A significant portion of MEMS manufacturing technology has come from the IC industry. MEMS devices can be made using silicon wafers and the manufacturing process can incorporates semiconductor manufacturing processes such as sputtering, deposition, etching and lithography. This report analyzes the market for MEMS devices and the equipment and materials to make them.
Table of Contents
Chapter - 1: Introduction
Chapter - 2: Forecast Of The Key Applications And Markets
2.1 MEMS Device Market Forecast
2.1.1 Ink Jet Head
2.1.2 Pressure Sensor
2.1.3 Silicon Microphone
2.1.4 Accelerometer
2.1.5 Gyroscope
2.1.6 MOEMS
2.1.7 Micro Display
2.1.8 Microfluidics
2.1.9 RF MEMS
2.1.10 Micro Fuel Cells
2.1.11 Emerging Applications
2.2 MEMS System Market Forecast
Chapter - 3: Markets for Equipment and Materials Suppliers
3.1 Introduction
3.2 MEMS Equipment Markets
3.2.1 Assembly
3.2.2 Bonding
3.2.3 Cleaning
3.2.4 Deposition
3.2.5 Dicing
3.2.6 Etching
3.2.7 Laser Micromachining
3.2.8 Lithography
3.2.9 Metrology/Inspection
3.2.10 Testing
3.2.11 Thermal Treatment
3.2.12 Wafer Thinning
3.3 MEMS Material Markets
3.3.1 Chemicals
3.3.2 Photomasks
3.3.3 Substrates
Chapter - 4: MEMS Foundries
4.1 Foundry Profiles and Strategies
4.1.1 Advanced Custom Sensors, Inc.
4.1.2 Advanced Microsensors
4.1.3 ACSI
4.1.4 Alpha Tech International
4.1.5 Amkor
4.1.6 APM
4.1.7 Applied MEMS
4.1.8 Asia Pacific Microsystems
4.1.9 Beijing First MEMS
4.1.10 Bosch
4.1.11 Branchy
4.1.12 China Resoources Semiconductor
4.1.13 Canadian Microelectronics Corporation (CMC)
4.1.14 Chipsense
4.1.15 Colibrys
4.1.16 Corning Intellisense
4.1.17 Cronos (subsidiary of MEMSCAP)
4.1.18 C2V
4.1.19 Dalsa
4.1.20 Delphi Delco
4.1.21 Dai-Nippon
4.1.22 ELMOS
4.1.23 ELume Inc.
4.1.24 Haleos
4.1.25 Honeywell MEMSplus
4.1.26 Infineon Technologies SensoNor As
4.1.27 Institute of Microelectronics
4.1.28 Innovative Micro Tech
4.1.29 Integrated Sensing Systems Inc. (ISSYS)
4.1.30 Intelligent Micro Patterning
4.1.31 Jazz Semiconductor
4.1.32 Kionix, New York
4.1.33 LioniX
4.1.34 MEMS Engineering and Material
4.1.35 MEMSCAP
4.1.36 MEMSIC
4.1.37 MEMS OpticalMEMStech
4.1.38 Metrodyne
4.1.39 MicralynemicroFAB Bremen GmbH
4.1.40 Micronit Microfluidics BV
4.1.41 Microbase
4.1.42 Midwest MicroDevices, LLC
4.1.43 MOSIS
4.1.44 Nanostructures Inc
4.1.45 NetMotion, Inc.
4.1.46 Norcada Inc.
4.1.47 Olympus Optical
4.1.48 Omron
4.1.49 OptiSwitch Technology Corp. (OTC)
4.1.50 Prodeo Technologies Inc
4.1.51 Protochips, Inc.
4.1.52 Proton Mikrotechnik
4.1.53 Rogue Valley Microdevices
4.1.54 SEMEFAB
4.1.55 Semiconductor Complex Limited
4.1.56 Sanyo
4.1.57 Silex Microsystems
4.1.58 SiWave, Inc.
4.1.59 Sony
4.1.60 Sporian, Colorado STMicroelectronics
4.1.61 SVTC Technologies
4.1.62 Taiwan Semiconductor Manufacturing Co Ltd (TSMC)
4.1.63 Touch Microsystems
4.1.64 TRONICS Microsystems
4.1.65 TI
4.1.66 Verimetra
4.1.67 Walsin Lihwa
4.1.68 X-Fab
4.1.69 Yokogawa
4.2 Segmentation of MEMS foundries
Chapter - 5: Factors for Foundry Success
5.1.1 Achieving Economies Of Scale
5.1.2 Competitive Advantages
5.1.3 Core Strengths
5.1.4 Employee Commitment
5.1.5 Expansion Plans
5.1.6 Financial Objectives:
5.1.7 Groundbreaking MEMS Solutions
5.1.8 In- House Expertise in MEMS Testing And Reliability
5.1.9 Leadership in Technology
5.1.10 1Manufacturing Excellence
5.1.11 Manufacturing Process
5.1.12 Mastering Process and Production Technology
