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市場調查報告書

美國的半導體部門的資本投資:2015-2019年

Semiconductor Capital Spending Market in the US 2015-2019

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 350016
出版日期 內容資訊 英文 64 Pages
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美國的半導體部門的資本投資:2015-2019年 Semiconductor Capital Spending Market in the US 2015-2019
出版日期: 2016年01月06日 內容資訊: 英文 64 Pages
簡介

於 美國的半導體供應商的資本投資額在預測期間內,預計以近9%的年複合成長率擴大。該成長由各種要素所帶來,尤其是記憶體及晶圓代工廠相關的投資擴大為顯著的要素,這些資產的投資額總計佔整體3分之2的佔有率。

本報告提供美國的半導體供應商的資本投資趨勢的相關調查、市場定義、主要供應商的提供產品、市場整體及各設備/資產種類的市場規模 (CAPEX) 的變化與預測、主要市場趨勢、市場的各種影響因素分析、競爭環境、主要供應商簡介等彙整資料。

第1章 摘要整理

  • 焦點

第2章 調查範圍

  • 市場概要
  • 主要供應商產品

第3章 市場調查手法

  • 調查手法
  • 經濟指標

第4章 簡介

  • 主要市場焦點

第5章 市場形勢

  • 市場概要
  • 市場規模、預測
  • 波特的五力分析

第6章 市場分析:各類型

  • 晶圓構造設備
  • 晶粒層級包裝&集合設備
  • 自動實驗設備
  • 晶圓級構裝&集合設備

第7章 推動市場要素

第8章 推動因素的影響

第9章 市場課題

第10章 推動因素與課題的影響

第11章 市場趨勢

第12章 業者情勢

  • 競爭模式
  • 主要供應商
  • 其他的有力供應商

第13章 主要供應商分析

  • Global Foundries
  • Intel
  • Micron
  • Samsung Electronics
  • SK Hynix

第14章 對供應商、投資者的建議

第15章 附錄

第16章 關於Technavio

圖表

目錄
Product Code: IRTNTR7795

Market outlook of the semiconductor capital spending market in the US

Semiconductors are the basic component for any electronic component. Semiconductor technology is continuously growing with emergence of advanced technology. Since the last decade, the most prominent segment in global semiconductor industry has been memory, logic, MPU and analog, which made up almost 75% of the total semiconductor demand. Technavio predicts the semiconductor capital spending market in the US to multiply rapidly with a CAGR of close to 9% during the forecast period.

The semiconductor capital spending market in the US is driven by numerous drivers, of which, the most prominent among of all is the accelerated capex in memory and foundry segments. Collectively, memory and foundry represent close to two-third of the total semiconductor capital spending market. With such accelerated capital investments on a global scale, the outcome will have a considerable impact on the semiconductor industry worldwide.

Segmentation of the semiconductor capital spending market in the US by type

  • Wafer fab equipment
  • Die-level packaging and assembly equipment
  • Automated test equipment
  • Wafer-level packaging and assembly equipment
  • Others

Wafer fab equipment segment constitutes the largest share of the overall market, accounting for a market share of more than 48% in 2014. Wafer fab equipment is mainly used during the first half of semiconductor's manufacturing process that makes memory cells and transistors. It covers various patterning, deposition and cleaning process, till wafer passivation.

Competitive landscape and key vendors

The competition in the semiconductor capital spending market in the US is rigid. And the main reason for such intense completion is the evolution of technology. With the pace of technological advancements in the US market, vendors are involved in substantial capital spending, hence, the market comprises of players with strong technological proficiency.

Key vendors in this market are -

  • Global Foundries
  • Intel
  • Micron
  • Samsung Electronics
  • SK Hynix

Other prominent vendors included in this report are AMD, Analog Devices, Broadcom, Freescale, Semiconductor, Marvell Technologies, Qualcomm, and Texas Instruments.

Growth drivers, challenges, and upcoming trends:

Technavio also highlights various trends affecting the semiconductor capital spending market in the US, and one such trend is the rise in China's semiconductor industry. Even though, there are a large number of local semiconductor components manufacturers in China, more than 80% of the semiconductor requirements in China is fulfilled by US semiconductor companies, such as Intel and Global Foundries.

This report provides a number of factors contributing to the adoption, limitations, and opportunities of the semiconductor capital spending market in the US. It also offers an analysis of each factor and an estimation of the extent to which the factors are likely to impact the overall market growth.

Key questions answered in the report include

  • What will the market size and the growth rate be in 2019?
  • What are the key factors driving the semiconductor capital spending market in the US?
  • What are the key market trends impacting the growth of the semiconductor capital spending market in the US?
  • What are the challenges to market growth?
  • Who are the key vendors in the semiconductor capital spending market in the US?
  • What are the market opportunities and threats faced by the vendors in the semiconductor capital spending market in the US?
  • What are the key outcomes of the five forces analysis of the semiconductor capital spending market in the US?

Technavio also offers customization on reports based on specific client requirement.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Product offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Market landscape

  • Market overview
  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by type

  • Wafer fab equipment
  • Die-level packaging and assembly equipment
  • Automated test equipment
  • Wafer-level packaging and assembly equipment

PART 07: Market Drivers

PART 08: Market drivers and their impacts

PART 09: Market challenges

PART 10: Impact of drivers and challenges

PART 11: Market trends

PART 12: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 13: Key vendor analysis

  • Global Foundries
  • Intel
  • Micron
  • Samsung Electronics
  • SK Hynix

PART 14: Key recommendations for vendors/investors

PART 15: Appendix

  • List of abbreviation

PART 16: Explore Technavio

List of Exhibits

  • Exhibit 01: Semiconductor capital spending market in the US
  • Exhibit 02: Semiconductor capital spending market in the US ($ billions)
  • Exhibit 03: Five forces analysis
  • Exhibit 04: Semiconductor capital spending market in the US by type 2014-2019 (% share)
  • Exhibit 05: Capital spending in wafer fab equipment market($ billions)
  • Exhibit 06: Capital spending in die-level packaging and assembly equipment market 2014-2019 ($ billions)
  • Exhibit 07: Capital spending in automated test equipment market 2014-2019 ($ billions)
  • Exhibit 08: Capital spending in wafer-level packaging and assembly equipment market 2014-2019 ($ billions)
  • Exhibit 09: Impact of drivers
  • Exhibit 10: Impact of drivers and challenges
  • Exhibit 11: Global Foundries: Service offerings
  • Exhibit 12: Intel: Business segmentation 2014 by revenue
  • Exhibit 13: Intel: Business segmentation by revenue 2013 and 2014 ($ billions)
  • Exhibit 14: Micron: Business segmentation 2014: By revenue
  • Exhibit 15: Micron: Business segmentation by revenue 2013 and 2014 ($ billion)
  • Exhibit 16: Micron: Geographical segmentation by revenue 2014
  • Exhibit 17: Samsung Electronics: Business segmentation 2013
  • Exhibit 18: Samsung Electronics: Business segmentation by revenue 2013 and 2014 ($ billion)
  • Exhibit 19: Samsung Electronics: Geographical segmentation by revenue 2014
  • Exhibit 20: SK Hynix: Product segmentation 2014
  • Exhibit 21: SK Hynix: Product segmentation revenue by 2014 ($ billions)
  • Exhibit 22: SK Hynix: Geographical segmentation by revenue 2014
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