中國IC封裝及測試產業 是由出版商Market Intelligence & Consulting Institute (MIC)在2007年09月所出版的。
這份英文市場調查報告書包含22 pages 價格從美金1760起跳。
Abstract
In 2006, China' s semiconductor packaging and testing industry shipment value
reached 51.2 billion RMB (US$6.8 billion; US$1 = 7.5 RMB). Although this was a
48.4% increase compared to 2005, IC packaging and testing only held a 50.8%
share of China' s IC industry compared to 74.3% in 2002. In 2007, while NXP,
Qimonda, Micron Semiconductor, Kingston Technology, and Samsung have invested
in China to construct new production lines or expand capacity, TI was choosing
between China and the Philippines and was likely to partner with the
Philippines government in the end. Chinese IC packaging and testing service
providers have been establishing strategic alliances to improve their
technologies and create new business opportunities. This report will analyze
the current status of the IC packaging and testing industry in China as well
as leading companies' opportunities and challenges.
Table of Contents
Current status of the Chinese semiconductor packaging and testing industry,
including revenue during the period 2002 -2006 and leading players;
development of major semiconductor companies in China, including Freescale
Tianjin Final Manufacturing, Qimonda Technology, RFMD (Beijing), Shenzhen STS
Micro-Electronics, Shanghai Matsushita Semiconductor, Intel Products
(Shanghai), Nantong Fujitsu Microelectronics, and Changjiang Electronics;
future trends for the Chinese semiconductor packaging and testing industry.
- Development of Semiconductor Packaging and Testing in China
- Freescale Semiconductor' s Development
- Qimonda Technology' s Development
- RFMD Beijing' s Development
- Shenzhen STS Micro-Electronics' Development
- Shanghai Matsushita Semiconductor' s Development
- Intel Product' s Development
- Nantong Fujitsu Microelectronics' Development
- Changjiang Electronics' Development
- STATS ChipPAC' s Development
- MIC Perspective
- Appendix
ANST, ASE (Shanghai), Changjiang Electronics, China Resources Microelectronics
(Holdings), Freescale Semiconductor, Fujitsu Limited Japan, General
Semiconductor (China), Giemin Electronics, Hangzhou Youwang Electronics,
Hitachi Semiconductor (Suzhou), Hua Yue Microelectronics, HuaXu
Microelectronics, Huayue IC Packaging, Hynix-ST Semiconductor, Hyundai
Electronics (Shanghai), IBM, Infineon, Intel, Intel Products (Shanghai), Intel
Technology Development (SH), International Rectifier, Jiangsu Syber
Electronic, Jiangyin Changdian Advanced Packaging, Kingston Technology, Leshan
Phoenix Semiconductor, Leshan Radio, Lianyungang Huawei Electronic Group,
Micron Semiconductor, Micron Technology, Motorola, Nantong Fujitsu Micro,
Nantong Huada Microelectronics, National Semiconductor (Suzhou), NFME, Ningbo
Kangqiang Electronics, Nokia, NXP, Panasonic, Payton Technology, Qimonda
(Suzhou), Qingdao Hisense Communications, Renesas Technology, RF Micro
Devices, Sanyo Semiconductor, SGNEC, Shanghai Electronics Development Holding
Group, Shanghai Kai Hong Electronics, Shanghai Matsushita Semi, Shanghai
Simconix, Shenzhen STS Micro, SHIC, Silan Microelectronics, Siliconware
(Suzhou), SIMS, Sino-Microelectronics, SMIC, SMSC, Stats ChipPAC, STMicro,
Suzhou Hanlin, Suzhou Kinglong, Tianshui Huatian Microelectronics, Toshiba
Semiconductor, Unisonic Technologies, Wuxi China Resources Huajing
Microelectronics, Wuxi-KEC Semiconductor, Xiamen Union Development, Xiamen
Yonghong Electronic, Yangzhou Jinglai Electronics, Yangzhou JingShi High
Technology
List of Tables
- Table 1 China' s Top-ten Semiconductor Packaging and Testing Companies in
2006
- Table 2 China' s Main Packaging and Testing Makers in 2007
- Table 3 Freescale' s R&D and Production Locations
- Table 4 Qimonda AG' s R&D and Production Locations
- Table 5 STMicro' s R&D and Production Locations in China
- Table 6 Matsushita Electric Industrial' s Packaging and Testing Facilities
in China
- Table 7 Intel' s R&D and Production LocationsI in China
List of Figures
- Figure 1 Chinese Semiconductor Packaging and Testing Industry Revenue,
2002 - 2006
