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市場調查報告書

熱傳導性材料(TIM)的全球市場

Global Thermal Interface Materials (TIM) Market 2014-2018

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 318314
出版日期 內容資訊 英文 86 Pages
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熱傳導性材料(TIM)的全球市場 Global Thermal Interface Materials (TIM) Market 2014-2018
出版日期: 2014年11月05日 內容資訊: 英文 86 Pages
簡介

熱傳導性材料(TIM)作為散熱處理用途,使用於電腦產業和電器及電子工業、通信工業,還有汽車產業等寬廣的範圍,TIM的全球市場預計從2013年到2018年期間以10.30%的年複合成長率持續擴大。

本報告以TIM的全球市場為主題,提供從許多產業的專家取得的資料和資訊,以及市場成長推動要素、市場課題、市場趨勢,還有依據市場競爭情形詳細分析為基礎的現行市場規模估計,以及到2018年的未來預測。提供TIM市場各產品類型、各終端用戶產業,還有各地區分類之詳細分析與市場預測。

第1章 摘要整理

第2章 簡稱表

第3章 本報告涵蓋範圍

  • 市場概要
  • 提供產品

第4章 市場調查手法

  • 市場調查流程
  • 調查手法

第5章 序論

第6章 市場情形

  • 市場概要

第7章 全球TIM市場

  • 市場規模及未來預測
  • 波特的五力分析

第8章 各產品類型市場分析

  • 各產品類型的TIM全球市場
  • 聚合物為基礎的TIM全球市場
    • 市場規模及未來預測
  • 相變TIM全球市場
    • 市場規模及未來預測
  • 金屬為基礎的TIM全球市場
    • 市場規模及未來預測

第9章 各終端用戶產業市場分析

  • 各終端用戶產業的TIM全球市場
  • 電腦產業的TIM全球市場
    • 市場規模及未來預測
  • 電力及電子工業的TIM全球市場
    • 市場規模及未來預測
  • 通信工業的TIM全球市場
    • 市場規模及未來預測
  • 汽車其他產業的TIM全球市場
    • 市場規模及未來預測

第10章 各地區市場分析

  • 各地區的TIM全球市場
  • 亞太地區的TIM市場
    • 市場規模及未來預測
  • 南北美洲地區的TIM市場
    • 市場規模及未來預測
  • 歐洲、中東,及非洲地區的TIM市場
    • 市場規模及未來預測

第11章 主要國家

  • 中國
  • 美國
  • 日本

第12章 購買標準

第13章 推動市場成長要素

第14章 推動市場成長要素與其影響

第15章 市場課題

第16章 市場成長促進要素和市場課題帶來的影響

第17章 市場趨勢

第18章 市場趨勢與其影響

第19章 供應商情形

  • 市場競爭方案
  • 其他關注供應商

第20章 主要供應商分析

  • Cookson Electronics Assembly Materials
  • Dow Corning
  • Henkel
  • Honeywell International
  • Laird
  • Zalman Tech

第21章 相關報告

目錄
Product Code: IRTNTR4564

About TIM

TIM is used to support heat sinks in removing heat from heat sources in various equipment. It is generally used in the form of a secondary thermally conducting material to replace the thermally insulating air between the two surfaces. Along with helping in the efficient transfer of heat, TIM also acts as an adhesive and strengthens the mechanical link between the surfaces. Polymer-based TIM, metal-based TIM, and phase change TIM (PCTIM) are the basic types of TIM commercially available. Owing to its conductive and adhesive properties, TIM is used for thermal management applications in various industries, including Computers, Electrical and Electronics, Telecom, and Automotive.

TechNavio's analysts forecast the Global TIM market to grow at a CAGR of 10.30 percent over the period 2013-2018.

Covered in this Report

The report covers the present scenario and the growth prospects of the Global TIM market for the period 2014-2018. Some of the major end-users of the Global TIM market are the Computers, Electrical and Electronics, Telecom, and Automotive industries.

TechNavio's report, the Global TIM Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the America, the APAC and EMEA regions; it also covers the Global TIM market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.

