The Taiwanese Smartphone Application IC Market, 3Q 2014
|出版商||Market Intelligence & Consulting Institute (MIC)||商品編碼||235004|
|出版日期||內容資訊||英文 27 Pages
|台灣的智慧型手機用應用IC市場:2012年第2季 The Taiwanese Smartphone Application IC Market, 3Q 2014|
|出版日期: 2014年12月04日||內容資訊: 英文 27 Pages||
This research report presents market size and value forecast and recent quarter review of the Taiwanese smartphone baseband, transceiver, power amplifier, application processor, GPS IC, Bluetooth IC, and Wi-Fi IC markets. The report includes baseband, transceiver, power amplifier, application processor, GPS IC, Bluetooth IC, and Wi-Fi IC market volume, value, ASP, and market share by solution provider. The content of this report is based on primary data obtained through interviews with smartphone component makers. The report finds that Taiwanese smartphone communication IC market volume saw both year-on-year and sequential growth in the second quarter of 2014, due largely in part to increased shipments for smartphone brands in the same quarter. As with baseband ICs, Qualcomm, though still having the largest share in the Taiwanese smartphone baseband IC market, saw its share decline to 83.7% in the second quarter, down from 92.7% in the first one. Although MediaTek is still trailing behind Qualcomm, the company witnessed an increase in market share in the second quarter because of its growing shipments for Xiaomi Redmi Note and HTC Desire 310. Looking atapplication processors, despite of seeing a decline in market share, Samsung's application processors continued to be widespread used by most of smartphones produced by Taiwanese makers, followed by Nvidia, and Intel. Meanwhile, Qualcomm fell out of the top 3. Having reached approximately 288.1 million units in the third quarter of 2014, Taiwan's smartphone communication IC market volume is forecast to post the biggest quarterly gain in the fourth quarter, to reach over 400 million units, as iPhone growth continues unabated.
Apple, ASUS, Broadcom, CSR, HTC, Infineon, Intel, JP Morgan, MediaTek, Nvidia, Qualcomm, Realtek, Samsung, Sequans, SiRF, Spreadtrum, ST-Ericsson, T3G, TI, Xiaomi