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市場調查報告書

半導體資本設備的全球市場:2017年∼2021年

Global Semiconductor Capital Equipment Market 2017-2021

出版商 TechNavio (Infiniti Research Ltd.) 商品編碼 239351
出版日期 內容資訊 英文 81 Pages
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半導體資本設備的全球市場:2017年∼2021年 Global Semiconductor Capital Equipment Market 2017-2021
出版日期: 2017年07月12日 內容資訊: 英文 81 Pages
簡介

半導體資本設備的全球市場在2017年到2021年這段期間,預測將以6.36%的年複合成長率 (CAGR) 擴大。

本報告依設備類型,終端用戶及地區別提供全球半導體資本設備市場現狀分析與今後預測,提供市場成長因素與課題,主要趨勢,主要供應商簡介等資訊。

第1章 摘要整理

第2章 本報告的調查範圍

第3章 調查手法

第4章 簡介

  • 市場概要
  • 半導體產業的價值鏈

第5章 市場形勢

  • 市場概要
  • 市場規模與預測
  • 波特的五力分析

第6章 設備各類型的市場分類

  • 全球半導體資本設備市場:各類型
  • 晶圓構裝製造設備
  • 晶粒層級包裝·集合設備
  • 自動檢查裝置

第7章 各終端用戶的市場分類

  • 全球半導體資本設備市場:各終端用戶
  • 晶圓代工廠
  • 記憶體製造商
  • IDM

第8章 地理區分

  • 全球半導體資本設備市場:各地區
  • 亞太地區
  • 南北美洲
  • 歐洲·中東·非洲地區

第9章 主要國家

  • 主要國家
  • 台灣
  • 韓國
  • 日本
  • 中國

第10章 決策架構

第11章 市場成長因素與課題

  • 市場成長因素
  • 市場課題

第12章 市場趨勢

第13章 業者情勢

  • 競爭模式
  • 主要供應商
  • 其他卓越供應商

第14章 附錄

  • 簡稱清單

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目錄
Product Code: IRTNTR14755

About Semiconductor Capital Equipment

Semiconductor capital equipment is machinery used in the production of semiconductor devices. Equipment for manufacturing semiconductor devices is classified as front-end or back-end based on the processes used. Front-end includes wafer fabrication along with other functions such as lithography, deposition, etching, cleaning, and chemical and mechanical polishing to name a few. Back-end encompasses assembly, packaging, and testing of ICs. Semiconductors are the building blocks for electronics. They form the crucial core of any electronic component. Semiconductor capital spending essentially refers to the capital investments by vendors in the semiconductor domain.

Technavio's analysts forecast the global semiconductor capital equipment market to grow at a CAGR of 6.36 % during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor capital equipment market for 2017-2021. To calculate the market size, the report considers the sale of semiconductor capital equipment to end-user segments.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Semiconductor Capital Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Applied Materials
  • ASML
  • KLA-Tencor
  • Lam Research
  • Tokyo Electron

Other Prominent Vendors

  • ASM International
  • ADVANTEST
  • Hitachi High-Technologies
  • Kulicke & Soffa
  • Nikon
  • Planar
  • Rudolph Technologies
  • SCREEN Semiconductor Solutions (SCREEN Holdings)
  • Teradyne
  • TOKYO SEIMITSU
  • Veeco Instruments

Market driver

  • Integration of semiconductor devices across industrial sectors
  • For a full, detailed list, view our report

Market challenge

  • High inventory levels in supply chain
  • For a full, detailed list, view our report

Market trend

  • Rapid changes in technology driving equipment orders
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction

  • Market outline
  • Semiconductor industry value chain

PART 05: Market landscape

  • Market overview
  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by equipment type

  • Global semiconductor capital equipment by type
  • Wafer-level manufacturing equipment
  • Die-level packaging and assembly equipment
  • Automated test equipment

PART 07: Market segmentation by end-user

  • Global semiconductor capital equipment by end-user
  • Foundries
  • Memory manufacturers
  • IDMs

PART 08: Geographical segmentation

  • Global semiconductor capital equipment market by geography
  • APAC
  • Americas
  • EMEA

PART 09: Key leading countries

  • Key leading countries
  • Taiwan
  • South Korea
  • Japan
  • China

PART 10: Decision framework

PART 11: Drivers and challenges

  • Market drivers
  • Market challenges

PART 12: Market trends

  • Rapid changes in technology driving equipment orders
  • Rising prominence of 3D packaging
  • Large-scale development of the Chinese semiconductor industry
  • Automation in automobiles
  • Development of multi-beam e-beam inspection
  • Proliferation of IoT technology

PART 13: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 14: Appendix

  • List of abbreviations

List of Exhibits

  • Exhibit 01: Semiconductor industry value chain
  • Exhibit 02: Description of semiconductor industry value chain
  • Exhibit 03: Segmentation of global semiconductor capital equipment market
  • Exhibit 04: Global semiconductor capital equipment market 2016-2021 ($ billions)
  • Exhibit 05: Requirements for semiconductor capital equipment
  • Exhibit 06: Factors influencing the purchase decisions
  • Exhibit 07: Five forces analysis
  • Exhibit 08: Global semiconductor capital equipment market by type 2016-2021 (% share of revenue)
  • Exhibit 09: Global semiconductor capital equipment market by type 2016-2021 ($ billions)
  • Exhibit 10: Global semiconductor capital equipment by wafer-level manufacturing equipment market 2016-2021 ($ billions)
  • Exhibit 11: Global semiconductor capital equipment market by die-level packaging and assembly equipment 2016-2021 ($ billions)
  • Exhibit 12: Global semiconductor capital equipment market by automated test equipment 2016-2021 ($ billions)
  • Exhibit 13: Global semiconductor capital equipment market by end-user 2016-2021 (% share of revenue)
  • Exhibit 14: Global semiconductor capital equipment market by end-user 2016-2021 ($ billions)
  • Exhibit 15: Global semiconductor capital equipment market by foundries 2016-2021 ($ billions)
  • Exhibit 16: Global semiconductor capital equipment market by memory manufacturers 2016-2021 ($ billions)
  • Exhibit 17: Global semiconductor capital equipment market by IDMs 2016-2021 ($ billions)
  • Exhibit 18: Global semiconductor capital equipment market by geography 2016-2021 (% share of revenue)
  • Exhibit 19: Global semiconductor capital equipment market by geography 2016-2021 ($ billions)
  • Exhibit 20: Semiconductor capital equipment market in APAC 2016-2021 ($ billions)
  • Exhibit 21: Global semiconductor capital equipment market in Americas 2016-2021 ($ billions)
  • Exhibit 22: Semiconductor capital equipment market in EMEA 2016-2021 ($ billions)
  • Exhibit 23: Key leading countries
  • Exhibit 24: Share of key leading countries 2016-2021 (% share of revenue)
  • Exhibit 25: Forecast by application of semiconductor devices 2016 and 2021 (% share of revenue)
  • Exhibit 26: Global NAND flash market 2016-2021 (% share of revenue)
  • Exhibit 27: Global semiconductor market trend 1990-2016 ($ billions)
  • Exhibit 28: Timeline for semiconductor wafer size advances
  • Exhibit 29: Principle parameters of competition
  • Exhibit 30: R&D spending of leading vendors 2016
  • Exhibit 31: Vendor share in global semiconductor capital equipment market 2016 (% share of revenue)
  • Exhibit 32: Key vendors
  • Exhibit 33: Other prominent vendors
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