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全球TSV 3D IC產業的未來趨勢

Future Trends of the Worldwide TSV 3D IC Industry

出版商 Market Intelligence & Consulting Institute (MIC) 商品編碼 320893
出版日期 內容資訊 英文 16 Pages
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全球TSV 3D IC產業的未來趨勢 Future Trends of the Worldwide TSV 3D IC Industry
出版日期: 2014年12月11日 內容資訊: 英文 16 Pages


本報告提供全球TSV(矽穿孔電極)3D IC產業調查分析,技術、市場、產業方面的發展概要相關驗證等有系統的資訊。

第1章 全球封裝技術的發展

  • SiP成為主流技術
  • TSV 3D IC:封裝技術的未來趨勢
  • TSV 3D IC技術的獨自性
  • TSV 3D IC的現有課題
  • TSV 3D IC主動的外國企業

第2章 TSV 3D IC市場發展

  • 強有力的成長可能性
  • 大量生產活動低
  • 市場成長由於技術強化而加速

第3章 TSV 3D IC產業的發展

  • 超越產業形成聯盟
  • 台灣的IC設計工作室於HMCC缺席
  • 在台灣的上游、下游的企業間要求的緊密合作關係




Product Code: SCRPT14121101

Electronics devices are developing towards more compact form factors, more versatility, higher performance, and lower power consumption, driving IC packaging technologies towards SiP (System-in-Package) from single chip package. Among various SiP technologies, TSV 3D IC (Through-Silicon-Via) which vertically interconnects stacked dies using TSV technology has been considered the future packaging technology due to its high space efficiency and performance. Up to now, TSV 3D IC technology has only been applied to the integration of homogeneous chips, resulting in a low industrial value. However, the situation is about to change as some foreign vendors are projected to make technological progress. This report provides the overview development of TSV 3D IC from the aspects of technology, market, and industry.

Table of Contents

1. Development of Global Packaging Technologies

  • 1.1. SiP to Become Mainstream Technology
  • 1.2. TSV 3D IC: The Future Trend of Packaging Technology
  • 1.3. Uniqueness of TSV 3D IC Technology
  • 1.4. Existing Challenges for TSV 3D IC
  • 1.5. Foreign Players' Leading Position in TSV 3D IC

2. Development of TSV 3D IC Market

  • 2.1. Strong Growth Potential
  • 2.1. Mass Production Activities Remain Low
  • 2.2. Market Growth to Speed Up with Technological Enhancement

3. Development of the TSV 3D IC Industry

  • 3.1. Formation of Cross-industry Alliances
  • 3.2. Taiwanese IC Design Houses' Absence in HMCC
  • 3.3. Close Cooperation between Taiwanese Upstream and Downstream Players Required
  • MIC Perspective
  • Appendix

List of Topics

Overview of the development of global packaging technology SiP (System-in-Package), in particular TSV (Through-Silicon-Via) 3D IC technology; four major production processes and existing challenges of TSV 3D IC in stacking, circuit, stress, heat dissipation, yield and cost are also covered.

Development of the TSV 3D IC market and industry, including the global industry value forecast up to 2017 and major players' development plan in 2015 and 2016; also provided are those players' mass production timetable for TSV 3D IC.

Overview of the deployment of TSV 3D IC industry alliances, covering upstream to downstream segments of fabless, foundry, memeory, packaging and IDM; also included are the position of US, UK, Korean, Singaporean, and Taiwanese players in the TSV 3D IC supply chain.

List of Figures

  • Figure 1: Development of Electronic Devices and Packaging Technologies
  • Figure 2: Comparison of TSV 3D IC and Other Packaging Technologies
  • Figure 3: Production Process of TSV 3D IC
  • Figure 4: Worldwide TSV 3D IC Industry Value Forecast, 2014 - 2017
  • Figure 5: Major Players' Development Plan in 2015 and 2016
  • Figure 6: Comparison of Industry Alliances Worldwide
  • Figure 7: Participation of Taiwanese and Korean HMCC Members

List of Tables

  • Table 1: Current Challenges in TSV 3D IC Development
  • Table 2: Technology Development and Mass Production Timetable of Taiwanese and Foreign TSC IC Chipmakers
  • Table 3: TSV-based ICs Mass Produced as of Year-end 2014
  • Table 4: Impact on Taiwan's Semiconductor Industry

Companies covered

Altera, AMD, Amkor, ARM Holding, ASE Kaohsiung, GlobalFoundry, HMCC, Hynix, Inotera Memories, Micron, Samsung, STATS ChipPAC, STMicro, Toshiba, TSMC, UMC, Xilinx.

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