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市場調查報告書

SiP技術開發的全球趨勢

Global Trends in SiP Technology Development

出版商 Market Intelligence & Consulting Institute (MIC) 商品編碼 353117
出版日期 內容資訊 英文 18 Pages
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SiP技術開發的全球趨勢 Global Trends in SiP Technology Development
出版日期: 2016年02月26日 內容資訊: 英文 18 Pages
簡介

近幾年,隨著輕量行動裝置和穿戴式設備的需求逐漸增加,SiP (系統級封裝) 技術愈來愈受關心。

本報告提供全球SiP開發,3個方面 (技術開發,市場應用開發,產業趨勢) 的驗證之系統性資訊。

第1章 全球SiP技術開發

  • 高層級的整合和小型化
  • SiP/模組設計綁定套組
  • SiP的進入障礙

第2章 全球SiP市場應用開發

  • 智慧型手機
  • 行動裝置、穿戴式設備、IoT

第3章 全球SiP產業的發展

  • 包裝、試驗服務供應商
  • IC基板廠商
  • IC製造工廠

第4章 結論

圖表

對象企業

  • Amkor、Apple、ASE、ChipPAC、Inotera Memories、JCET、Kansu、Nan Ya PCB、SPIL、TAM、TDK、Unimicron、USI
目錄
Product Code: SCRPT16022601

Under the global trends where electronic products are getting thinner, multi-functional and low power, the SiP (System in Package) technology has grabbed increasing attention, especially in recent years where the demand for lightweight mobile devices and wearables rises. With the IoT (Internet of Things) era approaching, multi-functional integration and low power consumption are considered essential when selecting an electronic product. Hence, SiP is playing an increasingly important role in the development of packaging technology. This report provides an in-depth analysis of global SiP development from three dimensions: technology development, market application development, and industry trends; examines how SiP shapes up and influences the semiconductor industry, particularly packaging and testing service providers, IC substrate manufacturers, and foundries.

Table of Contents

1. Global Development of SIP Technology

  • 1.1. High Levels of Integration and Miniaturization Drive SiP Development
  • 1.2. SiP/Module Design Bundles for Diverse Development
  • 1.3. Entry Barriers to SiP Remain High

2. Development of Global SiP Market Applications

  • 2.1. Smartphones as Key Growth Driver for SiP
  • 2.2. Mobile Devices, Wearables, and IoT Continue to Spur Demand for SiP

3. Development of the Global SiP industry

  • 3.1. Packaging and Testing Service Providers Make Aggressive Move Towards SiP
  • 3.2. IC Substrate Makers Also Extend Reach to SiP
  • 3.3. Foundries Aim for Turnkey Services with SiP

4. Conclusion

  • 4.1. Complete Supply Chain as Cornerstone of SiP Development
  • Appendix
  • Glossary of Terms
  • List of Companies

List of Topics

  • Development of SiP from the industry perspective and includes favorable and detrimental factors
  • Development of SiP from the perspective of market applications, touching on smartphones, other mobile devices, wearables and IoT
  • Development of SiP from the perspective of packaging and testing service providers, IC substrate manufacturers and foundries

List of Figures

  • Figure 1: How SiP Boosts Levels of Integration and Miniaturization
  • Figure 2: Major SiP Packaging Technologies
  • Figure 3: Use of SiP Modules in Smartphones
  • Figure 4: Global SiP Shipment Value and Growth, 2013-2016
  • Figure 5: Cooperation and Competition Between Foundries and Packaging and Testing Service Providers

Companies covered

Amkor, Apple, ASE, ChipPAC, Inotera Memories, JCET, Kansu, Nan Ya PCB, SPIL, TAM, TDK, Unimicron, USI.

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