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市場調查報告書

全球和台灣的半導體包裝產業

Worldwide and Taiwanese Semiconductor Packaging & Testing Industry, 2015 and Beyond

出版商 Market Intelligence & Consulting Institute (MIC) 商品編碼 339431
出版日期 內容資訊 英文 16 Pages
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全球和台灣的半導體包裝產業 Worldwide and Taiwanese Semiconductor Packaging & Testing Industry, 2015 and Beyond
出版日期: 2015年09月08日 內容資訊: 英文 16 Pages
簡介

全球IC封裝、實驗產業,帶動行動裝置的發展,2014年顯著成長。台灣的IC封裝、實驗產業,由於是技術、生產能力的龍頭,在全球達成最高成長。

本報告提供全球和台灣的半導體包裝產業調查分析、最近的發展趨勢、2015年之後的發展預測相關的系統性資訊。

第1章 全球和台灣的IC封裝、實驗產業趨勢

  • 中國的市場佔有率急速成長
  • 不確實的市場成長:2015年

第2章 全球和台灣的IC封裝、實驗產業的未來

  • 積極擴大
  • SiP主要技術
  • IC製造工廠的高端異種封裝技術開發的影響

結論

附錄

詞彙表

企業清單

目錄
Product Code: SCRPT15090801

Driven by the development of mobile devices, the worldwide IC packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure.

Table of Contents

1. Trends in Worldwide and Taiwanese IC Packaging and Testing Industries

  • 1.1. China's Market Share Sees Fastest Growth
  • 1.2. Uncertain Market Growth for 2015

2. Future of Worldwide and Taiwanese IC Packaging and Testing Industries

  • 2.1. Aggressive Expansion
  • 2.2. SiP to Become Key Technology
  • 2.3. Influence of IC Foundries' Development of High-end Heterogeneous Packaging Technologies
  • Conclusion
  • Industry's Optimism about the Future on the Wane
  • Enhancement in Technology and Production Capacity as Key to Stay Ahead
  • Appendix
  • Glossary of Terms
  • List of Companies

List of Topics

  • Overview of the major trends in the worldwide and Taiwanese IC packaging and testing industries, including major vendors' rankings by revenue in 2014 and market share by region from 2012 to 2015. Also provided are shipment value forecasts of the worldwide and Taiwanese IC packaging and testing industries from 2015 to 2017
  • Highlights of the industry's future development, touching on vendors' capacity expansion activities from 2013 to present, growing demand for SiP technology due to wearable devices and IoT, and development of high-end heterogeneous packaging technologies

List of Figures

  • Figure 1: Worldwide Top 10 IC Packaging and Testing Vendors by Revenue, 2014
  • Figure 2: Worldwide IC Packaging and Testing Market Share by Region, 2012 - 2015
  • Figure 3: Worldwide and Taiwanese IC Packaging and Testing Industry Shipment Value, 2014 - 2017
  • Figure 4: Evolution of End-User Devices and Packaging Technologies
  • Figure 5: Leading IC Foundries' High-end Heterogeneous Packaging Technologies

List of Tables

  • Table 1: Worldwide and Taiwanese IC Packaging and Testing Vendor's Capacity Expansion, 2013 - 2015

Companies covered

Amkor Technology, ASE, ASE Embedded Electronics Inc., Chipbond Technology, ChipMOS, FCI, Greatek Electronic, JCET, J-Device, Micron, Nepes, OCZ, Panasonic, Promos, PTI, Renesas, Samsung, SK Hynix, SMIC, SPIL, STATS ChipPAC, TDK, Tianshui Huatian Technology, Toshiba, TSMC, UTAC, Wuxi Tongzhi Microelectronics, Xilinx.

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