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市場調查報告書

有機基板配套組材料的全球市場:2015年∼2019年

Global Organic Substrate Packaging Material Market 2015-2019

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 338875
出版日期 內容資訊 英文 67 Pages
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有機基板配套組材料的全球市場:2015年∼2019年 Global Organic Substrate Packaging Material Market 2015-2019
出版日期: 2015年09月02日 內容資訊: 英文 67 Pages
簡介

全球有機基板配套組材料市場,預計2014年∼2019年以5.41%的年複合成長率成長。

本報告提供全球有機基板配套組材料市場相關調查分析、市場規模與成長率、市場趨勢、市場的推動要素與課題、市場機會驗證、主要供應商等相關的系統性資訊。

第1章 摘要整理

  • 焦點

第2章 調查範圍

  • 市場概要
  • 主要供應商產品

第3章 市場調查手法

  • 調查手法
  • 經濟指標

第4章 簡介

  • 主要市場焦點

第5章 市場形勢

  • 市場概要
  • 市場規模與預測
  • 波特的五力分析

第6章 市場區隔:各包裝技術

  • 市場區隔:各包裝技術
  • SO (小型概要) 包裝
  • GA (電網陣列) 包裝
  • 平面無鉛包裝
  • QFP (四核扁平封裝)
  • DIP (雙列直插式封裝)
  • 其他

第7章 地理區分

  • 地理區分
  • 亞太地區
  • 台灣
  • 日本
  • 韓國
  • 中國
  • 北美
  • 歐洲

第8章 主要國家

  • 台灣
  • 韓國
  • 中國

第9章 推動市場成長要素

第10章 推動因素的影響

第11章 市場課題

第12章 推動因素與課題的影響

第13章 市場趨勢

第14章 業者情勢

  • 競爭模式
  • 主要市場供應商

第15章 主要供應商分析

  • Ajinomoto
  • Amkor Technology
  • ASE Kaohsiung
  • 三菱瓦斯化學
  • Siliconware Precision Industries
  • STATS ChipPAC

第16章 附錄

第17章 關於Technavio

圖表

目錄
Product Code: IRTNTR6945

About organic substrate packaging materials

Organic substrates are the base layers of individual semiconductor devices and ICs on which other layers are deposited to complete a circuit. As these materials are part of the circuit, it is imperative that they are efficient conductors of electricity, and preferably thinner core materials are used to surround them in demanding system applications. A small die (block of semiconducting material made of silicon or gallium arsenide with a fabricated circuit) is mounted on the substrate, which connects the input and output terminals from the die to a PCB.

Organic substrates are surrounded by low-loss and ultra-thin materials that have a dielectric base. A thin film layer used to protect the semiconductors on the substrate is made of polyamide and polyester films. These materials are mainly used in area array packages such as BGA and PGA.

Technavio's analysts forecast the global organic substrate packaging materials market to grow at a CAGR of 5.41% over the period 2014-2019.

Covered in this report

This report covers the present scenario and the growth prospects of the global organic substrate packaging materials market for the period 2015-2019. The report provides the vendor landscape and a corresponding detailed analysis of the top six vendors in the market. The market segmentation is done based on the following:

  • Packaging technology
  • Geography

Technavio's report, Global Organic Substrate Packaging Materials Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts.

Key regions

  • APAC
  • Europe
  • North America
  • ROW

Key vendors

  • AJINOMOTO
  • AMKOR
  • ASE Kaohsiung
  • Mitsubishi Gas Chemical
  • SPIL
  • STATS ChipPAC

Market driver

  • Demand for wireless devices
  • For a full, detailed list, view our report

Market challenge

  • Dependency on semiconductor equipment industry performance
  • For a full, detailed list, view our report

Market trend

  • Popularity of redistributed chip packaging
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2019 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Top vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Market landscape

  • Market overview
  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by packaging technology

