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市場調查報告書

300公厘/Cu/Low K的收斂

300/450MM/COPPER/LOW-K CONVERGENCE: TIMING, TRENDS, ISSUES, MARKET ANALYSIS

出版商 Information Network 商品編碼 4969
出版日期 內容資訊 英文
商品交期: 最快1-2個工作天內
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300公厘/Cu/Low K的收斂 300/450MM/COPPER/LOW-K CONVERGENCE: TIMING, TRENDS, ISSUES, MARKET ANALYSIS
出版日期: 2016年11月01日 內容資訊: 英文
簡介

本報告書為300公厘/Cu/Low-k收斂的技術的・經濟的影響之相關分析,包含了300公厘/晶圓工具、Cu薄膜/蝕刻/CMP、Low-k材料的時期・動向・相關事項・市場分析,概述如下。

第1章 導論

第2章 概要

  • 技術課題摘要
  • 市場預測摘要

第3章 300公厘晶圓與其動向

  • 導論
  • 業界的營企業
  • 300mm晶圓的優勢
  • 對小型IC製造商的影響
  • 對ASIC製造商的影響
  • 成本
  • 對自動化的影響
  • 300mm生產線建設計畫
  • 300mm最佳部分
  • 450mm生產線

第4章 Cu相關課題與其動向

  • Cu的優勢
  • Cu處理技術相關的課題
  • 金屬附著
  • 防護層
  • 平坦化
  • 計測
  • 與鋁鑲嵌技術的競爭
  • 針對22mm的Cu
  • 機器供應商的Cu電鍍產品
  • 摘要

第5章 Low-k絶緣膜(低導電層間絶緣膜)相關的課題與其動向

  • 導論
  • 理想的導電體
  • Low-k絶緣膜種類
  • 加工相關課題
  • 摘要

第6章 市場分析

  • 半導體市場
  • 邁向市場回復之道
  • 市場預測相關的假設
  • 300mm晶圓市場
  • 300mm機器市場
  • Cu加工機器市場
  • Low-k市場

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目錄

A semiconductor foundry capable of processing 450mm wafers offers a tremendous economy of scale versus facilities working with smaller-diameter wafers, albeit with large startup costs required for the needed wafer-handling equipment. The larger wafers yield more semiconductor die, assuming that good material quality can be maintained across the surface of the larger wafers. As a rough approximation, only about one-half the wafer starts are required for a 450mm wafer facility compared to a 300mm wafer facility to produce the same number of die.

ASML, one of the major equipment suppliers to chip factories, recently decided to stop trying to develop a new generation of machines that could handle 450mm wafers. No one is definitively ruling out 450mm, but even Intel agrees that it is on hold until the end of the decade. TSMC is not as vocal as Intel, but the Taiwan foundry giant is still interested in 450mm, as well. Still others believe 450mm fabs could get pushed out to the 2020 to 2025 timeframe. Now that work is on hold, along with the Intel investment in ASML's 450mm program.

Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts.

Table of Contents

Chapter 1: Introduction

Chapter 2: Executive Summary

  • 2.1. Summary of Technical Issues
  • 2.2. Summary of Market Forecasts

Chapter 3: 300/450mm Wafer Issues and Trends

  • 3.1. Introduction
  • 3.2. Industry Consortia
  • 3.3. Benefits of 450mm Wafers
  • 3.4. Requirements For IC Manufacturers
  • 3.5. Impact on Automation
    • 3.5.1. Software
  • 3.6. 450mm Wafer Issues
    • 3.6.1. Overview
    • 3.6.2. Economic Challenges

Chapter 4: Copper Issues and Trends

  • 4.1. Advantages of Copper
  • 4.2. Copper Processing Challenges
  • 4.3. Metal Deposition
    • 4.3.1. Seed Layer
    • 4.3.2. Bulk Copper Fill
  • 4.4. Barriers
  • 4.5. Planarization
  • 4.6. Metrology
  • 4.7. Competing against Aluminum Damascene
  • 4.8. Copper for 22nm
    • 4.8.1. Low-K and Hard Metal Mask Deposition
    • 4.8.2. Lithography
    • 4.8.3. Etch
    • 4.8.4. Post-etch residue removal
    • 4.8.5. Chemical mechanical polishing
  • 4.9. Equipment Suppliers' Copper Electroplating Products
  • 4.10. Summary
    • 4.10.1. Advantages/Disadvantages of Cu
    • 4.10.2. Processing Issues
    • 4.10.3. Challenges

