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市場調查報告書

半導體構裝材料的全球市場 - 2016∼2020年

Global Semiconductor Packaging Materials Market 2016-2020

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 325009
出版日期 內容資訊 英文 112 Pages
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半導體構裝材料的全球市場 - 2016∼2020年 Global Semiconductor Packaging Materials Market 2016-2020
出版日期: 2016年04月18日 內容資訊: 英文 112 Pages
簡介

半導體構裝材料的全球市場預測從2016年到2020年這段期間將以4.79%的年複合成長率 (CAGR) 持續成長。

本報告涵括半導體構裝材料的全球市場,提供您推動市場成長要素和市場上的課題,並透過市場趨勢,以及市場競爭情形的詳細調查,進行目前市場方案分析以及2016年到2020年的市場預測。

第1章 摘要整理

第2章 本報告涵蓋範圍

  • 市場概要
  • 主要供應商產品

第3章 市場調查手法

  • 調查手法
  • 經濟指標

第4章 序論

  • 市場相關重要事項

第5章 技術概況

  • 半導體包裝與組裝
  • 晶圓層級 vs. 晶粒層級的包裝與組裝
  • 半導體包裝產業藍圖
  • 半導體IC封裝產業的生態系統

第6章 半導體封裝技術

  • Small outline (SO) packages
  • Grid array (GA) packages
  • Flat no-leads packages
  • Quad flat packages (QFP)
  • Dual in-line package (DIP)
  • Other technologies

第7章 市場概況

  • 市場概要
  • 市場規模及未來預測
  • PEST分析
  • 波特的五力分析

第8章 各材料類型市場分類

  • 就各材料類型來看的半導體構裝材料的全球市場 - 2015∼2020年
  • 有機基板全球市場
  • 鍵合線全球市場
  • 導線架全球市場
  • 封裝樹脂全球市場
  • 陶瓷封裝全球市場
  • 晶片粘接材全球市場
  • 焊球全球市場
  • 其他半導體包裝材料全球市場

第9章 各地區市場分類

  • 從各地區來看半導體構裝材料的全球市場 - 2015∼2020年
  • 亞太地區的半導體構裝材料市場
  • 北美的半導體構裝材料市場
  • 歐洲的半導體構裝材料市場

第10章 主要國家

  • 台灣
  • 中國
  • 日本

第11章 推動市場成長要素

第12章 推動市場成長要素帶來的影響

第13章 市場課題

第14章 推動市場成長要素和市場課題帶來的影響

第15章 市場趨勢

第16章 業者情勢

  • 市場競爭方案

第17章 主要供應商分析

  • Amkor Technology
  • DuPont
  • Henkel
  • 日立化成株式會社
  • Honeywell International
  • 京瓷株式會社
  • 凸版印刷株式會社
  • 其他卓越供應商

第18章 附錄

第19章 關於Technavio

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目錄
Product Code: IRTNTR9245

About Semiconductor Packaging Materials

Semiconductor packages are metal, plastic, and ceramic components which not only protect the fabricated IC on the semiconductor die but also acts as an interconnect between the die and the PCB (printed circuit board). They protect the die from external mechanical impact and corrosion, and also act as electrically conductive interconnects with excellent signal propagation properties. Excess heat in the circuit is not allowed to build up by dissipation through attached heat spreaders. Packaging components vary in dimensions and functionality and mainly are organic substrates, leadframes, bonding wires, encapsulation resins, die attach materials, solder balls, and thermal interface materials, among others. The key customers of these packaging material are fabless semiconductor companies, packaging material suppliers, packaging subcontractors, semiconductor manufacturers, the electronics industry, and the automotive sector.

Technavio's analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 4.79% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for the period 2016-2020. To calculate the market size and geographical segmentation, the report considers the revenue generated from the sales of different types of packaging based on the type of material, which can be broadly classified as either leadframe based or laminate substrate based.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Semiconductor Packaging Materials Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Amkor Technology
  • DuPont
  • Henkel
  • Hitachi Chemical
  • Honeywell
  • KYOCERA
  • Toppan Printing

Other Prominent Vendors

  • Alpha Advanced Materials
  • Applied Materials
  • ASM Pacific Technology (ASMPT)
  • BASF
  • Beijing Doublink Solders
  • Beijing Kehua New Chemical Technology
  • Cheil Industries
  • Duksan Hi-metal
  • Diehl Metall
  • Dynacraft
  • Evergreen Semiconductor Materials
  • Guangdong Rongtai
  • Heesung Metal
  • Heraeus
  • Ibiden
  • Indium
  • IQE
  • KCC
  • LG Innotek
  • Lintec
  • Lord
  • Mitsui High-Tec
  • MK Electron
  • Nanya PCB
  • Ningbo Dongsheng IC
  • Nippon Micrometal
  • Nitto Denko
  • Poongsan
  • Samsung Techwin
  • Shinko
  • Shin-Etsu Chemical
  • Shanghai Sinyang Semiconductor Materials
  • Sumitomo Metal Mining
  • Tanaka Denshi Kogyo
  • Tatsuta Electronic Materials
  • Xiamen Yonghong Electronics

Market driver

  • Rising demand for polymer adhesive wafer bonding equipment
  • For a full, detailed list, view our report

Market challenge

  • Fluctuating foreign exchange rates
  • For a full, detailed list, view our report

Market trend

  • Rapid technological changes
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Top-vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Technology landscape

