Global Die-level Packaging Equipment Market 2015-2019
|出版商||TechNavio (Infiniti Research Ltd.)||商品編碼||336493|
|出版日期||內容資訊||英文 63 Pages
|晶粒層級包裝設備的全球市場:2015年∼2019年 Global Die-level Packaging Equipment Market 2015-2019|
|出版日期: 2015年07月29日||內容資訊: 英文 63 Pages||
ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials. Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole.
Technavio's analysts forecast the global die-level packaging equipment market to grow at a CAGR of 1.24% during 2014-2019.
This report covers the present scenario and growth prospects of the global die-level packaging equipment market for 2015-2019. To calculate the market size, the report considers revenue generated from the sales of die-level packaging equipment worldwide. However, the report does not consider the following while calculating the market size:
Technavio's report, Global Die-level Packaging Equipment Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.