Key Regions

  • Americas
  • APAC
  • EMEA

Key Vendors

  • Cookson Electronics Assembly Materials
  • Dow Corning
  • Henkel
  • Honeywell International
  • Laird
  • Zalman Tech

Other Prominent Vendors

  • 3M
  • Aavid Thermalloy
  • Aegis Technology
  • AI Technology
  • Akasa Group
  • AMETEK Specialty Metal Products
  • AOS Thermal Compounds
  • Arctic Silver
  • Bergquist
  • Cast-Coat
  • Chomerics
  • Cool Polymers
  • Coolaboratory
  • Enerdyne Thermal Solutions
  • Epoxies
  • Indium
  • Innovation Cooling
  • LORD
  • Master Bond
  • Materion
  • MC-21
  • MG Chemicals
  • Momentive
  • NuSil Technology
  • ROGERS
  • Rubbercraft
  • Seal King Industrial
  • Shenzhen Western Hemisphere Technology
  • Shin-Etsu Chemical
  • Stockwell Elastomerics
  • T-Global Technology
  • Thermal Transfer Composites
  • Timtronics
  • Universal Science
  • Vanguard products
  • Wakefield-Vette

Key Market Driver

  • Increased Functionality of Telecommunication and Electronic Devices
  • For a full, detailed list, view our report

Key Market Challenge

  • Concentration of Demand
  • For a full, detailed list, view our report

Key Market Trend

  • Increased Usage of PCTIM
  • For a full, detailed list, view our report

Key Questions Answered in this Report

  • What will the market size be in 2018 and what will the growth rate be
  • What are the key market trends
  • What is driving this market
  • What are the challenges to market growth
  • Who are the key vendors in this market space
  • What are the market opportunities and threats faced by the key vendors
  • What are the strengths and weaknesses of the key vendors

Table of Contents

01. Executive Summary

02. List of Abbreviations

03. Scope of the Report

  • 03.1. Market Overview
  • 03.2. Product Offerings

04. Market Research Methodology

  • 04.1. Market Research Process
  • 04.2. Research Methodology

05. Introduction

06. Market Landscape

  • 06.1. Market Overview

07. Global TIM Market

  • 07.1. Market Size and Forecast
  • 07.2. Five Forces Analysis

08. Market Segmentation by Product

  • 08.1. Global TIM Market Segmentation by Product 2013-2018
  • 08.2. Global Polymer-based TIM Market
    • 08.2.1. Market Size and Forecast
  • 08.3. Global PCTIM Market
    • 08.3.1. Market Size and Forecast
  • 08.4. Global Metal-based TIM Market
    • 08.4.1. Market Size and Forecast

09. Market Segmentation by End-users

  • 09.1. Global TIM Market Segmentation by End-users 2013-2018
  • 09.2. Global TIM Market in Computers
    • 09.2.1. Market Size and Forecast
  • 09.3. Global TIM Market in Electrical and Electronics
    • 09.3.1. Market Size and Forecast
  • 09.4. Global TIM Market in Telecom
    • 09.4.1. Market Size and Forecast
  • 09.5. Global TIM Market in Automotive and Others
    • 09.5.1. Market Size and Forecast

10. Geographical Segmentation

  • 10.1. Global TIM Market by Geographical Segmentation 2013-2018
  • 10.2. TIM Market in the APAC Region
    • 10.2.1. Market Size and Forecast
  • 10.3. TIM Market in the Americas
    • 10.3.1. Market Size and Forecast
  • 10.4. TIM Market in the EMEA
    • 10.4.1. Market Size and Forecast