  • Market segmentation by packaging technology
  • Global SO packaging technology overview
  • Global GA packaging technology overview
  • Global flat no-leads packaging technology overview
  • Global QFP packaging technology overview
  • Global DIP packaging technology overview
  • Global other packaging technologies overview

PART 07: Geographical segmentation

  • Geographical segmentation of global organic substrate packaging material market 2014-2019
  • Organic substrate packaging material market in APAC
  • Organic substrate packaging material market in Taiwan
  • Organic substrate packaging material market in Japan
  • Organic substrate packaging material market in South Korea
  • Organic substrate packaging material market in China
  • Organic substrate packaging material market in North America
  • Organic substrate packaging material market in Europe

PART 08: Key leading countries

  • Taiwan
  • South Korea
  • China

PART 09: Market drivers

  • Growth drivers

PART 10: Impact of drivers

PART 11: Market challenges

PART 12: Impact of drivers and challenges

PART 13: Market trends

PART 14: Vendor landscape

  • Competitive scenario
  • Key market vendors 2014

PART 15: Key vendor analysis

  • Ajinomoto
  • Amkor Technology
  • ASE Kaohsiung
  • Mitsubishi Gas Chemical Company
  • Siliconware Precision Industries
  • STATS ChipPAC

PART 16: Appendix

  • List of abbreviation

PART 17: Explore Technavio

List of Exhibits

  • Exhibit 01: Segmentation of global organic substrate packaging material market
  • Exhibit 02: Product offerings
  • Exhibit 03: Global organic substrate packaging material market
  • Exhibit 04: Geographical segmentation of global organic substrate packaging material market
  • Exhibit 05: Global organic substrate packaging material market by packaging technology
  • Exhibit 06: Global organic substrate packaging material market 2014-2019 ($ billions)
  • Exhibit 07: Five forces analysis
  • Exhibit 08: Geographical segmentation of global organic substrate packaging material market 2014
  • Exhibit 09: Organic substrate packaging material market in APAC 2014
  • Exhibit 10: Organic substrate packaging material market in Taiwan 2014-2019 ($ billions)
  • Exhibit 11: Organic substrate packaging material market in Japan 2014-2019 ($ billions)
  • Exhibit 12: Organic substrate packaging material market in South Korea 2014-2019 ($ billions)
  • Exhibit 13: Organic substrate packaging material market in China 2014-2019 ($ billions)
  • Exhibit 14: Organic substrate packaging material market in North America 2014-2019 ($ billions)
  • Exhibit 15: Organic substrate packaging material market in Europe 2014-2019 ($ billions)
  • Exhibit 16: Impact of drivers
  • Exhibit 17: Impact of drivers and challenges
  • Exhibit 18: Key market vendors 2014
  • Exhibit 19: Ajinomoto: Business segmentation by revenue 2014
  • Exhibit 20: Ajinomoto: Geographical segmentation 2014
  • Exhibit 21: Amkor Technology: Product segmentation by revenue 2014
  • Exhibit 22: Amkor Technology: Product segmentation comparison by revenue 2013 and 2014 ($ billions)
  • Exhibit 23: Amkor Technology: Geographical segmentation by revenue 2014
  • Exhibit 24: Mitsubishi Gas Chemical Company: Business segmentation 2014
  • Exhibit 25: Mitsubishi Gas Chemical Company: Product segmentation by revenue 2014
  • Exhibit 26: Mitsubishi Gas Chemical Company: Geographical segmentation by revenue 2014
  • Exhibit 27: Siliconware Precision Industries: Business segmentation by revenue 2014
  • Exhibit 28: Siliconware Precision Industries: Business segmentation by revenue 2013 and 2014 ($ billions)
  • Exhibit 29: Siliconware Precision Industries: Geographical segmentation by revenue 2014
  • Exhibit 30: STATS ChipPAC: Product segmentation by revenue 2014
  • Exhibit 31: STATS ChipPAC: Geographical segmentation by revenue 2013
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