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市場調查報告書

中國的半導體實行及檢驗市場:2015年∼2019年

Semiconductor Packaging and Test Market in China 2015-2019

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 345514
出版日期 內容資訊 英文 57 Pages
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中國的半導體實行及檢驗市場:2015年∼2019年 Semiconductor Packaging and Test Market in China 2015-2019
出版日期: 2015年11月18日 內容資訊: 英文 57 Pages
簡介

中國的半導體實行及檢驗市場預測從2014年到2019年間將以7.05%的年複合成長率擴大。

本報告提供中國的半導體實行及檢驗市場現狀分析與今後的預測,市場成長要素與課題,主要趨勢,加上主要供應商分析等資訊。

第1章 摘要整理

  • 概況

第2章 本報告的調查範圍

  • 市場概要
  • 主要的產品

第3章 市場調查手法

  • 調查手法
  • 經濟指標

第4章 簡介

  • 主要市場洞察

第5章 市場形勢

  • 該國簡介
  • 市場規模與預測
  • 波特的五力分析

第6章 產業各類型的市場分類

  • 市場規模與預測

第7章 市場成長因素

第8章 市場成長因素的影響

第9章 市場課題

第10章 成長因素與課題的影響

第11章 市場趨勢

第12章 業者情勢

  • 競爭模式
  • 其他卓越供應商
  • ChipMOS TECHNOLOGIES (Bermuda)
  • Greatek Electronic
  • Huahong
  • JCET
  • KYEC
  • Lingsen Precision
  • Nepes
  • SMIC
  • Tianshui Huatian
  • Unisem

第13章 主要供應商分析

  • Amkor Technology
  • ASE
  • Powertech Technology
  • Siliconware Precision Industries (SPIL)
  • STATS ChipPAC
  • UTAC

第14章 附錄

  • 簡稱清單

第15章 關於Technavio

目錄
Product Code: IRTNTR7868

About semiconductor packaging and testing

Semiconductor packaging involves casing of materials such as metal, plastic, glass, or ceramic on the silicon wafer. These casings usually contain one or more semiconductor electronic components. A casing protects the silicon wafer against corrosion and impact, clamps the contact pins or leads used to connect the external circuits to the device, and dissipates heat produced in the device. Though packages are usually made in accordance to industry standards, they meet the specifics of an individual manufacturer.

Wafer testing is executed during the semiconductor device fabrication. This involves the testing of all individual integrated circuits present on the wafer. The individual circuits are tested for functional defects using special test patterns. The testing is carried out using an equipment called a wafer prober or handler. Testing is also carried out using testing methods such as system level tests and burn-in method.

Technavio's analysts forecast the semiconductor packaging and test market in China to grow at a CAGR of 7.05% by revenue over the period 2014-2019.

Covered in this report

The report covers the present scenario and the growth prospects of the semiconductor packaging and test market in China for 2015-2019 along with a market overview. The market has been segmented and sub-segmented on the following basis:

By business type :

  • IDM (integrated devices manufacturers)
  • Outsourced semiconductor assembly and test (OSAT)

Technavio's report, Semiconductor Packaging and Test Market in China in 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report focuses on the landscape of semiconductor packaging and test market in China market and its opportunities in the coming years. The report includes a discussion of the key vendors operating in this market.

Key vendors

  • Amkor
  • ASE
  • PowerTech
  • SPIL
  • STATS ChipsPAC
  • UTAC

Other Prominent Vendors

  • ChipMos
  • Greatek
  • Huanhong
  • JCET
  • KYEC
  • Lingsen Precision
  • Nepes Corporation
  • SMIC
  • Tianshui Huatian
  • Unisem

Key market driver

  • Growth of semiconductor chip application market
  • For a full, detailed list, view our report

Key market challenge

  • Short lifecycle of semiconductor devices
  • For a full, detailed list, view our report

Key market trend

  • Emergence of 3D packaging
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2019 in terms of both revenue and unit shipments and what will the growth rate be
  • What are the key market trends
  • What is driving this market
  • What are the challenges to market growth
  • Who are the key vendors in this market space
  • What are the market opportunities and threats faced by the key vendors

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Product offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Market landscape

  • Country profile
  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by business type

  • Market size and forecast
  • Market size and forecast

PART 07: Market drivers

PART 08: Impact of drivers

PART 09: Market challenges

PART 10: Impact of drivers and challenges

PART 11: Market trends

PART 12: Vendor landscape

  • Competitive scenario
  • Other prominent vendors
  • ChipMOS TECHNOLOGIES (Bermuda)
  • Greatek Electronic
  • Huahong
  • JCET
  • KYEC
  • Lingsen Precision
  • Nepes
  • SMIC
  • Tianshui Huatian
  • Unisem

PART 13: Key vendor analysis

  • Amkor Technology
  • ASE
  • Powertech Technology
  • Siliconware Precision Industries (SPIL)
  • STATS ChipPAC
  • UTAC

PART 14: Appendix

  • List of abbreviations

PART 15: Explore Technavio

List of Exhibits

  • Exhibit 01: Evolution of semiconductor packaging techniques
  • Exhibit 02: Types of packaging and testing
  • Exhibit 03: Semiconductor packaging and test market
  • Exhibit 04: Semiconductor packaging and test market size in China ($ billions)
  • Exhibit 05: Five forces analysis
  • Exhibit 06: Semiconductor packaging and test market by IDM in China 2014-2019 ($ billions)
  • Exhibit 07: Semiconductor packaging and test market in China by outsourcing 2014-2019 ($ billions)
  • Exhibit 08: Impact of drivers
  • Exhibit 09: Impact of drivers and challenges
  • Exhibit 10: Market share in semiconductor packaging and test market in China 2014
  • Exhibit 11: Amkor Technology: Product segmentation by revenue 2014
  • Exhibit 12: Amkor Technology: Product segment comparison by revenue 2013 and 2014 ($ billions)
  • Exhibit 13: Amkor Technology: Geographical segmentation by revenue 2014
  • Exhibit 14: ASE: Business segmentation by revenue 2014
  • Exhibit 15: ASE: Business segmentation by revenue 2013 and 2014 ($ billions)
  • Exhibit 16: Company Name: Geographical segmentation by revenue 2013
  • Exhibit 17: Powertech Technology: Business segmentation
  • Exhibit 18: Powertech Technology: Geographical segmentation by revenue 2014
  • Exhibit 19: SPIL: Business segmentation by revenue 2014
  • Exhibit 20: SPIL: Business segmentation by revenue 2013 and 2014 ($ billions)
  • Exhibit 21: SPIL: Geographical segmentation by revenue 2014
  • Exhibit 22: STATS ChipPAC: Product segmentation by revenue 2014
  • Exhibit 23: STATS ChipPAC: Geographical segmentation by revenue 2013
  • Exhibit 24: UTAC: Business segmentation
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