11. Key Leading Countries

  • 11.1. China
  • 11.2. US
  • 11.3. Japan

12. Buying Criteria

13. Market Growth Drivers

14. Drivers and their Impact

15. Market Challenges

16. Impact of Drivers and Challenges

17. Market Trends

18. Trends and their Impact

19. Vendor Landscape

  • 19.1. Competitive Scenario
  • 19.2. Other Prominent Vendors

20. Key Vendor Analysis

  • 20.1. Cookson Electronics Assembly Materials
    • 20.1.1. Key Facts
    • 20.1.2. Business Overview
    • 20.1.3. Product Segmentation
    • 20.1.4. Sales Offices
    • 20.1.5. SWOT Analysis
  • 20.2. Dow Corning
    • 20.2.1. Key Facts
    • 20.2.2. Business Overview
    • 20.2.3. Key Locations
    • 20.2.4. Business Strategy
    • 20.2.5. Recent Developments
    • 20.2.6. SWOT Analysis
  • 20.3. Henkel
    • 20.3.1. Key Facts
    • 20.3.2. Business Overview
    • 20.3.3. Key Brands and Technologies
    • 20.3.4. Business Strategy
    • 20.3.5. Recent Developments
    • 20.3.6. SWOT Analysis
  • 20.4. Honeywell International
    • 20.4.1. Key Facts
    • 20.4.2. Business Overview
    • 20.4.3. Business Segmentation by Revenue 2013
    • 20.4.4. Business Segmentation by Revenue 2012 and 2013
    • 20.4.5. Geographical Segmentation by Revenue 2013
    • 20.4.6. Business Strategy
    • 20.4.7. Recent Developments
    • 20.4.8. SWOT Analysis
  • 20.5. Laird
    • 20.5.1. Key Facts
    • 20.5.2. Business Overview
    • 20.5.3. Business Segmentation by Revenue 2013
    • 20.5.4. Business Segmentation by Revenue 2012 and 2013
    • 20.5.5. Geographical Segmentation by Revenue 2013
    • 20.5.6. Business Strategy
    • 20.5.7. Recent Developments
    • 20.5.8. SWOT Analysis
  • 20.6. Zalman Tech
    • 20.6.1. Key Facts
    • 20.6.2. Business Overview
    • 20.6.3. Business Segmentation
    • 20.6.4. Geographical Segmentation
    • 20.6.5. Business Strategy
    • 20.6.6. Recent Developments
    • 20.6.7. SWOT Analysis

21. Other Reports in this Series

List of Exhibits

  • Exhibit 1: Market Research Methodology
  • Exhibit 2: Global TIM Market Segmentation
  • Exhibit 3: Global TIM Market Segmentation by Product
  • Exhibit 4: Global TIM Market Segmentation by End-user
  • Exhibit 5: Global TIM Market Segmentation by Geography
  • Exhibit 7: Global TIM Market 2013-2018 (US$ million)
  • Exhibit 6: Global TIM Market Segmentation by Product 2013-2018
  • Exhibit 7: Global TIM Market Segmentation by Product 2013-2018 (US$ million)
  • Exhibit 8: Global Polymer-based TIM Market 2013-2018 (US$ million)
  • Exhibit 9: Global PCTIM Market 2013-2018 (US$ million)
  • Exhibit 10: Global Metal-based TIM Market 2013-2018 (US$ million)
  • Exhibit 11: Global TIM Market Segmentation by End-users 2013-2018
  • Exhibit 12: Global TIM Market Segmentation by End-users 2013-2018 (US$ million)
  • Exhibit 13: Global TIM Market in Computers 2013-2018 (US$ million)
  • Exhibit 14: Global TIM Market in Electrical and Electronics 2013-2018 (US$ million)
  • Exhibit 15: Global TIM Market in Electrical and Electronics Segmentation by Type 2013-2018
  • Exhibit 16: Global TIM Market in Telecom 2013-2018 (US$ million)
  • Exhibit 17: Global TIM Market in Automotive and Others 2013-2018 (US$ million)
  • Exhibit 18: Global TIM Market by Geographical Segmentation 2013-2018
  • Exhibit 19: Global TIM Market by Geographical Segmentation 2013-2018 (US$ million)
  • Exhibit 20: TIM Market in APAC Region 2013-2018 (US$ million)
  • Exhibit 21: TIM Market in Americas 2013-2018 (US$ million)
  • Exhibit 22: TIM Market in EMEA 2013-2018 (US$ million)
  • Exhibit 23: Global Shipments of Tablets, Laptops and Personal Computers 2012-2017 (Million Units)
  • Exhibit 24: Annual Global Automobile Sales 2012-2018 (Million Vehicles)
  • Exhibit 25: Cookson Electronics Assembly Materials: Product Segmentation
  • Exhibit 26: Cookson Electronics Assembly Materials: Sales Offices
  • Exhibit 27: Dow Corning: Key Locations
  • Exhibit 28: Henkel: Key Brands and Technologies
  • Exhibit 29: Honeywell International: Business Segmentation by Revenue 2013
  • Exhibit 30: Honeywell International: Business Segmentation by Revenue 2012 and 2013 (US$ billion)
  • Exhibit 31: Honeywell International: Geographical Segmentation by Revenue 2013
  • Exhibit 32: Laird: Business Segmentation by Revenue 2013
  • Exhibit 33: Laird: Business Segmentation by Revenue 2012 and 2013 (US$ million)
  • Exhibit 34: Laird: Geographical Segmentation by Revenue 2013
  • Exhibit 35: Zalman Tech: Business Segmentation 2013
  • Exhibit 36: Zalman Tech: Geographical Segmentation
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