The biggest enabler of the mobile data increase and the most important driver of the GaAs RF IC market is the handset segment. Much of the content of a handset is silicon-based, but power amplifiers (PAs) and switches in the front-end of the phone use GaAs devices. This report investigates the technology trends, applications, and market developments of GaAs ICs. U.S., Japanese, and European applications such as telecom, computers, defense, consumers, are reviewed. This report will provide the reader with an in-depth understanding of the technological and market factors determining the evolution of GaAs ICs.
Every cell phone contains Power Amplifiers (PA), which enables the handset to transmit voice and data back to the base station tower to route a call to another phone number or Internet address. PAs, the most critical radio frequency component in the phone are currently dominated by circuits made with Gallium Arsenide (GaAs).
Table of Contents
Chapter 1. Introduction
Chapter 2. Executive Summary
- 2.1. Summary of Major Issues
- 2.2. Summary of Market Forecast
Chapter 3. Technology Issues
- 3.1. GaAs Devices
- 3.1.1. FETs
- 3.1.2. HEMTs
- 3.1.3. HBT
- 3.2. Comparison of Logic Structures
- 3.2.1. Buffered FET Logic
- 3.2.2. FET Logic
- 3.2.3. Capacitively Enhanced Logic
- 3.2.4. Direct-Coupled FET Logic
- 3.2.5. Source-Coupled FET Logic
- 3.3. Material Issues
- 3.3.1. Wafer Production
- 3.3.2. Etch Pit Densities
- 3.4. Equipment
- 3.4.1. Implanters
- 3.4.2. Lithography
- 3.4.3. Etching
- 3.4.4. Deposition
- 3.4.5. Rapid Thermal Processing
- 3.5. Packaging
- 3.5.1. Package Types
- 3.5.2. Bonding
- 3.6. Testing
- 3.7. Design
Chapter 4. Applications for GaAs ICs
- 4.1. Introduction
- 4.1.1. The Trend Toward Higher Frequencies
- 4.1.2. Transition from Analog to Digital Modulation
- 4.1.3. Discrete Components and Silicon-Based ICs
- 4.2. Markets
- 4.2.1. Telecommunications Systems
- 4.2.2. Television Systems
- 4.2.3. Computing
- 4.2.4. Data Communications
- 4.2.5. Automotive
- 4.2.6. Automated Test Equipment
- 4.2.7. Military
Chapter 5. IC Supplier and End-User Issues
- 5.1. Introduction
- 5.2. Competing Against Silicon
- 5.3. Competing Against The Japanese
- 5.4. Taiwan's Market Momentum
- 5.5. Korea's Market Momentum
- 5.6. Wafer Sizes
- 5.7. Competing Against SiGe
- 5.7.1. Introduction
- 5.7.2. Technology
- 5.7.2.1. Strained Silicon
- 5.7.2.2. Device Manufacturing
- 5.7.3. Applications
- 5.7.3.1. Wireless LAN
- 5.7.3.2. WiMAX
- 5.7.3.3. Bluetooth
- 5.7.3.4. Cellular
- 5.7.3.5. GPS
Chapter 6. Market Forecast
- 6.1. Driving Forces
- 6.2. Market Forecast Assumptions
- 6.3. GaAs IC Market Forecast
- 6.4. SiGe IC Market Forecast
- 6.5. End Application Market
Chapter 7. Profile of GaAs IC Manufacturers