Chapter 5: Low-K Dielectric Issues and Trends

  • 5.1. Introduction
  • 5.2. Ideal Dielectric
  • 5.3. Types of Low-K Dielectrics
    • 5.3.1. FSG
    • 5.3.2. HSQ
    • 5.3.3. Nanoporous Silica
    • 5.3.4. Spin-on Polymers
    • 5.3.5. BCB
    • 5.3.6. Flowfill
    • 5.3.7. CVD
    • 5.3.8. AF4
    • 5.3.9. PTFE
  • 5.4. Processing Issues
  • 5.5. Summary
    • 5.5.1. Integration Issues
    • 5.5.2. Low-K Dielectric Issues

Chapter 6: Market Analysis

  • 6.1. Semiconductor Market
  • 6.2. Road to Recovery
  • 6.3. Market Forecast Assumptions
  • 6.4. 450mm Wafer Market Forecast
  • 6.5. 300/450mm Equipment Market
    • 6.5.1. 300/450mm Equipment Tools
    • 6.5.2. Factory Automation in 300mm Fab Market
  • 6.6. Copper Processing Equipment Market
  • 6.7. Low-K Dielectric Market

List of Tables:

  • 3.1. Completed Wafer Price Increases With Time And Minimum Feature Sizes
  • 3.2. Cost of 450mm Fab
  • 3.3. Generic Model For CZ Crystal Yield
  • 5.1. Low-K Material Requirements
  • 5.2. Low-K Materials
  • 6.1. Worldwide Market Forecast of Si Wafers
  • 6.2. Worldwide Market Forecast of 300mm Equipment
  • 6.3. Process Tool Automation For 300mm Fabs
  • 6.4. Worldwide Forecast of Automation Transfer Tools
  • 6.5. Worldwide Forecast of Copper Processing Equipment
  • 6.6. Worldwide Forecast of Low-K Market

List of Figures:

  • 3.1. Increase in Wafer Diameter With Time
  • 3.2. R&D Costs For Each Wafer Diameter Introduction
  • 3.3. Fab Costs For Each Wafer Diameter
  • 3.4. Revenues For Semiconductor and Semiconductor Equipment
  • 3.5. ITRS Has Its Roadmap For 450mm Wafers
  • 3.6. 450mm Consortia
  • 3.7. Completed Wafer Price Increases With Time and Minimum Feature Sizes
  • 3.8. IC Cost With Wafer Size And Device Feature Sizes
  • 3.9. Trends In Manufacturing Variables In The Transition From 300m To 450mm Wafers
  • 3.10. Wafer Thickness Trends With Diameter
  • 3.11. Polysilicon Usage By The Solar Industry
  • 3.12. Increasing Cost Of Wafer With Time
  • 4.1. Reduced Complexity of Copper Interconnect
  • 4.2. Interconnect Delay for Copper
  • 4.3. ALD Versus PVD Copper Barrier
  • 4.4. Copper CMP Steps And Challenges
  • 4.5. Electromigration Resistance
  • 4.6. Metal Diffusion Barrier
  • 4.7. Cu Planarization Process
  • 4.8. Copper ECMD Process
  • 4.9. Damascus Complete Copper
  • 4.10. Copper/Low-K Interconnect Schemes
  • 4.11. Copper And Low-K Integration Concerns
  • 5.1. Low-K Roadmap
  • 6.1. 300mm Wafer Market As Percentage of Total Market
  • 6.2. Forecast of 450mm Processing Equipment
  • 6.3. Interconnect Technology Requirements
  • 6.3. Electrochemical Deposition Market Shares - Revenues
  • 6.5. Copper Implementation By Geographic Region
  • 6.6. Copper Implementation By Feature Size
  • 6.7. Low-K Deposition Market Shares
  • 6.8. Low-K Precursor Market
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