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市場調查報告書

全球晶圓層次電子構裝(WLP)設備市場

Global Wafer-level Packaging Equipment Market 2015-2019

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 294963
出版日期 內容資訊 英文 85 Pages
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全球晶圓層次電子構裝(WLP)設備市場 Global Wafer-level Packaging Equipment Market 2015-2019
出版日期: 2015年01月21日 內容資訊: 英文 85 Pages
簡介

由於IC非常纖細,有污染造成故障的傾向。為了消除那樣的疑慮,矽晶片和IC,使用包裝材料保護。全球晶圓層次電子構裝(WLP)設備市場,預計2014年∼2019年以0.1%的年複合成長率成長。

本報告提供全球晶圓層次電子構裝(WLP)設備市場相關調查分析、市場規模與成長率、市場趨勢、推動市場要素與課題、市場機會驗證、主要供應商等相關的系統性資訊。

第1章 摘要整理

第2章 簡稱清單

第3章 調查範圍

  • 市場概要
  • 主要的產品

第4章 市場調查手法

  • 市場調查流程
  • 調查手法

第5章 簡介

第6章 產業概要

  • 半導體產業概要
    • 半導體價值鏈
  • 半導體市場結構
  • 全球半導體市場概要
    • 半導體市場地區區分

第7章 市場形勢

  • 市場規模與預測
  • 波特的五力分析

第8章 地區區分

  • 全球晶圓層次電子構裝設備市場:各區域區隔
  • 亞太地區的晶圓層次電子構裝設備市場
    • 市場規模與預測
  • 南北美洲的晶圓層次電子構裝設備市場
    • 市場規模與預測
  • 歐洲、中東、非洲地區的晶圓層次電子構裝設備市場
    • 市場規模與預測

第9章 主要國家

  • 台灣
  • 韓國
  • 美國

第10章 購買標準

第11章 推動市場成長要素

第12章 推動因素與其影響

第13章 市場課題

第14章 推動因素與課題的影響

第15章 市場趨勢

第16章 趨勢與其影響

第17章 業者情勢

  • 競爭模式
  • 市場佔有率分析
  • 其他卓越供應商

第18章 主要供應商分析

  • Applied Materials
  • DISCO
  • EV
  • Tokyo Electron Glass
  • 東京精密

第19章 市場摘要

  • 成長推動要素
  • 成長阻礙因素
  • 持續性趨勢
  • 市場魅力

第20章 相關報告

圖表

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目錄
Product Code: IRTNTR5108

About Wafer-level Packaging Equipment

ICs are very delicate in nature, therefore, prone to contamination that can cause malfunctioning. To eliminate such issues, silicon chips or ICs are protected by using packaging materials. Wafer level packaging is one such type of packaging, which involves the packaging of individual ICs using best fit packaging processes conducted at wafer level manufacturing in semiconductor production process.

TechNavio's analysts forecast the Global Wafer-level Packaging Equipment market to grow at a CAGR of 0.1 percent over the period 2014-2019.

Covered in this Report

This report covers the present scenario and the growth prospects of the Global Wafer-level Packaging Equipment market for the period 2015-2019. This report considers 2014 as the base year and provides data for the trailing 12 months. To calculate the market size, the report considers revenue generated from the sales of wafer-level packaging equipment worldwide. However, the report does not take into consideration the following while calculating the market size:

  • Support or maintenance services that are offered for/with wafer-level packaging equipment
  • Components that are used in the production of wafer-level packaging equipment
  • Aftermarket sales of wafer-level packaging equipment

Key Regions

  • Americas
  • APAC
  • EMEA

Key Vendors

  • Applied Materials
  • Disco
  • EV Group
  • Tokyo Electron
  • Tokyo Seimitsu

Other Prominent Vendors

  • Rudolph Technologies
  • SEMES
  • Suss Microtec
  • Ultratech
  • ULVAC

Market Driver

  • Increased Demand for Smartphones and Tablets
  • For a full, detailed list, view our report

Market Challenge

  • Rapid Changes in Technology
  • For a full, detailed list, view our report

Market Trend

  • Short Replacement Cycle of Portable Electronic Devices
  • For a full, detailed list, view our report

Key Questions Answered in this Report

  • What will the market size be in 2019 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

Table of Contents

01. Executive Summary

02. List of Abbreviations

03. Scope of the Report

  • 03.1. Market Overview
  • 03.2. Product Offerings

04. Market Research Methodology

  • 04.1. Market Research Process
  • 04.2. Research Methodology

05. Introduction

06. Industry Overview

  • 06.1. Semiconductor Industry Overview
    • 06.1.1. Semiconductor Value Chain
  • 06.2. Structure of Semiconductor Market
  • 06.3. Global Semiconductor Market Overview
    • 06.3.1. Geographical Segmentation of Semiconductor Market 2005-2012

07. Market Landscape

  • 07.1. Market Size and Forecast
  • 07.2. Five Forces Analysis

08. Geographical Segmentation

  • 08.1. Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019
  • 08.2. Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (percentage share and revenue split)
  • 08.3. Wafer-level Packaging Equipment Market in APAC Region
    • 08.3.1. Market Size and Forecast
  • 08.4. Wafer-level Packaging Equipment Market in Americas
    • 08.4.1. Market Size and Forecast
  • 08.5. Wafer-level Packaging Equipment Market in EMEA Region
    • 08.5.1. Market Size and Forecast

09. Key Leading Countries

  • 09.1. Taiwan
  • 09.2. South Korea
  • 09.3. US

10. Buying Criteria

11. Market Growth Drivers

12. Drivers and their Impact

13. Market Challenges

14. Impact of Drivers and Challenges

15. Market Trends

16. Trends and their Impact

17. Vendor Landscape

  • 17.1. Competitive Scenario
  • 17.2. Market Share Analysis 2014
  • 17.3. Other Prominent Vendors

