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市場調查報告書

混合訊號SoC的全球市場:2015-2019年

Global Mixed Signal SoC Market 2015-2019

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 317819
出版日期 內容資訊 英文 80 Pages
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混合訊號SoC的全球市場:2015-2019年 Global Mixed Signal SoC Market 2015-2019
出版日期: 2015年09月23日 內容資訊: 英文 80 Pages
簡介

全球混合訊號SoC的市場預計從2014年到2019年將以8.46%的年複合成長率成長。

本報告提供全球混合訊號SoC市場相關調查,提供您SoC及混合訊號SoC概要,整體市場及用途·各地區的主要趨勢,收益規模的變化與預測,市場成長的各種影響因素分析,競爭環境,並彙整主要供應商簡介等資料。

第1章 摘要整理

第2章 調查範圍

  • 市場概要
  • 主要供應商的產品

第3章 市場調查手法

  • 調查手法
  • 經濟指標

第4章 簡介

  • 市場焦點

第5章 市場環境

  • 市場概要
  • 市場規模·預測
  • 波特的五力分析

第6章 各用途市場

  • 通訊網基礎設施
  • CE產品
  • 電腦
  • 汽車

第7章 各地區市場

  • 亞太地區
  • 南北美洲
  • 歐洲·中東·非洲

第8章 主要國家

  • 中國
  • 日本

第9章 市場成長因素

第10章 成長因素的影響

第11章 市場課題

第12章 成長因素與課題的影響

第13章 市場趨勢

第14章 業者情勢

  • 競爭模式
  • 其他的有力供應商

第15章 主要供應商分析

  • Broadcom
  • Freescale Semiconductor
  • Infineon Technologies
  • Intel
  • Qualcomm
  • Texas Instruments

第16章 附錄

第17章 關於Technavio

圖表

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目錄
Product Code: IRTNTR7107

About mixed signal SoC

A mixed signal SoC is an electronic circuit that integrates both analog circuits and digital circuits on a single semiconductor die. It is an IC consisting of a large number of transistors on a single chip with applications in embedded systems. Most of the electronic systems accommodate analog signals because of the applicability of analog interfaces in many systems such as temperature, pressure, sound, and video sensors. Due to the signal processing capability of digital circuits, many electronic systems today integrate both these circuits in order to achieve the mixed-signal operation.

Technavio predicts the global mixed signal SoC market to grow at a CAGR of 8.46% over the period 2014-2019.

Covered in this report

This report covers the present scenario and growth prospects of the global mixed signal SoC market during 2015-2019. The report covers the mixed signal SoC market for the following application segments:

  • Communication network infrastructure
  • Consumer electronics
  • Computer
  • Automotive
  • Others

Technavio's report, Global Mixed Signal SoC Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report focuses on the market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market. The report also focuses on the demand patterns from various geographies for the forecast period.

Key regions

  • Americas
  • APAC
  • EMEA

Key vendors

  • Broadcom
  • Freescale Semiconductor
  • Infineon Technologies
  • Intel
  • Qualcomm
  • Texas Instruments

Other Prominent Vendors

  • Altera
  • ARM Holdings
  • Marvell Technology Group
  • STMicroelectronics

Key market driver

  • Increased demand for wireless computing devices
  • For a full, detailed list, view our report

Key market challenge

  • Mixed signal design and verification complexities
  • For a full, detailed list, view our report

Key market trend

  • High investments in R&D
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2019 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Top-vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Market landscape

  • Market overview
  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by application

  • Global communication network infrastructure mixed signal SoC market
  • Global consumer electronics mixed signal SoC market
  • Global computer mixed signal SoC market
  • Global automotive mixed signal SoC market

PART 07: Geographical segmentation

  • Mixed signal SoC market in APAC
  • Mixed signal SoC market in Americas
  • Mixed signal SoC market in EMEA

PART 08: Key leading countries

  • China
  • Japan

PART 09: Market drivers

PART 10: Impact of drivers

PART 11: Market challenges

PART 12: Impact of drivers and challenges

PART 13: Market trends

PART 14: Vendor landscape

  • Competitive scenario
  • Other prominent vendors

PART 15: Key vendor analysis

  • Broadcom
  • Freescale Semiconductor
  • Infineon Technologies
  • Intel
  • Qualcomm
  • Texas Instruments

PART 16: Appendix

  • List of abbreviations

PART 17: Explore Technavio

List of Exhibits

  • Exhibit 01: Product offerings
  • Exhibit 02: Application segments of mixed signal SoC
  • Exhibit 03: Mixed signal SoC: Market overview
  • Exhibit 04: Global mixed signal SoC market 2014-2019 ($ billions)
  • Exhibit 05: Five forces analysis
  • Exhibit 06: Global mixed signal SoC market segmentation by application 2014
  • Exhibit 07: Global mixed signal SoC market segmentation 2014-2019
  • Exhibit 08: Global communication network infrastructure mixed signal SoC market ($ billions)
  • Exhibit 09: Global consumer electronics mixed signal SoC market ($ billions)
  • Exhibit 10: Global computer mixed signal SoC market ($ billions)
  • Exhibit 11: Ultramobile product segmentation
  • Exhibit 12: Global automotive mixed signal SoC market ($ billions)
  • Exhibit 13: Growth rate of global shipment of cars 2014-2019
  • Exhibit 14: Global mixed signal SoC market segmentation by geography 2014
  • Exhibit 15: Global mixed signal SoC market segmentation by geography 2014-2019
  • Exhibit 16: Mixed signal SoC market in APAC ($ billions)
  • Exhibit 17: Top ultramobile devices in terms of performance
  • Exhibit 18: Automotive production by country 2014
  • Exhibit 19: Mixed signal SoC market in Americas ($ billions)
  • Exhibit 20: Mixed signal SoC market in EMEA ($ billions)
  • Exhibit 21: Key leading countries
  • Exhibit 22: Impact of drivers
  • Exhibit 23: Impact of drivers and challenges
  • Exhibit 24: IoT spending and device penetration
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