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市場調查報告書

中國·台灣間的半導體產業的發展趨勢

Review on the Development of Cross-Strait Semiconductor Industries in 2013

出版商 Market Intelligence & Consulting Institute (MIC) 商品編碼 298547
出版日期 內容資訊 英文 33 Pages
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中國·台灣間的半導體產業的發展趨勢 Review on the Development of Cross-Strait Semiconductor Industries in 2013
出版日期: 2014年03月31日 內容資訊: 英文 33 Pages
簡介

國際性半導體供應適在中國政府的優待政策與巨大的國內市場需求推動下,持續於中國建廠。此外也對中國的IC設計住宅廠商,包裝·實驗供應商有所貢獻。其結果讓中國的半導體產業嚴重威脅到台灣半導體產業的發展。

本報告提供中國·台灣間的半導體產業相關調查分析,提供現狀與現有/未來發展趨勢相關驗證,為您概述為以下內容。

第1章 中國·台灣間的半導體產業的生產規模與結構比較

第2章 中國·台灣間的IC設計產業比較

  • 產業規模比較
  • 中國·台灣的主要十大IC設計住宅的發展趨勢

第3章 中國·台灣間的IC製造業比較

  • 產業規模比較
  • 中國的IC製造業叢集
  • 中國·台灣的主要十大IC廠商的發展趨勢
  • 加工技術和生產能力比較

第4章 中國·台灣間的IC封裝·實驗產業比較

  • 產業規模比較
  • 中國的IC封裝·實驗產業叢集
  • 中國·台灣的主要十大IC封裝·實驗供應商的發展趨勢

MIC預測

附錄

詞彙表

企業清單

目錄
Product Code: SVRPT14032801

Driven by the Chinese government's preferential policies and enormous domestic market needs, international semiconductor vendors have constantly set up plants in China to strengthen their deployment. The movement has also contributed to the development of Chinese IC design houses, manufacturers, and packaging and testing vendors. As a result, the Chinese semiconductor industry has seen stunning growth since 2010, posing serious threats to the development of the Taiwanese semiconductor industry. This report will analyze the current status of Taiwanese and Chinese semiconductor industries as well as the existing and future development of the sub-industries in Taiwan and China.

Table of Contents

1. Comparison of Cross-Strait Semiconductor Industry's Production Value and Structure

2. Comparison of Cross-Strait IC Design Industries

  • 2.1. Comparison of Industry Value
  • 2.2. Development of Top Ten IC Design Houses in China and Taiwan
    • 2.2.1. Smart Handheld Device Core IC Vendors
    • 2.2.2. Panel Driver IC Vendors
    • 2.2.3. Vendors in Other Industries

3. Comparison of Cross-Strait IC Manufacturing Industries

  • 3.1. Comparison of Industry Value
  • 3.2. Chinese IC Manufacturing Industry Clusters
  • 3.3. Development of Top Ten IC Manufacturers in China and Taiwan
  • 3.4. Comparison of Process Technologies and Production Capacity

4. Comparison of Cross-Strait IC Packaging and Testing Industries

  • 4.1. Comparison of Industry Value
  • 4.2. Chinese IC Packaging and Testing Industry Clusters
  • 4.3. Development of Top Ten IC Packaging and Testing Vendors in China and Taiwan
    • 4.3.1. Development of Taiwanese IC Packaging and Testing Vendors
    • 4.3.2. Development of Chinese IC Packaging and Testing Vendors
  • MIC Perspectives
  • Competition of IC Design for Smart Handheld Devices Intensifies
  • Increased Competition in 28nm Process Technology with Steady 8-inch Wafer Demand
  • Appendix
  • Glossary of Terms
  • List of Companies

List of Topics

Sector-by-sector comparison between Chinese and Taiwanese semiconductor industries, including shipment value reviews and forecasts, the ranking of top ten vendors, and major vendors' latest development in each sector

Companies and organizations analyzed or mentioned in the report include:

Allwinner Technology, APS, ASE, ASE Assembly & Test, ASEN Semiconductors, Casio Micronics, CEC Huada Electronic Design, Cension Semiconductor Manufacturing, China Integrated Circuit Design Center, China Resources Microelectronics, Chipbond, ChipMOS, Elpida, FATC, Freescale Semiconductor, Fujitsu, Galaxycore, Global Unichip, Globalfoundries, Grace Semiconductor Manufacturing, Greatek Electronic, HHGrace, Himax, Hisilicon, Hitech Semiconductor, HJTC, Hua Hong NEC, Huawei, Ilitek, Infineon, Inotera Memories, Intel, Jiangsu Changjiang Electronics Technology, Jilin Sino-Microelectronics, KYEC, Leadcore Technology, Lingsen Precision Industries, Macronix, MediaTek, Micron, Microsoft, MStar, Nantong Fujitsu Microelectronics, Nantong Huada Microelectronics, Nanya Technology, Novatek, Nufrontsoft, Nuvoton Technology, Orisetech, OSE, Phison Electronics, Powerchip, Powertech Technology, Qualcomm, Raydium Semiconductor, RDA Microelectronics, Realtek, Renesas Electronics, Rexchip, RF Micro Devices, Richtek Technology, Rockchip, Samsung, Shanghai Matsushita Semiconductor, Shanghai Huahong Grace Semiconductor Manufacturing, Shanghai HuaLi Microelectronics, Shanghai Kai Hong Electronic, Shenzhen High Tech Industrial Company, Silan, SK Hynix, SMIC, SMIT, SPIL, Spreadtrum, ST, Taiji Industry, Teramikros, Texas Instruments, Toshiba, Tsinghua Unisplendour, TSMC, UMC, Vimicro, VIS, WAE, Walton Advanced Engineering, Winbond, Wuxi Tongzhi Microelectronics, Yang Ding Tech, Zhonghuan Semiconductor Current and future development of Chinese and Taiwanese semiconductor industry, comprising of IC design, memory and wafer manufacturing, and IC packaging and testing sectors.

List of Figures

  • Figure 1: Chinese and Taiwanese Semiconductor Industry Value, 2009 - 2015
  • Figure 2: Revenue Share of Chinese and Taiwanese Semiconductor Industries by Sector, 2008 - 2013
  • Figure 3: Chinese and Taiwanese IC Design Industry Value, 2004 - 2013
  • Figure 4: Chinese and Taiwanese IC Manufacturing Industry Value, 2006 - 2013
  • Figure 5: Chinese IC Manufacturing Industry Clusters
  • Figure 6: Process Technologies Adopted by Taiwanese, Chinese, and Foreign IC Manufacturers, 1Q 2012 - 4Q 2013
  • Figure 7: Production Capacity of Chinese and Taiwanese IC Manufacturing Industries, 2012 - 2016
  • Figure 8: Chinese and Taiwanese IC Packaging and Testing Industry Value, 2006 - 2013
  • Figure 9: Chinese IC Packaging and Testing Industry Clusters

List of Tables

  • Table 1: Top Ten Chinese and Taiwanese IC Design Houses, 2012
  • Table 2: Top Ten Chinese and Taiwanese IC Manufacturers, 2012
  • Table 3: Top Ten Taiwanese IC Packaging and Testing Vendors, 2012 - 2013
  • Table 4: Top Ten Chinese IC Packaging and Testing Vendors, 2011 - 2012
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