  • Semiconductor packaging and assembly
  • Wafer-level versus die-level packaging and assembly
  • Roadmap of the semiconductor packaging industry
  • Ecosystem of semiconductor IC packaging industry

PART 06: Semiconductor packaging technology

  • Small outline (SO) packages
  • Grid array (GA) packages
  • Flat no-leads packages
  • Quad flat packages (QFP)
  • Dual in-line package (DIP)
  • Other technologies

PART 07: Market landscape

  • Market overview
  • Market size and forecast
  • PEST analysis
  • Five forces analysis

PART 08: Market segmentation by type of material

  • Global semiconductor packaging materials market by type of material 2015-2020
  • Global organic substrates market
  • Global bonding wires market
  • Global leadframes market
  • Global encapsulation resins market
  • Global ceramic packages market
  • Global die attach materials market
  • Global solder balls market
  • Global other semiconductor packaging materials market

PART 09: Geographical segmentation

  • Global semiconductor packaging materials market geographically 2015-2020
  • Semiconductor packaging materials market in APAC
  • Semiconductor packaging materials market in North America
  • Semiconductor packaging materials market in Europe

PART 10: Key leading countries

  • Taiwan
  • China
  • Japan

PART 11: Market drivers

PART 12: Impact of drivers

PART 13: Market challenges

PART 14: Impact of drivers and challenges

PART 15: Market trends

PART 16: Vendor landscape

  • Competitive scenario

PART 17: Key vendor analysis

  • Amkor Technology
  • DuPont
  • Henkel
  • Hitachi Chemical
  • Honeywell International
  • Kyocera
  • Toppan Printing
  • Other prominent vendors

PART 18: Appendix

  • List of abbreviations

PART 19: Explore Technavio

List of Exhibits

  • Exhibit 01: Product offerings
  • Exhibit 02: Steps in back-end chip formation
  • Exhibit 03: Old supply chain of semiconductor IC packaging industry
  • Exhibit 04: New supply chain of semiconductor IC packaging industry
  • Exhibit 05: Semiconductor packaging materials technologies
  • Exhibit 06: Global semiconductor packaging materials market landscape
  • Exhibit 07: Global semiconductor packaging materials market 2015-2020 ($ billion)
  • Exhibit 08: Five forces analysis
  • Exhibit 09: Global semiconductor packaging materials market by type of material 2015 and 2020 (revenue %)
  • Exhibit 10: Global semiconductor packaging materials market by type of material 2015-2020 (revenue %)
  • Exhibit 11: Global semiconductor packaging materials market by type of material 2015-2020 ($ billion)
  • Exhibit 12: Global organic substrates market 2015-2020 ($ billion)
  • Exhibit 13: Global bonding wires market 2015-2020 ($ billion)
  • Exhibit 14: Global leadframes market 2015-2020 ($ billion)
  • Exhibit 15: Global encapsulation resins market 2015-2020 ($ billion)
  • Exhibit 16: Global ceramic packages market 2015-2020 ($ billion)
  • Exhibit 17: Global die attach materials market 2015-2020 ($ billion)
  • Exhibit 18: Die attach materials by type 2015 (revenue %)
  • Exhibit 19: Global solder balls market 2015-2016 ($ billion)
  • Exhibit 20: Global other semiconductor packaging materials market 2015-2020 ($ billion)
  • Exhibit 21: Five forces analysis by geography
  • Exhibit 22: Global semiconductor packaging materials market by geography 2015 and 2020 (revenue %)
  • Exhibit 23: Global semiconductor packaging materials market by geography 2015-2020 (revenue %)
  • Exhibit 24: Global semiconductor packaging materials market by geography 2015-2020 ($ billion)
  • Exhibit 25: Semiconductor packaging materials market in APAC 2015-2020 ($ billion)
  • Exhibit 26: Semiconductor packaging materials market in North America 2015-2020 ($ billion)
  • Exhibit 27: Semiconductor packaging materials market in Europe 2015-2020 ($ billion)
  • Exhibit 28: Key leading countries in 2015
  • Exhibit 29: Global MEMS market 2015-2020 ($ billion)
  • Exhibit 30: Impact of drivers
  • Exhibit 31: Global semiconductor capital equipment market by geography 2014 and 2015 ($ billion)
  • Exhibit 32: Impact of drivers and challenges
  • Exhibit 33: Global NAND flash market 2015-2020 (revenue %)
  • Exhibit 34: Global car shipments 2015-2020 (shipment growth %)
  • Exhibit 35: Amkor Technology: Product segmentation by revenue 2015
  • Exhibit 36: Amkor Technology: Geographical segmentation by revenue 2015
  • Exhibit 37: DuPont: Segmentation of revenue by business 2015
  • Exhibit 38: DuPont: Geographical segmentation by revenue 2015
  • Exhibit 39: Henkel: Business segmentation by revenue 2015
  • Exhibit 40: Henkel: Geographical segmentation by revenue 2015
  • Exhibit 41: Hitachi Chemical: Business segmentation by revenue 2015
  • Exhibit 42: Hitachi Chemical: Geographical segmentation by revenue 2015
  • Exhibit 43: Honeywell International: Business segmentation by revenue 2015
  • Exhibit 44: Honeywell International: Geographical segmentation by revenue by 2015
  • Exhibit 45: Kyocera: Business segmentation by revenue 2015
  • Exhibit 46: Kyocera: Geographical segmentation by revenue 2015
  • Exhibit 47: Toppan Printing: Business segmentation by revenue 2015
  • Exhibit 48: Toppan Printing: Geographical segmentation by revenue 20150
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