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市場調查報告書

晶粒層級包裝設備的全球市場:2015年∼2019年

Global Die-level Packaging Equipment Market 2015-2019

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 336493
出版日期 內容資訊 英文 63 Pages
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晶粒層級包裝設備的全球市場:2015年∼2019年 Global Die-level Packaging Equipment Market 2015-2019
出版日期: 2015年07月29日 內容資訊: 英文 63 Pages
簡介

全球晶粒層級包裝設備市場預測從2014年到2019年這段期間將以年複合成長率(CAGR)以收益為準1.24%的速度擴大。

本報告依各地區提供全球晶粒層級包裝設備的目前市場規模今後的預測,同時提供您市場發展要素與課題,主要趨勢,再加上主要供應商分析等資訊。

第1章 摘要整理

第2章 簡稱清單

第3章 調查範圍

  • 市場概要
  • 主要的產品

第4章 市場調查手法

  • 市場調查流程
  • 調查手法

第5章 簡介

第6章 產業概要

  • 半導體產業概要
    • 半導體的價值鏈
  • 全球半導體市場

第7章 市場形勢

  • 市場概要
  • 半導體的需求的影響因素
  • 市場規模與預測
  • 波特的五力分析

第8章 地理區分

  • 晶粒層級包裝設備的全球市場:各地區
  • 亞太地區
    • 市場規模與預測
  • 南北美洲
    • 市場規模與預測
  • 歐洲·中東·非洲地區
    • 市場規模與預測

第9章 購買標準

第10章 市場成長因素

第11章 成長因素與其影響

第12章 市場課題

第13章 成長因素與課題的影響

第14章 市場趨勢

第15章 趨勢與其影響

第16章 業者情勢

  • 競爭模式
  • 主要供應商
    • ASM International
    • BE Semiconductor Industries (Besi)
    • DISCO
    • Kulicke & Soffa Industries
  • 其他卓越供應商
    • Cohu
    • TOWA
    • 新川
    • Advantest
    • 日立先端科技

第17章 主要供應商分析

  • ASM International
  • Besi
  • DISCO
  • Kulicke & Soffa

第18章 相關報告

目錄
Product Code: IRTNTR6742

About Die-level Packaging

ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials. Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole.

Technavio's analysts forecast the global die-level packaging equipment market to grow at a CAGR of 1.24% during 2014-2019.

Covered in this Report

This report covers the present scenario and growth prospects of the global die-level packaging equipment market for 2015-2019. To calculate the market size, the report considers revenue generated from the sales of die-level packaging equipment worldwide. However, the report does not consider the following while calculating the market size:

  • Support or maintenance services offered for/with die-level packaging equipment
  • Components used in the production of die-level packaging equipment
  • Aftermarket sales of die-level packaging equipment

Technavio's report, Global Die-level Packaging Equipment Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.

Key Regions

  • Americas
  • APAC
  • EMEA

Key Vendors

  • ASM International
  • BE Semiconductor Industries
  • DISCO
  • Kulicke & Soffa Industries

Other Prominent Vendors

  • Advantest
  • Cohu
  • Hitachi High-Technologies
  • Shinkawa
  • TOWA

Market Driver

  • Rise in Demand for Smartphones and Tablets
  • For a full, detailed list, view our report

Market Challenge

  • Rapid Changes in Technology
  • For a full, detailed list, view our report

Market Trend

  • Short Replacement Cycle of Portable Electronic Devices
  • For a full, detailed list, view our report

Key Questions Answered in this Report

  • What will the market size be in 2019 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

Table of Contents

01. Executive Summary

02. List of Abbreviations

03. Scope of the Report

  • 03.1. Market Overview
  • 03.2. Product Offerings

04. Market Research Methodology

  • 04.1. Market Research Process
  • 04.2. Research Methodology

05. Introduction

06. Industry Overview

  • 06.1. Semiconductor Industry Overview
    • 06.1.1. Semiconductor Value Chain
  • 06.2. Global Semiconductor Market

07. Market Landscape

  • 07.1. Market Overview
  • 07.2. Factors Influencing Demand for Semiconductors
  • 07.3. Market Size and Forecast
  • 07.4. Five Forces Analysis

