segment
  • Exhibit 19: Global semiconductor market trend 1992-2014 ($ billions)
  • Exhibit 20: Impact of drivers and challenges
  • Exhibit 21: Timeline for semiconductor wafer size advancements
  • Exhibit 22: Cars shipment 2015-2020
  • Exhibit 23: Global wafer fab equipment market by vendors 2015
  • Exhibit 24: ASML customers by end-user segment
  • Exhibit 25: Applied Materials: Geographical segmentation by revenue 2014
  • Exhibit 26: ASML: Geographical segmentation by revenue 2014
  • Exhibit 27: KLA-Tencor: Geographical segmentation by revenue 2014
  • Exhibit 28: Lam Research: Geographical segmentation by revenue 2015
  • Exhibit 29: TEL: Geographical segmentation by revenue 2015
  • Exhibit 30: TEL: Business performance by revenue 2012-2015
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