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市場調查報告書

半導體構裝材料的全球市場 - 2016∼2020年

Global Semiconductor Packaging Materials Market 2017-2021

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 325009
出版日期 內容資訊 英文 136 Pages
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半導體構裝材料的全球市場 - 2016∼2020年 Global Semiconductor Packaging Materials Market 2017-2021
出版日期: 2017年11月14日 內容資訊: 英文 136 Pages
簡介

半導體構裝材料的全球市場預測從2016年到2020年這段期間將以4.79%的年複合成長率 (CAGR) 持續成長。

本報告涵括半導體構裝材料的全球市場,提供您推動市場成長要素和市場上的課題,並透過市場趨勢,以及市場競爭情形的詳細調查,進行目前市場方案分析以及2016年到2020年的市場預測。

第1章 摘要整理

第2章 本報告涵蓋範圍

  • 市場概要
  • 主要供應商產品

第3章 市場調查手法

  • 調查手法
  • 經濟指標

第4章 序論

  • 市場相關重要事項

第5章 技術概況

  • 半導體包裝與組裝
  • 晶圓層級 vs. 晶粒層級的包裝與組裝
  • 半導體包裝產業藍圖
  • 半導體IC封裝產業的生態系統

第6章 半導體封裝技術

  • Small outline (SO) packages
  • Grid array (GA) packages
  • Flat no-leads packages
  • Quad flat packages (QFP)
  • Dual in-line package (DIP)
  • Other technologies

第7章 市場概況

  • 市場概要
  • 市場規模及未來預測
  • PEST分析
  • 波特的五力分析

第8章 各材料類型市場分類

  • 就各材料類型來看的半導體構裝材料的全球市場 - 2015∼2020年
  • 有機基板全球市場
  • 鍵合線全球市場
  • 導線架全球市場
  • 封裝樹脂全球市場
  • 陶瓷封裝全球市場
  • 晶片粘接材全球市場
  • 焊球全球市場
  • 其他半導體包裝材料全球市場

第9章 各地區市場分類

  • 從各地區來看半導體構裝材料的全球市場 - 2015∼2020年
  • 亞太地區的半導體構裝材料市場
  • 北美的半導體構裝材料市場
  • 歐洲的半導體構裝材料市場

第10章 主要國家

  • 台灣
  • 中國
  • 日本

第11章 推動市場成長要素

第12章 推動市場成長要素帶來的影響

第13章 市場課題

第14章 推動市場成長要素和市場課題帶來的影響

第15章 市場趨勢

第16章 業者情勢

  • 市場競爭方案

第17章 主要供應商分析

  • Amkor Technology
  • DuPont
  • Henkel
  • 日立化成株式會社
  • Honeywell International
  • 京瓷株式會社
  • 凸版印刷株式會社
  • 其他卓越供應商

第18章 附錄

第19章 關於Technavio

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目錄
Product Code: IRTNTR15950

About Semiconductor Packaging Materials

Semiconductor packages are plastic, ceramic, and metal components that are not only protect fabricated integrated circuits (ICs) on the semiconductor die, but also act as an interconnect between the printed circuit board (PCB) and the die during shipping and handling. These packaging materials safeguard and protect the die from the external mechanical impacts and corrosion, besides acting as an electrically conductive interconnection with excellent signal propagation properties. Excessive heat in the integrated circuit is dissipation through attached heat spreaders. Semiconductor packaging components vary in dimensions and functionality and are mainly organic substrates, bonding wires, encapsulation resins, lead frames, thermal interface materials, die attach materials, and solder balls. The key customers of these packaging materials are the electronics industry, automotive sector, fabless semiconductor companies, packaging material suppliers, and packaging subcontractors.

Technavio's analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 5.27% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for 2017-2021. To calculate the market size, the report considers the revenue generated by vendors through the sales of semiconductor packaging materials which are organic substrates, lead frames, bonding wires, encapsulation resins, die attach materials, solder balls, thermal interface materials, and WLP dielectrics.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Semiconductor Packaging Materials Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Amkor Technology
  • DuPont
  • Henkel
  • Honeywell
  • Kyocera
  • Toppan Printing

Other Prominent Vendors

  • Hitachi Chemical
  • ASM Pacific Technology
  • BASF
  • Beijing Kehua New Chemical Technology

Market driver

  • Increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT
  • For a full, detailed list, view our report

Market challenge

  • Capital-intensive market
  • For a full, detailed list, view our report

Market trend

  • Increase in adoption of flip-chip, Sip, lead-free packaging solutions
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: INTRODUCTION

  • Market outline

PART 05: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 06: MARKET SIZING

  • Market definition
  • Market sizing 2016
  • Market size and forecast 2016-2021

PART 07: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 08: CUSTOMER LANDSCAPE

PART 09: MARKET SEGMENTATION BY MATERIAL TYPE

  • Segmentation by material type
  • Organic substrates - Market size and forecast 2016-2021
  • Lead frames - Market size and forecast 2016-2021
  • Bonding wires - Market size and forecast 2016-2021
  • Others - Market size and forecast 2016-2021
  • Market opportunity by type of materials

PART 10: REGIONAL LANDSCAPE

  • Geographical segmentation
  • APAC - Market size and forecast 2016-2021
  • Americas - Market size and forecast 2016-2021
  • EMEA - Market size and forecast 2016-2021
  • Market opportunity