08. Geographical Segmentation

  • 08.1. Global Die-level Packaging Equipment Market by Geography 2014-2019
  • 08.2. Global Die-level Packaging Equipment Market by Geography 2014-2019
  • 08.3. Die-level Packaging Equipment Market in APAC
    • 08.3.1. Market Size and Forecast
  • 08.4. Die-level Packaging Equipment Market in Americas
    • 08.4.1. Market Size and Forecast
  • 08.5. Die-level Packaging Equipment Market in EMEA
    • 08.5.1. Market Size and Forecast

09. Buying Criteria

10. Market Growth Drivers

11. Drivers and Their Impact

12. Market Challenges

13. Impact of Drivers and Challenges

14. Market Trends

15. Trends and Their Impact

16. Vendor Landscape

  • 16.1. Competitive Scenario
  • 16.2. Key Vendors
    • 16.2.1. ASM International
    • 16.2.2. BE Semiconductor Industries (Besi)
    • 16.2.3. DISCO
    • 16.2.4. Kulicke & Soffa Industries
  • 16.3. Other Prominent Vendors
    • 16.3.1. Cohu
    • 16.3.2. TOWA
    • 16.3.3. Shinkawa
    • 16.3.4. Advantest
    • 16.3.5. Hitachi High-Technologies

17. Key Vendor Analysis

  • 17.1. ASM International
    • 17.1.1. Key Facts
    • 17.1.2. Business Overview
    • 17.1.3. Product Portfolio
    • 17.1.4. Geographical Segmentation by Revenue 2013
    • 17.1.5. Business Strategy
    • 17.1.6. SWOT Analysis
  • 17.2. Besi
    • 17.2.1. Key facts
    • 17.2.2. Business overview
    • 17.2.3. Geographical segmentation by revenue 2014
    • 17.2.4. Recent developments
    • 17.2.5. SWOT analysis
  • 17.3. DISCO
    • 17.3.1. Key Facts
    • 17.3.2. Business Overview
    • 17.3.3. Business Segmentation by Revenue 2014
    • 17.3.4. Geographical Segmentation by Revenue 2014
    • 17.3.5. SWOT Analysis
  • 17.4. Kulicke & Soffa
    • 17.4.1. Key Facts
    • 17.4.2. Business Overview
    • 17.4.3. Business Segmentation by Revenue 2014
    • 17.4.4. Business Segmentation by Revenue 2013 and 2014
    • 17.4.5. Geographical Segmentation by Revenue 2014
    • 17.4.6. Business Strategy
    • 17.4.7. Recent Developments
    • 17.4.8. SWOT Analysis

18. Other Reports in this Series

List of Exhibits

  • Exhibit 1: Market Research Methodology
  • Exhibit 2: Workflow of Semiconductor IC Production and Packaging
  • Exhibit 3: Semiconductor Value Chain
  • Exhibit 4: Global Semiconductor Market
  • Exhibit 5: Global Die-level Packaging Equipment Market 2014-2019 ($ billions)
  • Exhibit 6: Global Die-level Packaging Equipment Market by Geography 2014
  • Exhibit 7: Global Die-level Packaging Equipment Market by Geography 2014-2019 (percentage share)
  • Exhibit 8: Global Die-level Packaging Equipment Market by Geography 2014-2019 ($ millions)
  • Exhibit 9: ASM International: Product Portfolio
  • Exhibit 10: ASM International: Geographical Segmentation by Revenue 2013
  • Exhibit 11: Besi: Geographical segmentation by revenue 2014
  • Exhibit 12: DISCO: Business Segmentation by Revenue 2014
  • Exhibit 13: DISCO: Geographical Segmentation by Revenue 2014
  • Exhibit 14: Kulicke & Soffa: Business Segmentation by Revenue 2014
  • Exhibit 15: Kulicke & Soffa: Business Segmentation by Revenue 2013 and 2014 ($ millions)
  • Exhibit 16: Kulicke & Soffa: Geographical Segmentation by Revenue 2014
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