18. Key Vendor Analysis

  • 18.1. Applied Materials
    • 18.1.1. Key Facts
    • 18.1.2. Business Overview
    • 18.1.3. Business Segmentation by Revenue 2013
    • 18.1.4. Business Segmentation by Revenue 2011-2013
    • 18.1.5. Geographical Segmentation by Revenue 2013
    • 18.1.6. Business Strategy
    • 18.1.7. Recent Developments
    • 18.1.8. SWOT Analysis
  • 18.2. DISCO
    • 18.2.1. Key Facts
    • 18.2.2. Business Overview
    • 18.2.3. Product Segmentation by Revenue 2013
    • 18.2.4. Product Segmentation by Revenue 2012 and 2013
    • 18.2.5. Geographical Segmentation by Revenue 2013
    • 18.2.6. Business Strategy
    • 18.2.7. Recent Developments
    • 18.2.8. SWOT Analysis
  • 18.3. EV
    • 18.3.1. Key Facts
    • 18.3.2. Business Overview
    • 18.3.3. Product Segmentation 2013
    • 18.3.4. Recent Developments
    • 18.3.5. SWOT Analysis
  • 18.4. Tokyo Electron
    • 18.4.1. Key Facts
    • 18.4.2. Business Overview
    • 18.4.3. Business Segmentation by Revenue 2013
    • 18.4.4. Business Segmentation by Revenue 2011-2013
    • 18.4.5. Geographical Segmentation by Revenue 2013
    • 18.4.6. Business Strategy
    • 18.4.7. Recent Developments
    • 18.4.8. SWOT Analysis
  • 18.5. Tokyo Seimitsu
    • 18.5.1. Key Facts
    • 18.5.2. Business Overview
    • 18.5.3. Product Segmentation by Revenue 2013
    • 18.5.4. Product Segmentation by Revenue 2012 and 2013
    • 18.5.5. Geographical Segmentation by Revenue 2013
    • 18.5.6. Business Strategy
    • 18.5.7. Recent Developments
    • 18.5.8. SWOT Analysis

19. Market Summary

  • 19.1. Growth Propellers
    • 19.1.1. Expansion Plans
    • 19.1.2. Replacement of Old Equipment
  • 19.2. Growth Inhibitor
    • 19.2.1. Cyclic Nature of Semiconductor Industry
    • 19.2.2. Rapid Advances in Technology
  • 19.3. Ongoing Trends
    • 19.3.1. Increasing Number of Innovations
    • 19.3.2. Increasing Penetration of Clean Energy Devices
    • 19.3.3. Increasing Focus on Improving Production Yield
    • 19.3.4. Increasing Adoption of Semiconductors in Automotive Sector
  • 19.4. Market Attractiveness

20. Other Reports in this Series

List of Exhibits

  • Exhibit 1: Market Research Methodology
  • Exhibit 2: Semiconductor Value Chain
  • Exhibit 3: Front-end Process
  • Exhibit 4: Back-end Process
  • Exhibit 5: Structure of Semiconductor Market
  • Exhibit 6: Global Semiconductor Market 2014
  • Exhibit 7: Global Semiconductor Market by Geographical Segmentation 2005-2012
  • Exhibit 8: Global Wafer-level Packaging Equipment Market 2013-2018 (US$ million)
  • Exhibit 9: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014
  • Exhibit 10: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (percentage share)
  • Exhibit 11: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (US$ million)
  • Exhibit 12: Comparison of Geographies by CAGR 2014-2019
  • Exhibit 13: Wafer-level Packaging Equipment Market in Taiwan 2014-2019 (US$ million)
  • Exhibit 14: Wafer-level Packaging Equipment Market in South Korea 2014-2019 (US$ million)
  • Exhibit 15: Wafer-level Packaging Equipment Market in US 2014-2019 (US$ million)
  • Exhibit 16: CAGR Comparison between Key Leading Countries 2014-2019
  • Exhibit 17: Global Smartphone Market by Unit Shipments 2013-2019 (billion units)
  • Exhibit 18: Global Tablets Market by Unit Shipments 2013-2019 (million units)
  • Exhibit 19: Global Wafer-level Packaging Equipment Market by Vendor Ranking 2014
  • Exhibit 20: Applied Materials: Business Segmentation by Revenue 2013
  • Exhibit 21: Applied Materials: Business Segmentation by Revenue 2011-2013 (US$ million)
  • Exhibit 22: Applied Materials: Geographical Segmentation by Revenue 2013
  • Exhibit 23: DISCO: Product Segmentation by Revenue 2013
  • Exhibit 24: DISCO: Product Segmentation by Revenue 2012 and 2013 (US$ million)
  • Exhibit 25: DISCO: Geographical Segmentation by Revenue 2013
  • Exhibit 26: EV: Product Segmentation 2013
  • Exhibit 27: Tokyo Electron: Business Segmentation by Revenue 2013
  • Exhibit 28: Tokyo Electron: Business Segmentation by Revenue 2011-2013 (US$ million)
  • Exhibit 29: Tokyo Electron: Geographical Segmentation by Revenue 2013
  • Exhibit 30: Tokyo Seimitsu: Business Segmentation by Revenue 2013
  • Exhibit 31: Tokyo Seimitsu: Business Segmentation by Revenue 2011-2013 (US$ million)
  • Exhibit 32: Tokyo Seimitsu: Geographical Segmentation by Revenue 2013
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