PART 11: DECISION FRAMEWORK

PART 12: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 13: MARKET TRENDS

  • Increase in adoption of flip-chip, Sip, lead-free packaging solutions
  • Growing preference of SMT (surface mount technology) over older through-hole technology and surge in popularity of redistributed chip packaging
  • Surge in adoption of semiconductor ICs for automobiles and shift toward copper as bonding wire material

PART 14: VENDOR LANDSCAPE

  • Competitive scenario

PART 15: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Amkor Technology
  • DuPont
  • Henkel
  • Honeywell
  • Kyocera
  • Toppan Printing

PART 16: APPENDIX

  • List of abbreviations

List of Exhibits

  • Exhibit 01: Steps in back-end chip formation
  • Exhibit 02: Roadmap of semiconductor packaging
  • Exhibit 03: Old supply chain of semiconductor IC packaging industry
  • Exhibit 04: New supply chain of semiconductor IC packaging industry
  • Exhibit 05: Related market
  • Exhibit 06: Semiconductor packaging materials technologies
  • Exhibit 07: Global semiconductor packaging materials market overview
  • Exhibit 08: Market characteristics
  • Exhibit 09: Market segments
  • Exhibit 10: Market definition - Inclusions and exclusions checklist
  • Exhibit 11: Market size 2016
  • Exhibit 12: Validation techniques employed for market sizing 2016
  • Exhibit 13: Global semiconductor packaging materials - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 14: Global semiconductor packaging materials market- Year-over-year growth 2017-2021 (%)
  • Exhibit 15: Five forces analysis 2016
  • Exhibit 16: Five forces analysis 2021
  • Exhibit 17: Bargaining power of buyers
  • Exhibit 18: Bargaining power of suppliers
  • Exhibit 19: Threat of new entrants
  • Exhibit 20: Threat of substitutes
  • Exhibit 21: Threat of rivalry
  • Exhibit 22: Market condition in 2016 - Five forces
  • Exhibit 23: Customer landscape
  • Exhibit 24: Global semiconductor packaging materials by market type 2016-2021 (%)
  • Exhibit 25: Comparison by end-user
  • Exhibit 26: Organic substrates - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 27: Organic substrates - Year-over-year growth 2017-2021 (%)
  • Exhibit 28: Lead frames - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 29: Lead frames - Year-over-year growth 2017-2021 (%)
  • Exhibit 30: Bonding wires - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 31: Bonding wires - Year over year growth 2017-2021 (%)
  • Exhibit 32: Others - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 33: Others - Year-over-year growth 2017-2021 (%)
  • Exhibit 34: Market opportunity by material type
  • Exhibit 35: Global semiconductor packaging materials market share by geography 2016-2021 (%)
  • Exhibit 36: Regional comparison
  • Exhibit 37: APAC - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 38: APAC - Year-over-year growth 2017-2021 (%)
  • Exhibit 39: Top 3 countries in Americas
  • Exhibit 40: Americas - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 41: Americas - Year-over-year growth 2017-2021 (%)
  • Exhibit 42: Top 3 countries in EMEA
  • Exhibit 43: EMEA - Market size and forecast 2016-2021 ($ billions)
  • Exhibit 44: EMEA - Year-over-year growth 2017-2021 (%)
  • Exhibit 45: Top 3 countries in APAC
  • Exhibit 46: Vendor classification
  • Exhibit 47: Market positioning of vendors
  • Exhibit 48: Amkor Technology overview
  • Exhibit 49: Amkor Technology - Business segments
  • Exhibit 50: Amkor Technology- Organizational developments
  • Exhibit 51: Amkor Technology- Geographic focus
  • Exhibit 52: Amkor Technology - Business segment focus
  • Exhibit 53: Amkor Technology - Key application packaging products
  • Exhibit 54: DuPont overview
  • Exhibit 55: DuPont - Business segments
  • Exhibit 56: Dupont - Organizational developments
  • Exhibit 57: Dupont - Geographic focus
  • Exhibit 58: Dupont - Segment focus
  • Exhibit 59: Dupont - Key offerings
  • Exhibit 60: Henkel overview
  • Exhibit 61: Henkel - Business segments
  • Exhibit 62: Henkel - Organizational developments
  • Exhibit 63: Henkel - Geographic focus
  • Exhibit 64: Henkel - Segment focus
  • Exhibit 65: Henkel - Key offerings
  • Exhibit 66: Honeywell overview
  • Exhibit 67: Honeywell - Business segments
  • Exhibit 68: Honeywell - Organizational developments
  • Exhibit 69: Honeywell - Geographic focus
  • Exhibit 70: Honeywell - Segment focus
  • Exhibit 71: Honeywell - Key offerings
  • Exhibit 72: Kyocera overview
  • Exhibit 73: Kyocera - Business segments
  • Exhibit 74: Kyocera - Organizational developments
  • Exhibit 75: Kyocera - Geographic focus
  • Exhibit 76: Kyocera - Segment focus
  • Exhibit 77: Kyocera - Key offerings
  • Exhibit 78: Toppan Printing overview
  • Exhibit 79: Toppan Printing - Business segments
  • Exhibit 80: Toppan Printing - Organizational developments
  • Exhibit 81: Toppan Printing - Geographic focus
  • Exhibit 82: Toppan Printing - Segment focus
  • Exhibit 83: Toppan Printing - Key offerings
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