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市場調查報告書

3D IC的全球市場:2015年∼2019年

Global 3D IC Market 2015-2019

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 261565
出版日期 內容資訊 英文 69 Pages
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3D IC的全球市場:2015年∼2019年 Global 3D IC Market 2015-2019
出版日期: 2015年12月09日 內容資訊: 英文 69 Pages
簡介

全球3D(3維)IC市場,預計從2015年到2019年以79%以上的年複合成長率擴大。

本報告提供全球3D IC市場趨勢與成長預測、市場成長因素和課題、主要供應商分析等。

第1章 摘要整理

第2章 調查範圍

  • 市場概要
  • 主要的產品

第3章 市場調查手法

  • 調查手法
  • 經濟指標
  • PEST分析

第4章 簡介

第5章 市場形勢

  • 產業概要
  • 技術形勢
  • 3D IC的生態系統
  • 市場概要
  • 市場規模與預測
  • 波特的五力分析

第6章 各產品的市場區隔

  • 市場概要
  • 市場規模與預測

第7章 地理區分

  • 市場概要
  • 市場規模與預測

第8章 市場成長因素

第9章 市場課題

第10章 成長因素與課題的影響

第11章 市場趨勢

第12章 業者情勢

  • 競爭模式
  • 主要供應商
  • 其他卓越供應商

第13章 主要供應商分析

  • ASE
  • Samsung Electronics
  • STMicroelectronics
  • TSMC
  • 東芝

第14章 重要建議:對供應商/投資者

第15章 簡稱清單

第16章 相關報告

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目錄
Product Code: IRTNTR8075

Market outlook of the 3D IC market

Technavio's research analyst predicts the global 3D IC market to grow at a CAGR above 79% during the forecast period. The demand for compact and high-performance ICs in smartphones, tablet PCs, smart TVs, automotive products, and heavy equipment is the primary growth driver for this market. In comparison to 2D ICs, they have better performance and high bandwidth. Moreover, 3D ICs have a lesser number of interconnections between the packages, consumes less power, and require less space on electronic boards.

The high proliferation of IoT devices is expected to boost the market growth during the forecast period. Vendors in IoT market are constantly innovating in designing, manufacturing, and packaging. This enables them to come up with new IoT products in different verticals such as consumer electronics, healthcare, and manufacturing. 3D MEMS and sensors are used to capture data in a real-time scenario, which helps the company in increasing the returns by streamlining the process, increasing productivity, and enabling predictive maintenance. They also reduce the maintenance cost and the possibility of a sudden stop of work due to machinery failure.

Product segmentation and analysis of the 3D IC market

  • Memories
  • Sensors
  • MEMS
  • LEDs

The memory product segment dominated the market during 2014, with a market share of over 62%. Technological advances such as high storage capacity and less power consumption are increasing the adoption of 3D NAND and DDR4 DRAM in smartphones, tablet PCs, consumer electronics, and automotive products, thereby driving the growth of the 3D memory chips.

Geographical segmentation and analysis of the 3D IC market

  • Americas
  • APAC
  • EMEA

APAC accounted for 52% of the market share during 2014 and is expected to grow at a CAGR of 86% during the forecast period. The high growth in memory product segment and presence of several prominent manufacturers in the mobile and consumer electronics market such as Xiaomi, Samsung, LG, HTC, ZTE, Huawei, Lenovo, and Sony is expected to create a high demand for 3D ICs in the region during the forecast period.

Competitive landscape and key vendors

The global 3D IC market is at the nascent stage and manufacturers are aiming for the first mover advantage by making an early entry into the market. The vendors in the market compete on the basis of price, quality, innovation, and technology. Collaborations between OSAT, IDMs, and OEMs is expected to bring down the cost of 3D ICs in the coming years.

The leading vendors in the market are -

  • Advanced Semiconductor Engineering (ASE)
  • Samsung
  • STMicroelectronics
  • Taiwan Semiconductors Manufacturing (TSMC)
  • Toshiba

Other prominent vendors in the market include Intel, Micron, SanDisk, SK Hynix, STATS ChipPAC, United Microelectronics, and Xilinx.

Key questions answered in the report include

  • What will the market size and the growth rate be in 2019?
  • What are the key factors driving the global 3D IC market?
  • What are the key market trends impacting the growth of the 3D IC market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the vendors in the global 3D IC market?
  • Trending factors influencing the market shares of the Americas, APAC, and EMEA?
  • What are the key outcomes of the five forces analysis of the 3D IC market?

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Top-vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators
  • PEST analysis

PART 04: Introduction

  • Key market highlights

PART 05: Market landscape

  • Industry overview
  • Technology landscape
  • Ecosystem of 3D ICs
  • Market overview
  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by product types

  • Market overview
  • Market size and forecast

PART 07: Geographical segmentation

  • Market overview
  • Market size and forecast

PART 08: Market drivers

  • Impact of drivers

PART 09: Market challenges

PART 10: Impact of drivers and challenges

PART 11: Market trends

PART 12: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 13: Key vendor analysis

  • ASE
  • Samsung Electronics
  • STMicroelectronics
  • TSMC
  • Toshiba

PART 14: Key recommendations for vendors/investors

PART 15: Appendix

  • List of abbreviations

PART 16: Explore Technavio

List of Exhibits

  • Exhibit 01: Global 3D IC market segments: A snapshot
  • Exhibit 02: Product offerings
  • Exhibit 03: Global semiconductor market overview 2014
  • Exhibit 04: 2.5D IC block diagram
  • Exhibit 05: 3D IC block diagram
  • Exhibit 06: Global semiconductor market (% share)
  • Exhibit 07: Global 3D IC market 2014-2019 ($ billions)
  • Exhibit 08: Five forces analysis
  • Exhibit 09: Global 3D IC market by products 2014 (% share)
  • Exhibit 10: Global 3D IC market 2014-2019 by products (% share)
  • Exhibit 11: Global 3D IC market 2014-2019 by products ($ billions)
  • Exhibit 12: Global 3D IC market by geography 2014 (% share)
  • Exhibit 13: Global 3D IC market by geography 2014-2019 (% share)
  • Exhibit 14: Global 3D IC market by geography 2014-2019 ($ billions)
  • Exhibit 15: CAGR of global 3D IC market by geography 2014-2019
  • Exhibit 16: Impact of market drivers on key customer segments
  • Exhibit 17: IoT spending and device penetration
  • Exhibit 18: Impact of drivers and challenges
  • Exhibit 19: ASE: Business segmentation 2014 by revenue
  • Exhibit 20: ASE: Business segmentation by revenue 2013 and 2014 (in billions)
  • Exhibit 21: ASE: Geographical segmentation by revenue 2013
  • Exhibit 22: Samsung Electronics: Business segmentation 2013
  • Exhibit 23: Samsung Electronics: Business segmentation by revenue 2013 and 2014 ($ billions)
  • Exhibit 24: Samsung Electronics: Geographical segmentation by revenue 2014
  • Exhibit 25: STMicroelectronics: Business segmentation 2014 by revenue
  • Exhibit 26: STMicroelectronics: Business segmentation by revenue 2013 and 2014 ($ in billions)
  • Exhibit 27: STMicroelectronics: Geographical segmentation by revenue 2014
  • Exhibit 28: TSMC: Business segmentation by revenue 2014
  • Exhibit 29: TSMC: Business segmentation by revenue 2013 and 2014 ($ billions)
  • Exhibit 30: TSMC: Geographical segmentation by revenue 2014
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